List of Other electronic parts products
- classification：Other electronic parts
3046～3060 item / All 8325 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
It is also used for preventing freezing of pitot tubes, which are parts of airplanes, and the propeller parts of drones!
- Other electronic parts
Simply attach it to a flat surface for use! Ideal for use with electronic jars, dryers, copiers, and more.
- Other electronic parts
The built-in PTC element heats the heat dissipation fins! It can accommodate various sizes.
- Other electronic parts
High precision and high durability! Automating deburring and polishing, making equipment more versatile.
- Other electronic parts
Highly customizable camera module for AI and computer vision.
- Other electronic parts
![[DRAM Module] DDR4 2666MT/s Series](https://image.mono.ipros.com/public/product/image/a4b/2000349347/IPROS72764147398421402250.png?w=280&h=280){kind=small}
Embedded DRAM module - Achieved a 11.2% increase in transfer speed compared to conventional products.
- Other electronic parts
- Other semiconductors
- Memory
Innodisk's innovative lineup for industrial applications.
We would like to introduce Innodisk's diverse solutions. Introduction items: - Flash - DRAM - Embedded Peripherals - Software Solutions ---Please download the materials to see more--- This is just a small part of our offerings, so feel free to contact us.
Combination of inconspicuous tactile switches
- switch
- Other electronic parts
Attention those struggling with cost reduction and space-saving for flexible printed circuit boards (flexible substrates)! We can provide optimal proposals tailored to your needs!
- Other electronic parts
[Press Release from Taiyo TechnoRex] Regarding the Improvement of High-Density Wiring Formation Technology Using the Patterned Beer Fill Method
Our company has further improved the technology for forming high-density wiring in our core business of electronic substrates, specifically in flexible printed circuit boards (FPCs). In recent years, electronic devices such as medical equipment and industrial machinery have been advancing in miniaturization and lightweight design. To incorporate many functions into limited space, there is a demand for increased wiring density on the substrate. Therefore, we have been working on establishing filled via technology and improving the M-SAP method. The filled via structure involves filling vias (holes) made by laser in the insulating layer with copper plating, ensuring electrical connections on both sides of the substrate while reducing the recesses of the vias, which allows for component mounting on the vias and leads to high-density mounting. On the other hand, the M-SAP method significantly improves line width management by laminating copper to form circuits, enabling high-density wiring. This time, based on the pattern via fill method that leverages these characteristics, we successfully formed wiring with a pitch of 30μm on a double-sided substrate with a filled via structure. We will continue to aim for further improvements in high-density wiring formation technology through ongoing development, prototyping, and verification.
Supports over 50% elongation! There are various applications such as wearable electronic devices and robots.
- Other electronic parts
【TTL】Invisible wiring with transparent FPC! Compatible with reflow mounting, ideal for display devices such as digital signage. 【Flexible Printed Circuit Board】
Transparent flexible printed circuit boards contribute to improved design with excellent transparency! Fine patterns make the wiring less noticeable. 〇 Made with polyimide that excels in heat resistance and flame retardancy. ⇒ Compatible with reflow mounting. ★ Suitable for display devices such as digital signage, as well as medical devices and transparent film antennas! ★ We also accommodate small quantities and a variety of prototypes.
A bump with a minimum diameter of Φ20µm is formed at the terminal section of the FPC. The bump is used as a contact point and is applied in high-precision circuit testing, etc. (Flexible substrate)
- Other electronic parts
[Press Release from Taiyo TechnoRex] Regarding the Improvement of High-Density Wiring Formation Technology Using the Patterned Beer Fill Method
Our company has further improved the technology for forming high-density wiring in our core business of electronic substrates, specifically in flexible printed circuit boards (FPCs). In recent years, electronic devices such as medical equipment and industrial machinery have been advancing in miniaturization and lightweight design. To incorporate many functions into limited space, there is a demand for increased wiring density on the substrate. Therefore, we have been working on establishing filled via technology and improving the M-SAP method. The filled via structure involves filling vias (holes) made by laser in the insulating layer with copper plating, ensuring electrical connections on both sides of the substrate while reducing the recesses of the vias, which allows for component mounting on the vias and leads to high-density mounting. On the other hand, the M-SAP method significantly improves line width management by laminating copper to form circuits, enabling high-density wiring. This time, based on the pattern via fill method that leverages these characteristics, we successfully formed wiring with a pitch of 30μm on a double-sided substrate with a filled via structure. We will continue to aim for further improvements in high-density wiring formation technology through ongoing development, prototyping, and verification.
Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.
- Other electronic parts
[Press Release from Taiyo Techno Rex] Announcement regarding the launch of electronic device contract manufacturing services.
We have newly launched an "Electronics Manufacturing Services (EMS)" that provides a comprehensive response from material procurement, circuit design, manufacturing, and assembly to functional testing and shipping in the traditional FPC (Flexible Printed Circuit Board) manufacturing process. In recent years, the use of FPCs has expanded across various fields such as medical devices and industrial equipment, leading to an increased demand not only for supply but also for a one-stop solution that encompasses circuit design, module manufacturing, and even final product assembly. To meet these market demands, we have strengthened our collaboration with electronics manufacturing companies and established a manufacturing system that covers everything from material procurement to assembly. With this service, customers can reduce interactions with multiple vendors, achieve shorter lead times, and improve manufacturing efficiency. Our stringent quality control system ensures the delivery of highly reliable products. The product areas we can support include automotive devices, medical devices, industrial equipment, robotics, communication devices, lighting equipment, and home appliances, allowing us to meet a wide range of manufacturing needs.
Wide, low LED tactile push button switch with built-in RGB LED.
- switch
- Other electronic parts