List of Wafer processing/polishing equipment products
- classification：Wafer processing/polishing equipment
136～180 item / All 1051 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
No more need to lift heavy one-gallon cans! Enjoy comfortable liquid transfer in the central kitchen.
- Other Pumps
Decision to exhibit at the 1st Chubu Food Industry Creation Exhibition '26!
We will be exhibiting at the "1st Chubu Food Industry Creation Exhibition '26" to be held at Port Messe Nagoya from November 4 (Wednesday) to November 6 (Friday), 2026. As a new addition to our lineup, we will showcase the "Cordless Sanitary Handy Pump," which is a product we started selling in April last year, alongside our "Compact Sanitary Handy Pump Model MHS." - Cordless! Portable anywhere! Easy to use! Simple cleaning! It is compatible with standard 18L cans and BIB (Bag-in-Box) and features a structure that allows for easy disassembly and cleaning. We would like to invite you to visit us at this opportunity. - Venue: Port Messe Nagoya - Our exhibition booth: Hall 1 "C-66"
Isn't it the case that flatness and parallelism are not stable in metal surface processing? We support quality stabilization through processing with fixed abrasive grains.
- Wafer processing/polishing equipment
Stable processing of sapphire flat surfaces with different machinability for each face orientation using fixed abrasive grains.
- Wafer processing/polishing equipment
Processing that does not melt even low-melting-point resins. Achieves stable precision even in batch processing of large-diameter workpieces.
- Wafer processing/polishing equipment
Suppresses processing heat and warping. Achieves high-precision finishing with uniform processing on both sides.
- Wafer processing/polishing equipment
Streamlining the flat grinding of hard and brittle ceramics. It helps reduce chipping and cracking while supporting both precision stability and productivity improvement.
- Wafer processing/polishing equipment
Are you struggling with scratches, chipping, and inconsistencies in finishing? We achieve high-quality surface finishes with stable processing.
- Wafer processing/polishing equipment
Efficient flat processing of silicon carbide, a difficult-to-machine material. It aims to shorten processing time while stabilizing precision simultaneously.
- Wafer processing/polishing equipment
The best cost-performance machine in the series! Automate deburring on a low budget.
- Wafer processing/polishing equipment
Standard with two axes for the grinding wheel shaft! Additional installation is possible to meet needs.
- Wafer processing/polishing equipment
The easiest model to introduce in the Baritac series!
- Wafer processing/polishing equipment
Achieve an even finish without polishing marks through "planetary motion" with a rotary 4-axis buff!
- Wafer processing/polishing equipment
Equipped with a simultaneous double-sided grinding mechanism that finishes both sides of the workpiece at once!
- Wafer processing/polishing equipment
A versatile diamond polishing machine capable of handling all polishing directions! Ideal for chip-free polishing of single crystal diamonds!
- Diamond cutter
- Wafer processing/polishing equipment
We will be exhibiting at JIMTOF2026.
We will be exhibiting at JIMTOF2026, which will be held from October 26 (Monday) to October 31 (Saturday), 2026. We plan to showcase actual machines such as diamond grinding machines and water laser processing machines. We look forward to your visit.
Equipped with an oscillation mechanism! Supports both deburring and hairline finishing with one machine.
- Wafer processing/polishing equipment
Proposal for Continuous Supply Ultra-Pure Water Production System: Achieving Stable Operation 24 Hours a Day
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Wafer
For any issues with surface grinding, please consult JFC. We can handle both processing of supplied materials and processing with materials included.
- Fine Ceramics
- Other machine elements
- Wafer processing/polishing equipment
A mirror-like surface created by electropolishing! Supporting IT technology with electropolishing that further enhances corrosion resistance.
- Wafer processing/polishing equipment
We provide batch-type cleaning equipment that utilizes cleaning technology and transport/control technology, compatible with various chemical solutions.
- Wafer processing/polishing equipment
Efficiently enhance polishing power with low vibration design! We offer three models of sanders with speed control.
- Wafer processing/polishing equipment
A model that combines a membrane attachment method compatible with TAIKO(R) wafers and a heating function.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Mounter
We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."
We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.
TAIKO(R) wafer and thin wafer compatible models
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Mounter
We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."
We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.
A model suitable for processes where temperature conditions affect adhesion quality and for applications where process variation needs to be minimized.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Mounter
We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."
We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.
A versatile model capable of supporting a wide range of processes from research and development applications to pre-mass production stages.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Mounter
We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."
We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.
Easy tool re-sharpening! Anyone can achieve a uniform finish! Ready to use with a household power supply.
- Other surface treatment equipment
- Wafer processing/polishing equipment
We will monitor the grinding process in real-time with the Marpos measurement head!
- Wafer processing/polishing equipment
- Production Management System
- Other measurement, recording and measuring instruments
[Product demo available] Achieving high efficiency, durability, and flat grinding capability! A new mechanism has been adopted in the pad support section.
- Wafer processing/polishing equipment
- Other machine elements
【Product demo available】Paper size is φ150mm! It is compact and lightweight at 730g, has a long lifespan, and is easy to maintain.
- Wafer processing/polishing equipment
- Other machine elements
【Product demo available】Low failure rate and long lifespan, plus easy maintenance! Easy to operate and does not cause fatigue even with long hours of use.
- Wafer processing/polishing equipment
- Other machine elements
![[Grinding Device] Tape Grinding Uni...](https://image.mono.ipros.com/public/product/image/31b/2000180536/IPROS76454250891536593949.jpeg?w=280&h=280){kind=small}
Polishing equipment that maximizes the characteristics of polishing film.
- Wafer processing/polishing equipment
Processing technology that can polish shafts with complex shapes!
- Wafer processing/polishing equipment
For home appliance parts! Achieving work improvement, labor saving, and uniform product quality through automation.
- Wafer processing/polishing equipment
- Articulated Robot
Precision polishing technology that contributes to the improvement of gear quality!
- Wafer processing/polishing equipment
Innovative processing technology that enables the grinding of complex-shaped main shafts!
- Wafer processing/polishing equipment
![[For Robots] IRF-1000 Complex Shape...](https://image.mono.ipros.com/public/product/image/2044136/IPROS15237369428143763279.jpeg?w=280&h=280){kind=small}
Processing technology that realizes precision grinding of robot joints!
- Wafer processing/polishing equipment
Precision grinding of complex-shaped gears!
- Wafer processing/polishing equipment
Precision shaft grinding that affects motor performance.
- Wafer processing/polishing equipment
It is possible to perform grinding on corner R surfaces and tapered sections. It also supports inner diameter grinding through attachment replacement.
- Wafer processing/polishing equipment
For grinding complex-shaped shafts such as camshafts!
- Wafer processing/polishing equipment
![[Aerospace] IRF-1000 Complex Shape ...](https://image.mono.ipros.com/public/product/image/2044136/IPROS11538834924439036162.jpeg?w=280&h=280){kind=small}
Innovation in turbine shaft polishing in the aerospace field.
- Wafer processing/polishing equipment
Precision shaft grinding technology to improve generator performance!
- Wafer processing/polishing equipment
Supports everything from MEMS devices to mass production. Assists in the miniaturization process.
- Wafer processing/polishing equipment
Supports the creation of natto by smoothing the surface of soybeans and ensuring a uniform texture.
- Other food machinery
- Wafer processing/polishing equipment
Polishing technology that creates gloss. It is possible to prevent nutrient leaching by processing raw materials without washing with water.
- Other food machinery
- Wafer processing/polishing equipment
Achieve beautiful prints with a glossy finish!
- Grinding Machine
- Wafer processing/polishing equipment
Introducing how to minimize mistakes and press the edit button without hesitation.
- Wafer processing/polishing equipment