List of Contract Analysis products
- classification:Contract Analysis
826~840 item / All 2030 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
Achieving clear images with large aluminum castings.
- X-ray inspection equipment
- Contract Analysis
- Contract Inspection
An innovative high-output micro-focus C-ray CT device that reflects the future.
- X-ray inspection equipment
- Contract Inspection
- Contract Analysis
Simulation of vacuum exhaust and analysis of gas flow under low pressure conditions, analysis software compatible with rarefied gases (rarefied fluids).
- Contract Analysis
- Vacuum pump
- CVD Equipment
An easy-to-understand explanation of the current status and outlook of the overseas solar power generation system market!
- Other contract services
- Technical and Reference Books
- Contract Analysis
The think tank and consulting company for solar power generation, Resource Comprehensive System, is recruiting personnel.
Resource Comprehensive System Co., Ltd. (Headquarters: Chuo-ku, Tokyo, Representative Director: Osamu Ichiki), which conducts consulting services related to solar power generation and its associated businesses, is now recruiting new personnel to meet customer needs arising from the expansion of solar power installation and the increasing demand for storage batteries and new fields. Positions available: 1. Researcher 2. General Affairs Staff Location: Headquarters in Chuo-ku, Tokyo, and a combination of remote work For details and application methods, please check our "Recruitment Information Page" (https://www.rts-pv.com/recruit/). Contact: Resource Comprehensive System Co., Ltd. Email: info@rts-pv.com
Ultrasonic microscope observation of transistors! It is possible to check the peeling conditions at various locations even with the same focus.
- Contract Analysis
- Analysis Services
- Contract Analysis
Ultrasonic microscope observation of semiconductor packages
This is an introduction to the ultrasonic microscope observation of semiconductor packages conducted by our company. Due to storage conditions and mounting conditions, delamination may occur between the metal parts (die pad) and the package resin in semiconductor packages. Delamination inside the package is a defect that significantly affects product quality, but it cannot be detected through visual inspection. By using an ultrasonic microscope, we can clearly capture the internal structure of the package, contributing to reliability evaluation.
If it is something that ultrasonic waves can penetrate, you can check internal information that cannot be confirmed from the appearance!
- Contract Analysis
- Analysis Services
- Contract Analysis
Observation of adhesive conditions through a metal plate using an ultrasonic microscope.
Here is an introduction to a case where the adhesive condition was observed through a metal plate using an ultrasonic microscope. The ultrasonic microscope can reveal internal information that cannot be confirmed from the appearance, as long as the ultrasonic waves can pass through the material. After reliability testing, we observed the condition of the adhesive remaining on the metal plate from the metal side in a sample where the chip had come off. Please refer to the PDF document for details and results of the observations.
Introduction of case studies! Specializing in simulations of low-pressure plasma or low-temperature plasma.
- Other analyses
- Magnetic field analysis/electromagnetic wave analysis
- Contract Analysis
Development of 'tactile devices'! The third interface alongside audio and video.
- High Speed Camera
- Image analysis software
- Contract Analysis
Since it is made of film, it won't tear even in rainy weather.
- Contract Analysis
- Office paper