List of Heat exchanger products
- classification：Heat exchanger
586～600 item / All 988 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
[Presentation of Case Studies] The equipment is old and there are no drawings... I want to use a refrigeration unit for cooling... I want to eliminate corrosion... etc. Please consult us about your he...
- Cooling system
- air conditioning
- Heat exchanger
![[Data] Collection of Drawings](https://image.mono.ipros.com/public/product/image/dd9/2000520747/IPROS02273958200049454432.png?w=280&h=280){kind=small}
We will design and manufacture products that meet your needs with a short delivery time and low cost.
- Cooling system
- air conditioning
- Heat exchanger
To satisfy our customers! With the theme of heat exchange, we create a comfortable environment through ideas and technology.
- Heat exchanger
- Refrigerators and freezers
- Other air conditioning equipment
Zero direct wind! A non-stress energy-saving radiation air conditioning system.
- Heat exchanger
We have published numerous examples of work, including scenes of water tank cleaning and before-and-after images, using photos and illustrations.
- Dust collector
- Heat exchanger
Please leave the design and production of heat exchangers to us.
- Heat exchanger
The well water type unit cooler can be used in explosion-proof areas. It is designed with pressure-resistant explosion-proof specifications, allowing for safe use even in hazardous locations.
- Cooling system
- air conditioning
- Heat exchanger
It is possible to arrange numerous fine holes of 0.01 to 0.03 mm on the surface! Applicable to custom-shaped products according to specifications.
- Heat exchanger
- Other electronic parts
- air conditioning
Solid-phase diffusion bonding refers to [WELCON Corporation].
Capable of manufacturing complex fine three-dimensional structures! We have a proven track record in various fields such as aerospace and chemical plants. Solid-state diffusion bonding is a method of directly bonding materials together, which is significantly different from techniques like welding or brazing. This technology promotes atomic movement at the bonding interface by heating and applying pressure to the materials being joined, allowing for bonding without melting the materials, thus expanding the range of possible manufacturing methods and functions. With the solid-state diffusion bonding method, it is possible to create fluid devices with microchannel structures and complex fine three-dimensional structures. 【Features】 ■ Lamination bonding of thin plates is possible ■ Bonding strength comparable to the base material can be achieved ■ Complex hollow components can be manufactured ■ Precise bonding with minimal deformation is possible ■ Bonding of dissimilar materials is possible *For more details, please refer to the PDF document or feel free to contact us.
Thin rib shape allows for internal cooling circuits to be placed even in narrow areas! Suitable for application in molds designed for high cycles.
- Heat exchanger
- Other electronic parts
- air conditioning
Solid-phase diffusion bonding refers to [WELCON Corporation].
Capable of manufacturing complex fine three-dimensional structures! We have a proven track record in various fields such as aerospace and chemical plants. Solid-state diffusion bonding is a method of directly bonding materials together, which is significantly different from techniques like welding or brazing. This technology promotes atomic movement at the bonding interface by heating and applying pressure to the materials being joined, allowing for bonding without melting the materials, thus expanding the range of possible manufacturing methods and functions. With the solid-state diffusion bonding method, it is possible to create fluid devices with microchannel structures and complex fine three-dimensional structures. 【Features】 ■ Lamination bonding of thin plates is possible ■ Bonding strength comparable to the base material can be achieved ■ Complex hollow components can be manufactured ■ Precise bonding with minimal deformation is possible ■ Bonding of dissimilar materials is possible *For more details, please refer to the PDF document or feel free to contact us.
By miniaturizing, it is also possible to reduce flow rate! Introducing microchannel heat exchangers.
- Heat exchanger
- Other electronic parts
- air conditioning
Efforts to miniaturize heat exchangers
By miniaturizing, it is also possible to suppress flow rate! Introducing microchannel heat exchangers. We would like to introduce our efforts in miniaturizing heat exchangers. Heat exchangers that implement flow paths using microchannels can be miniaturized without compromising heat exchange performance compared to conventional heat exchangers. Additionally, miniaturization allows for the suppression of flow rate. At WELCON, we have reduced the volume to one-hundredth while maintaining the same performance using microchannels. You can find more details through the related links. [Overview] ■ Microchannel heat exchangers ■ Increased heat transfer area due to microchannel technology ■ High corrosion resistance and heat resistance through solid-phase diffusion bonding *For more details, please refer to the PDF materials or feel free to contact us.
Capable of manufacturing complex fine three-dimensional structures! We have a proven track record in various fields such as aerospace and chemical plants.
- Heat exchanger
- Other electronic parts
- air conditioning
Solid-phase diffusion bonding refers to [WELCON Corporation].
Capable of manufacturing complex fine three-dimensional structures! We have a proven track record in various fields such as aerospace and chemical plants. Solid-state diffusion bonding is a method of directly bonding materials together, which is significantly different from techniques like welding or brazing. This technology promotes atomic movement at the bonding interface by heating and applying pressure to the materials being joined, allowing for bonding without melting the materials, thus expanding the range of possible manufacturing methods and functions. With the solid-state diffusion bonding method, it is possible to create fluid devices with microchannel structures and complex fine three-dimensional structures. 【Features】 ■ Lamination bonding of thin plates is possible ■ Bonding strength comparable to the base material can be achieved ■ Complex hollow components can be manufactured ■ Precise bonding with minimal deformation is possible ■ Bonding of dissimilar materials is possible *For more details, please refer to the PDF document or feel free to contact us.
It is possible to cool uniformly without temperature variation! We offer customization of standard products and prototype development from scratch.
- Heat exchanger
- Other electronic parts
- air conditioning
[Explanatory Material] What is a Water-Cooled Microchannel Heat Sink? *Free Distribution
Fresh refrigerant is evenly distributed within the plane! It is possible to reduce temperature variations, improve cooling efficiency, and achieve low thermal resistance. A heat sink is a component used to cool absorbed heat, commonly used when dissipating heat from heat sources like CPUs, often utilizing a structure called "fins" to release heat into the air or to absorb heat by flowing water inside. Our company designs, manufactures, and sells water-cooled heat sinks, referred to as "microchannel heat sinks." The "water-cooled microchannel heat sink" allows fresh refrigerant to be evenly distributed within the plane, reducing temperature variations, improving cooling efficiency, and achieving low thermal resistance. [Structure] - Matrix structure - Distribution flow path - Microchannel flow paths arranged across the entire cooling surface - Internal structure that ensures refrigerant is evenly distributed across all flow paths *For more details, please refer to the PDF document or feel free to contact us. https://www.ipros.jp/product/detail/2000726009
Achieves high heat exchange performance and miniaturization! Reduces coolant usage, and fittings can be connected from both sides.
- Heat exchanger
- Other electronic parts
- air conditioning
Constructed with a core and core plate! Introducing a composite material that achieves both thermal conductivity and low thermal expansion rate.
- Heat exchanger
- Other electronic parts
- air conditioning