List of Microcomputer products
- classification：Microcomputer
46～90 item / All 163 items
We will also search for parts that have been rejected by other companies.
- Microcomputer
- Memory
- Embedded Board Computers
Ultra-small satellite, onboard computer for CubeSat, CSP. A single-board computer equipped with a Zynq-7020 processor.
- Printed Circuit Board
- Microcomputer
Intel Atom x7000RE (Amston Lake) and Intel Core 3 equipped SMARC: conga-SA8
- Embedded Board Computers
- Microcomputer
- Other electronic parts
[Press Release] Congatec Expands SMARC Modules: Equipped with Intel's New Core 3 Processor to Enhance Performance - Boosting AI and Graphics Performance of Low-Power SMARC Modules -
Congatec, a leading provider of embedded and edge computing technology, is expanding its conga-SA8 SMARC module. The low-power computer-on-module (COM) will now feature the latest Intel Core i3 processors. This new CPU technology significantly enhances performance, making the energy-efficient credit card-sized SMARC module ideal for integration into high-performance edge applications and low-power systems. The new conga-SA8 model delivers higher performance and improved energy efficiency for all edge computing applications operating in an extended temperature range of 0°C to +60°C. Read the full press release here: https://bit.ly/4jjHIXA
AMD Ryzen 8000 equipped COM Express Compact Type 6 module: conga-TCR8
- Embedded Board Computers
- Microcomputer
- Other electronic parts
[News] Embedded Technology Blog Japanese Version Volume 10 Released!
The website of Congatec features a blog (in English) by experts in embedded computing and edge computing. The Japanese translations are published periodically on the following site: https://www.incom.co.jp/corporation/custom.php?company_id=4735&custom_page_id=631 The 10th installment is about the conga-TCR8 module equipped with AMD Ryzen Embedded 8000, which won the "Embeddy Award." Check out the highlights of products for edge AI. 【Currently Published Blogs】 1. COM-HPC Mini - Part 1: Size 2. COM-HPC Mini - Part 2: Pinout : 7. COM-HPC Mini - Part 3: Cooling : 10. From an Unsung Hero to an Award-Winning Star: Spotlight on Congatec's conga-TCR8 We hope this will be helpful for your embedded system development and new projects.
[Industrial Temperature Support] SMARC Module with NXP i.MX 95: conga-SMX95
- Embedded Board Computers
- Microcomputer
- Other electronic parts
[Press Release] Congatec Announces New SMARC Module Featuring NXP i.MX 95 Processor Series - Congatec's Module Sets a New Benchmark for Secure Edge AI Applications -
congatec, a leading vendor of embedded and edge computing technology, has announced a new high-performance Computer-on-Module (COM) featuring the NXP i.MX 95 processor, further expanding its portfolio of modules equipped with low-power NXP i.MX Arm processors. This symbolizes congatec's strong partnership with NXP. Customers can leverage a scalable and reliable upgrade path for existing or new energy-efficient edge AI applications with stringent security requirements. For the full press release, click here: https://bit.ly/3WppVEY
3.5-inch application carrier board for COM-HPC Mini module: conga-HPC/3.5-Mini
- Embedded Board Computers
- Microcomputer
- Other electronic parts
Micro-ATX application carrier board for COM-HPC Server: conga-HPC/uATX-Server
- Embedded Board Computers
- Microcomputer
- Other electronic parts
Application-ready COM-HPC Client with implemented hypervisor and OS: conga-aCOM/cRLP
- Embedded Board Computers
- Microcomputer
- Other electronic parts
[Press Release] Congatec Announces Partnership with Canonical - Providing the Best Ubuntu Pro Experience on Congatec's aReady.COM
congatec, a leading vendor of embedded and edge computing technologies, has announced a partnership with Canonical, the provider of Ubuntu. This partnership will enable congatec to offer the best out-of-the-box experience by bundling Ubuntu Pro with aReady.COM for optimized platforms that provide security, reliability, and stability. Designers across all industries are seeking greater agility, reduced time to market, and lower development costs to respond to an unprecedentedly accelerating innovation cycle and to gain a competitive edge in the market. congatec addresses these needs by providing aReady.COM as a fully validated complete package, including workload integration and layers of OS and functional software, to ensure seamless incorporation into applications for equipment manufacturers. Read the full press release here: https://bit.ly/3Z8c33h
Application-ready COM-HPC Mini module with implemented hypervisor and OS: conga-aCOM/mRLP
- Embedded Board Computers
- Microcomputer
- Other electronic parts
[Press Release] Congatec Announces Partnership with Canonical - Providing the Best Ubuntu Pro Experience on Congatec's aReady.COM
congatec, a leading vendor of embedded and edge computing technologies, has announced a partnership with Canonical, the provider of Ubuntu. This partnership will enable congatec to offer the best out-of-the-box experience by bundling Ubuntu Pro with aReady.COM for optimized platforms that provide security, reliability, and stability. Designers across all industries are seeking greater agility, reduced time to market, and lower development costs to respond to an unprecedentedly accelerating innovation cycle and to gain a competitive edge in the market. congatec addresses these needs by providing aReady.COM as a fully validated complete package, including workload integration and layers of OS and functional software, to ensure seamless incorporation into applications for equipment manufacturers. Read the full press release here: https://bit.ly/3Z8c33h
[AI Compatible] COM Express Compact Type 6 with Intel Core Ultra: conga-TC700
- Embedded Board Computers
- Microcomputer
- Other electronic parts
[Press Release] Congatec Releases COM Express Compact Module Featuring New Intel Core Ultra Processor - Next-Generation AI Computing for the Edge
Congatec will release the latest COM Express Compact module equipped with Intel Core Ultra processors. The new module, featuring a unique combination of heterogeneous computing engines including CPU, GPU, and NPU, is ideal for executing AI workloads in demanding edge environments. For the full press release, click here: https://bit.ly/3RwQap4
COM Express with 13th generation Intel Core, featuring excellent shock resistance and vibration resistance, suitable for industrial temperature applications: conga-TC675r.
- Embedded Board Computers
- Microcomputer
- Other electronic parts
AI-enabled, TI TDA4VM equipped SMARC module: conga-STDA4
- Embedded Board Computers
- Microcomputer
- Other electronic parts
[Press Release] Congatec announces a new SMARC module equipped with TI Jacinto 7 TDA4x and DRA8x processors - processing high-end edge AI and vision with ultra-low power consumption.
Congatec, a leading vendor of embedded and edge computing technology, has announced the release of its latest SMARC computer-on-module featuring TI Jacinto 7 TDA4x or DRA8x processors. These new industrial-grade computer-on-modules are equipped with dual Arm Cortex-A72 processors and powerful AI accelerators, as well as 3D graphics, making them ideal for ultra-low power high-performance AI edge applications. The conga-STDA4 module consumes only 5 to 10 watts, targeting areas such as automated guided vehicles (AGVs) and autonomous mobile robots (AMRs), as well as industrial vehicles that require near-field analysis using 2D/3D cameras, radar, and LIDAR, including construction and agricultural machinery. Additionally, it is suitable for vision-focused industrial automation and medical solutions that require powerful and energy-efficient AI processing at the edge.
13th Generation Intel Core equipped COM-HPC Mini Size Module: conga-HPC/mRLP
- Embedded Board Computers
- Microcomputer
- Other electronic parts
[Press Release] Congatec Welcomes Approval of COM-HPC 1.2 Standard with Addition of COM-HPC Mini - Achieving Maximum Performance in a Compact Size -
congatec, a leading vendor of embedded and edge computing technology, welcomes the approval of the COM-HPC 1.2 standard by PICMG, which includes the newly added COM-HPC Mini form factor. This new standard delivers high performance in a compact form factor of just 95mm x 70mm. Even devices with limited space can take advantage of the excellent bandwidth and interfaces of COM-HPC, such as PCIe Gen 5 and Thunderbolt. For the full press release, click here: https://bit.ly/3LWZlgJ
13th/14th Generation Intel Core equipped COM-HPC Client Size C Module: conga-HPC/cRLS
- Embedded Board Computers
- Microcomputer
- Other electronic parts
[Press Release] Congatec Announces New Carrier Board Design Training Program - Accelerating the Acquisition of Technical Knowledge -
congatec, a leading vendor of embedded and edge computing technology, has announced a new carrier board design training program to share best practices for design methods using state-of-the-art computer-on-modules such as the COM-HPC and SMARC standards. The goal is to enable system architects to quickly, easily, and efficiently delve deeply into the design rules of these PICMG and SGET standards. This training course will explain the fundamentals of design for all mandatory and recommended items of the standards, and by providing best practice schematics for computer-on-module carrier boards, it will allow developers to efficiently start their own carrier board design projects. The focus is on designing carrier boards that comply with the standards, allowing participants to learn about the essential interoperability, scalability, and durability needed to build custom embedded computing platforms. The target audience includes developers from OEMs, VARs, and system integrators.
13th Generation Intel Core equipped COM-HPC Client Size A Module: conga-HPC/cRLP
- Embedded Board Computers
- Microcomputer
- Other electronic parts
[Press Release] Congatec Announces New Carrier Board Design Training Program - Accelerating the Acquisition of Technical Knowledge -
congatec, a leading vendor of embedded and edge computing technology, has announced a new carrier board design training program to share best practices for design methods using state-of-the-art computer-on-modules such as the COM-HPC and SMARC standards. The goal is to enable system architects to quickly, easily, and efficiently delve deeply into the design rules of these PICMG and SGET standards. This training course will explain the fundamentals of design for all mandatory and recommended items of the standards, and by providing best practice schematics for computer-on-module carrier boards, it will allow developers to efficiently start their own carrier board design projects. The focus is on designing carrier boards that comply with the standards, allowing participants to learn about the essential interoperability, scalability, and durability needed to build custom embedded computing platforms. The target audience includes developers from OEMs, VARs, and system integrators.
13th Generation Intel Core equipped COM Express Compact Type 6 module: conga-TC675
- Embedded Board Computers
- Microcomputer
- Other electronic parts
[Press Release] Congatec Announces New Carrier Board Design Training Program - Accelerating the Acquisition of Technical Knowledge -
congatec, a leading vendor of embedded and edge computing technology, has announced a new carrier board design training program to share best practices for design methods using state-of-the-art computer-on-modules such as the COM-HPC and SMARC standards. The goal is to enable system architects to quickly, easily, and efficiently delve deeply into the design rules of these PICMG and SGET standards. This training course will explain the fundamentals of design for all mandatory and recommended items of the standards, and by providing best practice schematics for computer-on-module carrier boards, it will allow developers to efficiently start their own carrier board design projects. The focus is on designing carrier boards that comply with the standards, allowing participants to learn about the essential interoperability, scalability, and durability needed to build custom embedded computing platforms. The target audience includes developers from OEMs, VARs, and system integrators.
COM-HPC Server Size D module with Intel Xeon D-2700/2800: conga-HPC/sILH
- Embedded Board Computers
- Microcomputer
- Other electronic parts
[Press Release] Congatec expands the modular edge server ecosystem with μATX server carrier boards and new COM-HPC server-on-module featuring the latest Intel Xeon processors.
congatec, a leading vendor of embedded and edge computing technology, has expanded its modular edge server ecosystem. The new products include a server carrier board in the μATX form factor and a COM-HPC server-on-module featuring the latest Intel Xeon D processors (Ice Lake). The new μATX server board for COM-HPC modules is designed for compact real-time servers used in edge applications and critical infrastructure. Along with the new product modules equipped with the latest Intel Xeon D-1800 and D-2800 processors, a space-saving, robust design that meets high-performance requirements is provided on the μATX platform, ready for immediate application use. For the full press release, click here: https://bit.ly/4appdeG
COM-HPC Server Size D module with Intel Xeon D-1700/1800: conga-HPC/sILL
- Embedded Board Computers
- Microcomputer
- Other electronic parts
[Press Release] Congatec expands the modular edge server ecosystem with μATX server carrier boards and new COM-HPC server-on-module featuring the latest Intel Xeon processors.
congatec, a leading vendor of embedded and edge computing technology, has expanded its modular edge server ecosystem. The new products include a server carrier board in the μATX form factor and a COM-HPC server-on-module featuring the latest Intel Xeon D processors (Ice Lake). The new μATX server board for COM-HPC modules is designed for compact real-time servers used in edge applications and critical infrastructure. Along with the new product modules equipped with the latest Intel Xeon D-1800 and D-2800 processors, a space-saving, robust design that meets high-performance requirements is provided on the μATX platform, ready for immediate application use. For the full press release, click here: https://bit.ly/4appdeG
COM Express Basic Type 7 module with Intel Xeon D-1700/1800: conga-B7XI
- Embedded Board Computers
- Microcomputer
- Other electronic parts
[Press Release] Congatec Announces New Carrier Board Design Training Program - Accelerating the Acquisition of Technical Knowledge -
congatec, a leading vendor of embedded and edge computing technology, has announced a new carrier board design training program to share best practices for design methods using state-of-the-art computer-on-modules such as the COM-HPC and SMARC standards. The goal is to enable system architects to quickly, easily, and efficiently delve deeply into the design rules of these PICMG and SGET standards. This training course will explain the fundamentals of design for all mandatory and recommended items of the standards, and by providing best practice schematics for computer-on-module carrier boards, it will allow developers to efficiently start their own carrier board design projects. The focus is on designing carrier boards that comply with the standards, allowing participants to learn about the essential interoperability, scalability, and durability needed to build custom embedded computing platforms. The target audience includes developers from OEMs, VARs, and system integrators.
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NXP i.MX 8M Plus equipped with Qseven module: conga-QMX8-Plus
- Embedded Board Computers
- Microcomputer
- Other electronic parts
11th Generation Intel Core equipped COM-HPC Client Size B Module: conga-HPC/cTLH
- Embedded Board Computers
- Microcomputer
- Other electronic parts
11th Generation Intel Core equipped COM Express Basic Type 6 Module: conga-TS570
- Embedded Board Computers
- Microcomputer
- Other electronic parts
11th Generation Intel Core equipped COM Express compact Type 6 (Rugged version): conga-TC570r
- Embedded Board Computers
- Microcomputer
- Other electronic parts
[Press Release] Congatec's COM Express Module Obtains Railway Certification IEC-60068 - Proven Shock and Vibration Resistance for Harsh Environments -
congatec, a leading vendor of embedded and edge computing technology, announced today that its COM Express Type 6 Compact module, the conga-TC570r, equipped with the 11th generation Intel Core processor family (codename "Tiger Lake"), has received IEC-60068 certification. This certification confirms that these modules meet the requirements for harsh conditions such as extended temperature ranges, rapid temperature changes, shock, and vibration, making them suitable for railway applications. System developers can utilize application-ready building blocks that offer proven robustness for various mission-critical applications. For the full press release, visit: https://www.congatec.com/jp/congatec/press-releases/
NXP i.MX 8M Plus equipped with SMARC module: conga-SMX8-Plus
- Embedded Board Computers
- Microcomputer
- Other electronic parts
[Press Release] Congatec Announces New Carrier Board Design Training Program - Accelerating the Acquisition of Technical Knowledge -
congatec, a leading vendor of embedded and edge computing technology, has announced a new carrier board design training program to share best practices for design methods using state-of-the-art computer-on-modules such as the COM-HPC and SMARC standards. The goal is to enable system architects to quickly, easily, and efficiently delve deeply into the design rules of these PICMG and SGET standards. This training course will explain the fundamentals of design for all mandatory and recommended items of the standards, and by providing best practice schematics for computer-on-module carrier boards, it will allow developers to efficiently start their own carrier board design projects. The focus is on designing carrier boards that comply with the standards, allowing participants to learn about the essential interoperability, scalability, and durability needed to build custom embedded computing platforms. The target audience includes developers from OEMs, VARs, and system integrators.
11th Generation Intel Core equipped COM-HPC Client Size A Module: conga-HPC/cTLU
- Embedded Board Computers
- Microcomputer
- Other electronic parts
11th Generation Intel Core equipped COM Express compact Type 6 module: conga-TC570
- Embedded Board Computers
- Microcomputer
- Other electronic parts
AMD Ryzen Embedded V2000 equipped COM Express Compact Type 6: conga-TCV2
- Embedded Board Computers
- Microcomputer
- Other electronic parts
Intel Atom x6000E (Elkhart Lake) equipped Pico-ITX board: conga-PA7
- Embedded Board Computers
- Microcomputer
- Other electronic parts
Intel Atom x6000E equipped COM Express Mini Type 10: conga-MA7
- Embedded Board Computers
- Microcomputer
- Other electronic parts
Intel Atom x6000E (Elkhart Lake) equipped SMARC module: conga-SA7
- Embedded Board Computers
- Microcomputer
- Other electronic parts
Intel Atom x6000E (Elkhart Lake) equipped Qseven module: conga-QA7
- Embedded Board Computers
- Microcomputer
- Other electronic parts
Intel Atom x6000E equipped COM Express Compact Type 6: conga-TCA7
- Embedded Board Computers
- Microcomputer
- Other electronic parts
SMARC module with NXP i.MX 8M Mini series processor: conga-SMX8-Mini
- Embedded Board Computers
- Microcomputer
- Other electronic parts
8th Generation Intel Core COM Express Compact Type 6 Module: conga-TC370
- Embedded Board Computers
- Microcomputer
- Other electronic parts
8th Generation Intel Core equipped COM Express Basic Type 6 Module: conga-TS370
- Other electronic parts
- Microcomputer
- Embedded Board Computers
3.5-inch SBC with 8th Generation Intel Core (Whiskey Lake): conga-JC370
- Embedded Board Computers
- Microcomputer
- Other electronic parts
AMD EPYC Embedded 3000 equipped COM Express Basic Type 7: conga-B7E3
- Embedded Board Computers
- Microcomputer
- Other electronic parts
NXP i.MX 8X series processor equipped SMARC module: conga-SMX8-X
- Other electronic parts
- Microcomputer
- Embedded Board Computers
Intel Atom C3000 equipped COM Express Basic Type 7 module: conga-B7AC
- Other electronic parts
- Microcomputer
- Embedded Board Computers
Intel Atom E3900 equipped COM Express Mini Type 10 module: conga-MA5
- Other electronic parts
- Microcomputer
- Embedded Board Computers
Intel Atom E3900 (Apollo Lake) equipped Qseven module: conga-QA5
- Other electronic parts
- Microcomputer
- Embedded Board Computers
Intel Atom E3900 (Apollo Lake) equipped SMARC module: conga-SA5
- Other electronic parts
- Microcomputer
- Embedded Board Computers