List of Binding/Packing Machine products
- classification：Binding/Packing Machine
196～210 item / All 882 items
For those who have isolators. Achieving high chemical resistance and workability. Low cost and short delivery times are also possible for glove box and isolator gloves.
- Work gloves
Notice of participation in 'INTERPHEX Week Tokyo' from May 20 (Wednesday) to May 22 (Friday), 2026.
Ito Corporation will be exhibiting at "INTERPHEX Week Tokyo" held at Makuhari Messe. This exhibition is the largest in Japan, showcasing a wide range of products and services related to the research and manufacturing of pharmaceuticals, cosmetics, and regenerative medicine from 25 countries and regions around the world. Pharmaceutical and cosmetic manufacturers, as well as regenerative medicine companies, will be attending from all over the globe. We will be showcasing "Gloves for Glove Boxes/Isolators" manufactured by Tron Power. We look forward to your visit.
Shrink cloth stronger than shrink film. Easy packaging with heat shrinkage. Cost reduction through packaging automation!
- Packaging materials
- Binding/Packing Machine
- Other packaging materials
It is a semiconductor sorting device that extracts dies from dicing wafers and transfers them to tape/reels or trays while inspecting the dies.
- Visual Inspection Equipment
- Binding/Packing Machine
- Taping Machine
Exhibited at SEMICON Japan 2021 Hybrid.
Our company will be exhibiting at "SEMICON Japan 2021 Hybrid," which will be held at Tokyo Big Sight from December 15 (Wednesday) to December 17 (Friday), 2021. We are a semiconductor inspection equipment manufacturer headquartered in China. The company was established in 2008 in China, and we began full-scale sales activities in Japan in October 2020. This will be our first exhibition at SEMICON Japan. We look forward to your visit.
Hexa EVO+ is a device that inspects both the front and back sides of semiconductor IC packages and packages them for taping and other purposes.
- Binding/Packing Machine
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
Exhibited at SEMICON Japan 2021 Hybrid.
Our company will be exhibiting at "SEMICON Japan 2021 Hybrid," which will be held at Tokyo Big Sight from December 15 (Wednesday) to December 17 (Friday), 2021. We are a semiconductor inspection equipment manufacturer headquartered in China. The company was established in 2008 in China, and we began full-scale sales activities in Japan in October 2020. This will be our first exhibition at SEMICON Japan. We look forward to your visit.
Improved work efficiency! A PP band that combines toughness with ease of handling, lightness, and softness.
- Other packaging materials
- Binding/Packing Machine
Uses environmentally friendly honeycomb paper. No tape or scissors are needed as the papers interlock with each other. Multiple products can be packaged together, improving the process.
- Binding/Packing Machine
Currently featuring an article introducing RAMPACK on Paltek's website.
On the website of PALTEK Co., Ltd., the domestic distributor of Ranpak, there is a blog titled "Packaging Eggs Without Breaking Them! What Are Reliable Paper Packaging Materials?" It discusses the excellent cushioning capabilities of Geami, a cushioning material for wrapping. Please take a moment to read it! 【Paltek Blog】 https://www.paltek.co.jp/solution/ranpak/blog/rb230821_01/index.html
Multiple products can be packaged together! Unlike plastic bubble wrap, it requires no tape or scissors and takes up about 1/10 of the storage space! Environmentally friendly paper material.
- Binding/Packing Machine
Participated as a partner company in the tour of SoftBank Robotics' showroom "SoftBank Robotics Logistics Innovation Lab."
At the "SoftBank Robotics Logistics Innovation Lab (LIL)" located in Ichikawa City, Chiba Prefecture, various logistics automation solutions from around the world are gathered, including the packaging solutions from Ranpack. Ranpack participated as a partner company in a tour held on January 26, where we introduced the following solutions to approximately 50 visitors. We will continue to participate in various events and showcase environmentally friendly solutions. <Paper Cushioning Material> ■ Gap Filling https://kensetsu.ipros.jp/product/detail/2000736088 ■ Packaging https://kensetsu.ipros.jp/product/detail/2000719873 <Automation> ■ Automatic Sealing Machine with Height Adjustment Function https://kensetsu.ipros.jp/product/detail/2000700596 For more details about LIL, visit: https://www.softbankrobotics.com/jp/event/lil/
The unique palletizing software allows for even palletizing of booklets with simple settings!
- Binding/Packing Machine