List of Wafer processing/polishing equipment products

  • classification:Wafer processing/polishing equipment

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

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  • Other conveying machines

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Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.

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  • Satech - AdaptaGuard_Ipros_2023_JP_Media-gallery_1.jpg
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  • Other safety and hygiene products

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We propose our polishing equipment to address the concerns of automotive parts manufacturers.

  • Wafer processing/polishing equipment
  • Other abrasives

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Inner diameter grinding device renewal

We have renewed the demo model of the film-type inner diameter polishing machine. The maximum size of compatible workpieces has increased in both height and diameter! During test trials before the equipment is finalized, processing under conditions closer to actual operation has become widely possible. If you are having trouble managing roughness with inner diameter honing or similar processes, please consider the film-type inner diameter polishing machine!

Introducing a case study on equipment installation at an automotive parts manufacturer! We are showcasing solutions using ball screw grinding technology tailored to the concerns of automotive parts ma...

  • Wafer processing/polishing equipment
  • Other abrasives

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Solving the concerns of electronic device manufacturers! We propose our polishing equipment.

  • Other surface treatment equipment
  • Wafer processing/polishing equipment
  • Other abrasives

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Solving various companies' problems! Introducing it clearly with comparisons to other training programs!

  • Wafer processing/polishing equipment
  • Other abrasives
  • Other surface treatment equipment

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Automation of hand polishing, time reduction, and stabilization of quality are possible! Introducing the basic knowledge of film polishing.

  • Other machine tools
  • Wafer processing/polishing equipment

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Exhibition of actual machines at JIMTOF: Improving roughness and flattening of automotive parts and electrical/electronic components.

  • Wafer processing/polishing equipment
  • Flat/Shaped/Vertical Cutting Machine
  • Processing Contract

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Solving issues of labor shortages and technology transfer! An explanation of the purpose and features of Sanshin's equipment.

  • Wafer processing/polishing equipment

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A color filter full polishing device aimed at correcting protrusions and improving the flatness of the RGB surface!

  • Wafer processing/polishing equipment

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We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.

We will be exhibiting at JIMTOF 2018, the 29th International Machine Tool Fair. Date: November 1, 2018 (Thursday) to November 6, 2018 (Wednesday) 9:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Booth Number: East Hall 1 E 1073 We look forward to your visit.

Maximizing the features of the wrapping tape makes the intended polishing easy.

  • Wafer processing/polishing equipment

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JIMTOFニュース登録.jpg

We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.

We will be exhibiting at JIMTOF 2018, the 29th International Machine Tool Fair. Date: November 1, 2018 (Thursday) to November 6, 2018 (Wednesday) 9:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Booth Number: East Hall 1 E 1073 We look forward to your visit.

Recognize the shape of the protrusion and correct the position of the polishing center to ensure accurate protrusion correction.

  • Wafer processing/polishing equipment

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JIMTOFニュース登録.jpg

We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.

We will be exhibiting at JIMTOF 2018, the 29th International Machine Tool Fair. Date: November 1, 2018 (Thursday) to November 6, 2018 (Wednesday) 9:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Booth Number: East Hall 1 E 1073 We look forward to your visit.

Achieves approximately 30% space-saving compared to conventional machines! Precise finishing is possible regardless of experience level! [Patent obtained]

  • Wafer processing/polishing equipment
  • Engine parts
  • lathe

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Unlike hand grinding, this grinding unit is not affected by the operator's level of experience!

  • Wafer processing/polishing equipment

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Can be processed under suitable conditions! Even beginners can operate it easily.

  • Other processing machines
  • Wafer processing/polishing equipment

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A polishing device effective for polishing various substrates and removing fine burrs from punched parts!

  • Other processing machines
  • Wafer processing/polishing equipment

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Needle valves, for automotive small parts! Introducing the burr removal and outer diameter tape wrapping device!

  • Other processing machines
  • Wafer processing/polishing equipment

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We will introduce a case study of the installation of an outer diameter polishing device at a medical device manufacturer! We solve problems such as dirt on equipment that cannot use cleaning agents!

  • Wafer processing/polishing equipment
  • Other abrasives

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We want to reduce the man-hours for grinding! We will design according to your needs, such as wanting to use a different type of polishing instead of whetstone grinding! We are currently offering a co...

  • Wafer processing/polishing equipment
  • Other abrasives

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It can accommodate slight differences in shaft length! A device that achieves surface roughness according to the purpose.

  • Other processing machines
  • Wafer processing/polishing equipment

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Free gift: 'Handbook of Basic Knowledge on Wrapping & Polishing'!

  • Wafer processing/polishing equipment

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We will exhibit at the Fukuoka Monozukuri Fair 2016 (October 26-28, 2016).

Nippon Engis will be exhibiting at the "Monozukuri Fair 2016" held at Marine Messe Fukuoka from Wednesday, October 26 to Friday, October 28. If you would like an invitation, please contact us. <Exhibited Products> Small Lapping Machine Abrasives Lapping Process Samples We understand that you are busy, but we sincerely look forward to your visit.

Inolas Solutions' laser processing equipment cuts rigid substrates, flexible substrates, and composite substrates quickly and cleanly.

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  • Circuit board design and manufacturing
  • Other processing machines
  • Wafer processing/polishing equipment

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Leave the automation of metal polishing, grinding, and deburring to FUJIYA TECH.

  • Wafer processing/polishing equipment
  • Other FA equipment

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Leave the automation of metal grinding, polishing, and deburring processes to FUJIYA TECH.

  • Wafer processing/polishing equipment
  • Other FA equipment

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A dedicated belt grinder designed for incorporation into robots and devices. It has the highest output in the lineup, suitable for heavy grinding of castings and welded parts.

  • Other industrial robots
  • Wafer processing/polishing equipment

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A dedicated belt grinder designed for incorporation into robots and devices. Suitable for fine deburring, chamfering, and finishing.

  • Other industrial robots
  • Wafer processing/polishing equipment

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Leave everything to us! Our top priority is to protect your supply chain and respond with the utmost priority on delivery times.

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  • Wafer processing/polishing equipment
  • Surface treatment contract service
  • Other contract services

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By rotating the holder and the disk in the same direction at the same speed, grinding can be done without losing the parallelism of the workpiece!

  • Wafer processing/polishing equipment

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Total engineering partner in the semiconductor industry with over 2,000 achievements in the semiconductor field.

  • Resist Device
  • Wafer processing/polishing equipment
  • Other semiconductor manufacturing equipment

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SEMICON Japan 2025 Exhibition

We will be exhibiting at SEMICON Japan 2025, which will be held at Tokyo Big Sight from December 17 (Wednesday) to 19 (Friday). When you visit, please stop by our booth at East Hall 6, E6301.

Save cleaning time! The durable die-cast body provides robustness and stability.

  • Wafer processing/polishing equipment

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Introducing an automatic polishing machine with a total weight of 77kg, available with an optional splash kit and lid!

  • Wafer processing/polishing equipment

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