List of Other semiconductors products
- classification：Other semiconductors
211～225 item / All 2602 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
For thermal management of medium-sized devices. You can specify the ideal length in 1mm increments, without being constrained by the fixed sizes in the catalog, to match the enclosure space.
- Other semiconductors
Not constrained by fixed catalog sizes. You can specify the ideal length in millimeters to match thermal design and enclosure space. Additional processing can also be handled in bulk!
- Other semiconductors
Pin fin heat sink, width 40mm, height 20mm, length 40mm, material: Al99.5.
- Other semiconductors
Square pin fin heat sink, width 50mm, height 25mm, length 50mm, material: Al99.5.
- Other semiconductors
Custom formulations for important applications
- Other semiconductors
- Other medical supplies and cosmetic manufacturing materials
FFKM solutions designed for harsh operating conditions.
- Other semiconductors
For heat dissipation of surface mount packages such as DPAK, D2PAK, and SO-8. Our compact design reliably solves thermal issues in power converters and power supply boards.
- Other semiconductors
We conducted a cleaning evaluation using samples created under conditions that are likely to leave residues intentionally!
- Other semiconductors
A page on "Cleaning evaluation of organic residue remaining after sintering" has been added.
In the field of power semiconductors for automotive and industrial applications, the adoption of "sintering bonding" as a joining technology that achieves high resistance and high reliability against thermal stress is expanding, replacing solder bonding. Similar to no-clean solder bonding technology, sintering bonding is fundamentally designed to be "no-clean." However, the currently mainstream sintering bonding methods are conducted under high temperature and high pressure conditions, which can lead to the generation and adhesion of residues during the bonding process, potentially affecting subsequent processes and long-term reliability. Cleaning is one proposed solution to this issue. Although there is a "no-pressure" method for sintering bonding, its applications tend to be limited from the perspective of strength and reproducibility. Additionally, while it is residue-free, it is not "zero residue," so cleaning can also be a viable solution for achieving reliability. Detailed content of the technical column can be viewed through the related link.
Ideal for high-aspect ratio filling, from research and development to mass production.
- Printing Machinery
- Other semiconductors
- Printed Circuit Board
Designed for a wavelength range of 760 to 2900 nm with an accuracy of ±10 nm.
- Other semiconductors
QCL optimal for high-precision gas detection using TDLAS.
- Other semiconductors