List of Other semiconductors products
- classification：Other semiconductors
616～630 item / All 2655 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
FPGA capable of high-speed and real-time processing.
- Other semiconductors
A thorough explanation of semiconductor packaging from the basics to applications!
- Other semiconductors
- others
- Technical and Reference Books
7/2 Basic Course on Semiconductor Packaging Technology WEB Seminar
Title: "Fundamentals of Semiconductor Packaging Technology ~ From the Evolution of Package Types to Manufacturing Processes, Equipment and Materials Used, and Latest Trends ~" This is an introductory seminar where you can systematically learn about semiconductor packaging technology from the basics to advanced techniques. It provides a clear explanation of the role of packaging technology that supports the high performance of semiconductors, its background of evolution, manufacturing processes, and materials and equipment technologies. In addition to the characteristics of various package types such as DIP, QFP, BGA, and WLCSP, it also details major manufacturing technologies like back grinding, dicing, die bonding, wire bonding, and molding. Furthermore, you will learn about the trends and future prospects of the latest technologies such as SiP, FOWLP, CoWoS, EMIB, chiplets, and optoelectronic integrated packaging. This content is ideal for semiconductor engineers as well as sales and marketing personnel who want to understand packaging technology from the ground up.
Aluminum extruded heat sink with dimensions of 27.95 mm wide x 15.24 mm high - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with a width of 27.95 mm and a height of 12.5 mm - available in length variations.
- Other semiconductors
Aluminum extruded heat sink with a width of 27.95 mm and a height of 8 mm - available in various lengths.
- Other semiconductors
Analyze industry and market trends in semiconductors, focusing on chiplet technology, advanced packaging technology, chiplet packaging technologies, materials, and equipment configuration!
- Other semiconductors
- Other semiconductor manufacturing equipment
- Semiconductor inspection/test equipment
Web Seminar on "Latest Trends in Semiconductor Packaging and Semiconductor Encapsulation Materials" on April 17
■Title: "Latest Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulation Materials" ――As chipletization and 3D packaging advance in semiconductors, more sophisticated material design for encapsulants is required than ever before. This seminar will provide a detailed practical perspective on the latest trends in semiconductor packaging, covering raw material selection, design techniques, and reliability evaluation of encapsulants. ■Date and Time: April 17, 2026 (Friday) 13:30–16:30 ■Target Audience: Designers of semiconductor encapsulation materials, engineers using semiconductor encapsulation materials, designers of epoxy resins and hardeners for semiconductor encapsulation materials ■Knowledge Gained from the Seminar: - Trends in semiconductor packaging - Knowledge about raw materials for semiconductor encapsulation materials - Design techniques for semiconductor encapsulation materials and evaluation techniques for semiconductor encapsulation materials
Aluminum extruded heat sink with dimensions 27 mm wide x 22 mm high - available in various lengths.
- Other semiconductors
Clip-type rail mount that allows for quick attachment of heat sinks, cases, etc. to DIN rails compliant with TS35 standards.
- Other semiconductors
Aluminum clip for fixing heat sink and aluminum case to DIN rail.
- Other semiconductors
We offer silicon wafers such as particle management wafers and dummy mirror wafers!
- Wafer
- Other semiconductors
We continue to supply many electronic materials, starting with semiconductors.
- Other semiconductors
Our company, which has a product range of surfactants, glycol ethers, and amines, proposes original industrial cleaning agents tailored to meet our customers' needs!
- Cleaning agents
- Other semiconductors
- Other Auto Parts
Notice of Participation in the 17th Kawasaki International Environmental Technology Exhibition
We will be exhibiting the following items at the "17th Kawasaki International Environmental Technology Exhibition." When you visit, please stop by our booth. 【Exhibition Name】 17th Kawasaki International Environmental Technology Exhibition Official Website URL: https://www.kawasaki-eco-tech.jp/ 【Venue】 Kaltz Kawasaki, SDGs Contribution Zone D-8 【Dates】 November 13 (Wednesday) - November 14 (Thursday), 2024 【Visitor Registration】 Free visitor registration is required. For more details, please check the information on the official website above. 【Exhibited Items】 <Panel Display> ◆ Customized Industrial Cleaning Agents - Minemal Series ◆ Introduction of Environmentally Friendly Products ◆ Ionic Liquids for Cellulose Dissolution <Presentation Lecture> November 13 (Wednesday) at 11:30 AM "Introduction to Japanese Emulsifiers - Environmentally Friendly Products that Solve Social Issues" We look forward to your visit.
In the manufacturing processes of electronic materials such as semiconductors and liquid crystals, they are widely used as solvents such as photoresists, stripping agents, cleaning agents, and etchant...
- Other semiconductors
- Chemicals
- Cleaning agents
Our company's initiatives were featured in the "Amines Special" on page 6 of the Chemical Industry Daily on October 8, 2024.
Japanese emulsifiers are used by customers in many industries and fields. Depending on your application, we can also introduce grades that are not listed in the catalog. Please feel free to contact us. The materials can be downloaded from Ipros, and they are also introduced on our official website. - Amino alcohol-based, morpholine-based, piperazine-based - Electronic materials glycol ether and amine "Metarify series" - Industrial cleaning agents "Minemal series" - Gas absorbents and neutralizers "Amino alcohol"
Easy-to-understand explanation with manga! Company overview and workplace introduction.
- Chemicals
- Cleaning agents
- Other semiconductors
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We exhibited the following items at the 39th NePCON Japan. Thank you for visiting.
- Other semiconductors