List of Other electronic parts products
- classification：Other electronic parts
361～405 item / All 8613 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
Set up in the showcase to attract the attention of passersby, displaying videos and photos to make the store more eye-catching.
- LCD display
- Other electronic parts
The brightness of the outdoor display reaches 4000 nits, allowing it to be read in direct sunlight, providing clear and engaging content no matter where the audience is.
- LCD display
- Other electronic parts
For optical components and electronic components, leave it to Sinkland Corporation!
- Other optical parts
- Other electronic parts
It is possible to thin down to 0.2mm! There are proven applications in various products such as mobile phones and digital cameras, both domestically and internationally!
- antenna
- Sensors
- Other electronic parts
![[EMC & Electrostatic Measures] Cond...](https://image.mono.ipros.com/public/product/image/017/2000303974/IPROS6461387793223988976.png?w=280&h=280){kind=small}
Overwhelming adoption results in smartphones and digital cameras both domestically and internationally. Supports thicknesses down to 0.2mm, contributing to product miniaturization and slimming!
- Other electronic parts
FPC optimal for environments where cutting oil is being sprayed.
- Other electronic parts
FPC optimal for environments where cutting oil is being sprayed.
- Other electronic parts
Agilex 5 FPGA SOM Second Edition. Low-cost and small Comet A13 SoM.
- Embedded Board Computers
- Other electronic parts
- Other semiconductors
A bump with a minimum diameter of Φ20µm is formed at the terminal section of the FPC. The bump is used as a contact point and is applied in high-precision circuit testing, etc. (Flexible substrate)
- Other electronic parts
[Press Release from Taiyo TechnoRex] Regarding the Improvement of High-Density Wiring Formation Technology Using the Patterned Beer Fill Method
Our company has further improved the technology for forming high-density wiring in our core business of electronic substrates, specifically in flexible printed circuit boards (FPCs). In recent years, electronic devices such as medical equipment and industrial machinery have been advancing in miniaturization and lightweight design. To incorporate many functions into limited space, there is a demand for increased wiring density on the substrate. Therefore, we have been working on establishing filled via technology and improving the M-SAP method. The filled via structure involves filling vias (holes) made by laser in the insulating layer with copper plating, ensuring electrical connections on both sides of the substrate while reducing the recesses of the vias, which allows for component mounting on the vias and leads to high-density mounting. On the other hand, the M-SAP method significantly improves line width management by laminating copper to form circuits, enabling high-density wiring. This time, based on the pattern via fill method that leverages these characteristics, we successfully formed wiring with a pitch of 30μm on a double-sided substrate with a filled via structure. We will continue to aim for further improvements in high-density wiring formation technology through ongoing development, prototyping, and verification.
We will manufacture multi-layer flexible printed circuit boards (3 to 6 layers) entirely from polyimide. Please look forward to our quick delivery response! (Multi-layer boards, FPC)
- Other electronic parts
- Printed Circuit Board
- Circuit board design and manufacturing
Experience Taiyo Technorex's FPC at Flex's social study tour, Nepcon Japan 2025!
◎FPC (Flexible Printed Circuit Board): Under the theme of "Discovering Applications for FPC," you can experience the characteristics of FPC in four zones: lightweight, flexible, fine, and special. 1. Comparison of weight between rigid boards and FPC 2. FPC that you can actually touch and bend 3. Reduction of board area due to high-density wiring 4. FPC with special features such as transparent, high-frequency, and pressure-resistant types Additionally, we are also showcasing next-generation circuit technologies such as stack vias and via fills. It's not just about FPC! We have live demonstrations of 'FA Automation' and the latest appearance inspection system using AI technology! ◎FA Automation: By achieving teaching-less automation through visual feedback control, we eliminate the burden of calibration and realize high-precision, high-speed operation. We have prepared a demonstration for the transport of rigid boards. ◎The latest final appearance inspection system, the AI system 'TY-VISION XAIS,' is now in Chapter 2! In addition to improving efficiency by reducing false positives in the final appearance inspection process, it also supports defect detection using AI. It is effective for defects with minimal brightness differences that are difficult to detect with inspection devices, even though they can be identified visually.
Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.
- Other electronic parts
[Press Release from Taiyo TechnoRex] Established 4-layer FPC manufacturing technology using MSAP method, achieving 10μm/20μm fine wiring and accelerating expansion into next-generation communications, AI, and ADAS fields.
Taiyo TechnoRex has established manufacturing technology for 4-layer FPC (Flexible Printed Circuit Board) using the MSAP (Modified Semi Additive Process) method, which was developed to improve high-density wiring technology. Compared to conventional methods, it enables high-precision line width management, achieving fine wiring formation of 10μm/20μm (line/space) in 4-layer FPCs. This technology ensures high wiring accuracy and reliability of interlayer connections, making it possible to accommodate high-density and high-function circuit designs. The technology is expected to be applied not only in wearable devices and medical equipment but also in next-generation communication devices requiring high-frequency and high-speed transmission technology, AI server-related equipment, and ADAS and autonomous driving-related devices.
Transparent flexible printed circuit boards contribute to improved design with excellent transparency! The fine patterns make the wiring inconspicuous.
- Other electronic parts
[Press Release from Taiyo TechnoRex] Established 4-layer FPC manufacturing technology using MSAP method, achieving 10μm/20μm fine wiring and accelerating expansion into next-generation communications, AI, and ADAS fields.
Taiyo TechnoRex has established manufacturing technology for 4-layer FPC (Flexible Printed Circuit Board) using the MSAP (Modified Semi Additive Process) method, which was developed to improve high-density wiring technology. Compared to conventional methods, it enables high-precision line width management, achieving fine wiring formation of 10μm/20μm (line/space) in 4-layer FPCs. This technology ensures high wiring accuracy and reliability of interlayer connections, making it possible to accommodate high-density and high-function circuit designs. The technology is expected to be applied not only in wearable devices and medical equipment but also in next-generation communication devices requiring high-frequency and high-speed transmission technology, AI server-related equipment, and ADAS and autonomous driving-related devices.
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[Basic Knowledge] The standard manufacturing process of Taiyo Industry, which has focused on small quantities of a wide variety of products, has been documented!
- Printed Circuit Board
- Other electronic parts
- Other cable related products
[Press Release from Taiyo TechnoRex] Established 4-layer FPC manufacturing technology using MSAP method, achieving 10μm/20μm fine wiring and accelerating expansion into next-generation communications, AI, and ADAS fields.
Taiyo TechnoRex has established manufacturing technology for 4-layer FPC (Flexible Printed Circuit Board) using the MSAP (Modified Semi Additive Process) method, which was developed to improve high-density wiring technology. Compared to conventional methods, it enables high-precision line width management, achieving fine wiring formation of 10μm/20μm (line/space) in 4-layer FPCs. This technology ensures high wiring accuracy and reliability of interlayer connections, making it possible to accommodate high-density and high-function circuit designs. The technology is expected to be applied not only in wearable devices and medical equipment but also in next-generation communication devices requiring high-frequency and high-speed transmission technology, AI server-related equipment, and ADAS and autonomous driving-related devices.
We welcome inquiries and consultations regarding flexible procurement challenges! We respond to various requests, including halogen-free types. We cater to everything from digital cameras to the aeros...
- Printed Circuit Board
- Circuit board design and manufacturing
- Other electronic parts
[Press Release from Taiyo TechnoRex] Established 4-layer FPC manufacturing technology using MSAP method, achieving 10μm/20μm fine wiring and accelerating expansion into next-generation communications, AI, and ADAS fields.
Taiyo TechnoRex has established manufacturing technology for 4-layer FPC (Flexible Printed Circuit Board) using the MSAP (Modified Semi Additive Process) method, which was developed to improve high-density wiring technology. Compared to conventional methods, it enables high-precision line width management, achieving fine wiring formation of 10μm/20μm (line/space) in 4-layer FPCs. This technology ensures high wiring accuracy and reliability of interlayer connections, making it possible to accommodate high-density and high-function circuit designs. The technology is expected to be applied not only in wearable devices and medical equipment but also in next-generation communication devices requiring high-frequency and high-speed transmission technology, AI server-related equipment, and ADAS and autonomous driving-related devices.
We propose the optimal heat exchanger that contributes to energy conservation.
- Other electronic parts
- Heat exchanger
Captivating gaze, the magic of angles, every time I look, a different me.
- Other electronic parts
- Desktop PC
- Glass
Realizing lower loss with pure iron-based powder!
- Other metal materials
- Inductor Coil
- Other electronic parts
Heganes Japan will exhibit at the "2026 YOKOHAMA Automotive Technology Exhibition."
Heganes Japan will be exhibiting at the "Automotive Technology Exhibition 2026 YOKOHAMA," which will be held from May 27 (Wednesday) to May 29 (Friday). At our booth, we will introduce examples of applications for gear reducers and EMB gears made from powder metallurgy, iron powder for LFP batteries, and compacted magnetic cores made from SMC materials, as well as motors, among others. Additionally, our company has obtained SBTi certification, achieved the CN target for 2037, and reduced Scope 1 & 2 CO2 emissions by 55% compared to 2018 by 2025. 【Exhibition Highlights (Excerpt)】 ◆ Gear reducers and EMB gears made from powder metallurgy 1) Significant reduction in machining processes through net shape forming 2) Achieving both lightweight and strength through density control 3) Stable supply system with 15 global locations ◆ For improving the performance of electric motors. SMC materials already registered in JMAG 1) Proven track record as raw materials for motor cores and reactor cores (actual machine display) 2) Support for initial magnetic design considerations using JMAG registered materials 3) Environmental support through visualization of CO2 emissions caused by materials *For more details, please refer to the materials. We sincerely look forward to your visit.
Achieves a consumption current of 0uA! A multifunctional load switch IC equipped with a soft start external adjustment feature.
- Other electronic parts
- Dedicated IC
Reduce implementation area! Suitable for battery-operated portable wireless devices with low operating voltage and low power consumption.
- Wireless LAN
- Other electronic parts
Compact form factor for I/O interconnect! Enables effective use of installation space.
- Other electronic parts
- Routers, Switches, and Hubs
The ultra-thin, lightweight COG structure and low power consumption design are features! Ideal for handheld devices and more.
- Other electronic parts
- Other electronic measuring instruments
Power cable with locking function for active use in critical situations
- Other electronic parts
- cable
- Other PCs and OA equipment
Academic Conference of the Japanese Society of Intensive Care Medicine - Medical Engineering Collaboration Exhibition at the Kyoto International Conference Center Annex Hall Side.
We will be exhibiting at the Japan Society of Intensive Care Medicine Academic Conference and Medical-Engineering Collaboration Exhibition! This is a great opportunity to actually touch and confirm the products, so please stop by. 【Exhibition Schedule】 - Anti-disconnection power cable - Medical-grade AC adapter - Medical-grade touch panel PC - Medical-grade connector - Partition with casters for medical institutions - Washable keyboard & mouse - Portable battery for general equipment
We will arrange for press parts from a partner company that has obtained ISO certification.
- Press Dies
- Other electronic parts
- Processing Contract
Supports a voltage of 24kV and a peak current of 500A. Contributes to the expansion of processing capacity in high-throughput production lines and the improvement of on-site strength.
- Other electronic parts
Supports a voltage of 12kV and a peak current of 500A. It is an industrial model with an output of 9kW that supports continuous production lines.
- Other electronic parts
10kV voltage with 4-channel independent control. Supports complex experiments with bipolar asymmetric operation and precise timer control.
- Other electronic parts
Voltage 5kV, adopting SiC technology. Supports advanced biomedical research with two independent channels and a fast rise time of less than 50ns.
- Other electronic parts
Snow melting and freeze prevention, further promoting the growth of agricultural products as a heating material. Actively used for various applications [Agriculture, electric heating/heating cables, e...
- cable
- Other electronic parts
- power supply
FPC that is resistant to noise due to GND enhancement. Total quality assurance is possible when combined with our HF connectors.
- Other electronic parts
FPC that is resistant to noise due to GND enhancement. Total quality assurance is possible when combined with our HF connectors.
- Other electronic parts
FPC optimal for environments where cutting oil and similar substances are sprayed.
- Other electronic parts
FPC optimal for environments where cutting oil and similar substances are sprayed.
- Other electronic parts
FPC that is resistant to noise due to GND enhancement. Total quality assurance is possible when combined with our HF connectors.
- Other electronic parts
iTrans USB3-TR100 can extend USB 3.2 Gen 1 (5Gbps) up to 100m with a Cat6A cable!
- Other electronic parts
- Web/Video Conference
- LAN construction and wiring work
BizEasyP30 supports 4K@30Hz resolution, equipped with an 8-megapixel CMOS sensor, and features 3x optical zoom.
- Web/Video Conference
- Other electronic parts
- LAN construction and wiring work
iControl K10-US 10-button keypad controller
- Other electronic parts
- LAN construction and wiring work
- Web/Video Conference
2CH USB Audio to Dante Converter iTrans DU-TR-22B
- Web/Video Conference
- Other electronic parts
- cable
Achieve distribution and extension of 4K/30 HDMI video over 1G-LAN!
- Other electronic parts
- LAN construction and wiring work
- Web/Video Conference
Achieve HDMI video distribution and extension over 1G-LAN!
- Other electronic parts
- LAN construction and wiring work
- Web/Video Conference
Achieve distribution, extension, and switching of HDMI video/control signals over 1G-LAN!
- Other electronic parts
- Web/Video Conference
- LAN construction and wiring work
Save wandering seniors!! GPS Walk - shoes with built-in GPS device.
- Communications
- Other electronic parts