List of Solder products
- classification:Solder
151~165 item / All 386 items
For those who have isolators. Achieving high chemical resistance and workability. Low cost and short delivery times are also possible for glove box and isolator gloves.
- Work gloves
Notice of participation in 'INTERPHEX Week Tokyo' from May 20 (Wednesday) to May 22 (Friday), 2026.
Ito Corporation will be exhibiting at "INTERPHEX Week Tokyo" held at Makuhari Messe. This exhibition is the largest in Japan, showcasing a wide range of products and services related to the research and manufacturing of pharmaceuticals, cosmetics, and regenerative medicine from 25 countries and regions around the world. Pharmaceutical and cosmetic manufacturers, as well as regenerative medicine companies, will be attending from all over the globe. We will be showcasing "Gloves for Glove Boxes/Isolators" manufactured by Tron Power. We look forward to your visit.
We will introduce measures against copper and fine wire corrosion.
- Solder
We will introduce flux dispersion and solder balls (solder with resin).
- Solder
I will introduce you to flux dispersion (solder paste).
- Solder
I will introduce the issue of printing defects (solder paste).
- Solder
Reduced occurrence of dross due to the action of oxidation-inhibiting elements! A solder pot oxidation inhibitor that exhibits stable oxidation prevention effects.
- Solder
Completely halogen-free compatible! Demonstrates wettability equivalent to halogen-containing products, and is compatible with difficult materials such as nickel and brass!
- Solder
Acidic type high-speed indium plating solution
- Non-ferrous metals
- Chemicals
- Solder
Three types of Pb-free soldered products were subjected to reliability testing! We will introduce the main objectives of each test and the results of cross-sectional observations.
- Solder
Cross-sectional observation of substrate-mounted components (1) to (6)
We would like to introduce an example of cross-sectional observation of mounted components conducted by our company. Using commercially available computer circuit boards, we observed the solder joints of mounted components and the internal structure of the components with a metal microscope. The observation modes of the metal microscope include bright field observation, dark field observation, and polarized light observation, among others. Additionally, there are observations using transmitted light, and the observation mode is selected according to the sample. By conducting cross-sectional observations before and after reliability testing, we can evaluate the reliability of the product. When observing, it is important to select an appropriate "observation mode" to clearly capture the condition of the solder joint interface and defects such as cracks.