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Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
High-precision semiconductor manufacturing supported by high heat resistance and low loss flexible substrates.
- Printed Circuit Board
Formation of fine circuits using the MSAP method.
- Circuit board design and manufacturing
Next-generation high-temperature resistant solder resist ink "TAINEX Series"
- Printed Circuit Board
The Big Elec flexible circuit board compatible with high current has three features.
- Other electronic parts
The thinning of flexible substrates is effective for assembly in narrow spaces! Required in areas where low spring back and high bending flexibility are needed.
- Printed Circuit Board
- High frequency/microwave parts
- Wiring materials
Space-saving is possible! Suitable for high-resolution imaging diagnostic devices that require miniaturization.
- Wiring materials
Co-planar structure with unilateral wiring! We have two types of lineup available.
- Wiring materials
Improved flexibility with the adoption of mesh GND! Compatible with manual soldering as well.
- Wiring materials
The total length of the cable can be made to your specified length (up to 340mm), number of cores, and pitch!
- Wiring materials
Compared to polyimide, it has low dielectric constant, low dielectric loss tangent, and low water absorption, resulting in excellent high-frequency transmission characteristics! It also has long-term ...
- Wiring materials
Supports high-speed transmission up to 15GHz! We have combined the high-speed transmission connectors from Irisoh Electronics with our flexible substrates.
- Wiring materials
It can carry a larger current than a standard flexible circuit board, making it suitable for use in motors, power supply coils, and sensors.
- Wiring materials
Long-distance wiring in the meter class is achievable! Flexible printed circuit boards (FPC) can have their width and length freely determined, making them suitable for various fields.
- Wiring materials
Minimum connection pitch: 75/75μm. By using anisotropic conductive film, connection of narrow pitch terminals is possible!
- Wiring materials
Approximately one-third the rebound force compared to conventional structures! Low-rebound FPC for communication devices that combines noise reduction and high-speed transmission.
- Wiring materials