List of Other electronic parts products
- classification：Other electronic parts
3061～3075 item / All 8324 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
We recommend this for those looking for manufacturers that provide a stable supply of standard ICs!
- Other electronic parts
We recommend this for those looking for alternatives to discontinued or long-lead-time products.
- Other electronic parts
There are alternative products from domestic manufacturers, JSCJ's dual and compound semiconductors.
- Other electronic parts
Introducing various MOSFETs from JSCJ!
- Other electronic parts
Shunt regulator manufactured by Chinese major semiconductor company JSCJ.
- Other electronic parts
Replacement proposals for conventional products are possible! We offer Crystal, SPXO, and TCXO in sizes ranging from conventional specifications to compact models.
- Other electronic parts
An ultra-soft thermal conduction sheet that achieves excellent thermal conductivity. It fills the gaps of fine unevenness and efficiently conducts heat.
- Other electronic parts
- Other polymer materials
An ultra-soft thermal conduction sheet that achieves excellent thermal conductivity. It fills the gaps of fine unevenness and efficiently conducts heat.
- Other electronic parts
- Other polymer materials
An ultra-soft thermal conductive sheet that achieves excellent thermal conductivity. It fills the gaps of fine unevenness and efficiently conducts heat.
- Other electronic parts
You can select the input voltage and oscillation frequency!
- Other electronic parts
Total height 27mm, fanless heat sink cooler with a copper core heat sink with heat pipes and aluminum fins.
- Other electronic parts
We will manufacture multi-layer flexible printed circuit boards (3 to 6 layers) entirely from polyimide. Please look forward to our quick delivery response! (Multi-layer boards, FPC)
- Other electronic parts
- Printed Circuit Board
- Circuit board design and manufacturing
Experience Taiyo Technorex's FPC at Flex's social study tour, Nepcon Japan 2025!
◎FPC (Flexible Printed Circuit Board): Under the theme of "Discovering Applications for FPC," you can experience the characteristics of FPC in four zones: lightweight, flexible, fine, and special. 1. Comparison of weight between rigid boards and FPC 2. FPC that you can actually touch and bend 3. Reduction of board area due to high-density wiring 4. FPC with special features such as transparent, high-frequency, and pressure-resistant types Additionally, we are also showcasing next-generation circuit technologies such as stack vias and via fills. It's not just about FPC! We have live demonstrations of 'FA Automation' and the latest appearance inspection system using AI technology! ◎FA Automation: By achieving teaching-less automation through visual feedback control, we eliminate the burden of calibration and realize high-precision, high-speed operation. We have prepared a demonstration for the transport of rigid boards. ◎The latest final appearance inspection system, the AI system 'TY-VISION XAIS,' is now in Chapter 2! In addition to improving efficiency by reducing false positives in the final appearance inspection process, it also supports defect detection using AI. It is effective for defects with minimal brightness differences that are difficult to detect with inspection devices, even though they can be identified visually.
We welcome inquiries and consultations regarding flexible procurement challenges! We respond to various requests, including halogen-free types. We cater to everything from digital cameras to the aeros...
- Printed Circuit Board
- Circuit board design and manufacturing
- Other electronic parts
【TTL_Exhibition Participation Information】JPCAShow2025 'Newly Developed Topics.'
◆FPC (Flexible Printed Circuit Board)◆ ~Tayo Technorex's Strengths in the FPC Manufacturing Process~ The manufacturing of FPC requires multiple critical processing steps. Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. This time, we will introduce the "strengths" we have cultivated over many years in each process! <Design> Circuit design, artwork, S-parameter analysis <Layer Connection> Build-up FPC, filled vias, small-diameter vias <Circuit Formation> MSAP method, thin copper, thick copper <Insulation Treatment> High-precision openings ±20μm, LCP coverlay <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) <Post-Processing> High-precision outline processing ±50μm, diverse tools <Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Material Systems◆ Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ Proposals for utilizing FA and collaborative robots
Introduction to high-difficulty FPCs, specific issues, and TAIYO's one-stop service, covering the basics of flexible substrates (glossary)!
- Printed Circuit Board
- Other cable related products
- Other electronic parts
【TTL_Exhibition Participation Information】JPCAShow2025 'Newly Developed Topics.'
◆FPC (Flexible Printed Circuit Board)◆ ~Tayo Technorex's Strengths in the FPC Manufacturing Process~ The manufacturing of FPC requires multiple critical processing steps. Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. This time, we will introduce the "strengths" we have cultivated over many years in each process! <Design> Circuit design, artwork, S-parameter analysis <Layer Connection> Build-up FPC, filled vias, small-diameter vias <Circuit Formation> MSAP method, thin copper, thick copper <Insulation Treatment> High-precision openings ±20μm, LCP coverlay <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) <Post-Processing> High-precision outline processing ±50μm, diverse tools <Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Material Systems◆ Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ Proposals for utilizing FA and collaborative robots
Wide temperature resistance, customizable to your desired frequency.
- Other electronic parts