List of Electronic Components and Modules products
- classification：Electronic Components and Modules
2521～2565 item / All 59395 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
I will explain the types and principles of important devices that amplify light at high speeds.
- Other optical parts
Looking for the appropriate PD. An explanation of the types of photodiodes and their structural characteristics!
- diode
Explanation of the basic principles and applications of "saturable absorption materials" and "saturable absorption mechanisms."
- Laser Components
Pin fin heat sink, width 40mm, height 20mm, length 40mm, material: Al99.5.
- Other semiconductors
Square pin fin heat sink, width 50mm, height 25mm, length 50mm, material: Al99.5.
- Other semiconductors
Fiber optic cables with a heat resistance temperature of up to 250℃! You can choose from three types of transmission wavelengths according to your measurement content and application.
- LAN/Optical cable
- Other electronic parts
Maspower_E096-1A_96W_Constant Voltage AC Adapter
- power supply
faytech, ultra-thin casing, optical bonding compatible, supports power, video, and touch signals with a single USB Type-C, capacitive touch.
- LCD display
Introducing high-performance, high-efficiency products that meet strict industry standards!
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Significantly improved design flexibility in applications with space constraints!
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Additional board maintenance is possible! Ensures minimization of contact resistance between the wire and crimp barrel.
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Provides essential power efficiency for cost management! Designed for manufacturing flexibility and excellent electrical performance.
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Multiple types of circuit board stacking designs are possible, providing flexibility in design!
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
faytech, ultra-thin casing, supports optical bonding, powered and video transmission via a single USB Type-C cable.
- LCD display
Maspower S100-1A 100W Constant Voltage AC Adapter
- power supply
Maximize high-speed transmission processing performance and clean routing away from the connector installation area!
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
The flexible cable link provides relaxed tolerances and architectural flexibility!
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Cost reduction through hermaphroditic design! Shortened lead time and simplified product matrix.
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Providing a high-density and slim solution for interconnecting with SI performance!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
An OCP-recommended internal I/O connector solution designed specifically for boot drive applications!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Designed for internal wiring, enabling support for artificial intelligence (AI) and machine learning applications!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
faytech, ultra-thin casing, supports optical bonding, powered and video transmission via a single USB Type-C cable.
- LCD display
Achieving streamlined integration and rapid implementation through a male-female dual-body design!
- Other Connectors
- cable
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Equipped with 101 pairs of high-density modular interfaces per square inch!
- Other Connectors
- cable
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Maspower_S120-1B_120W_Constant Voltage AC Adapter
- power supply
Regular inspection methods for ultrasonic flaw detection devices that ensure the safety of aircraft.
- Ultrasonic Oscillator
We will ensure the safety of the fuel tank of the space rocket.
- Ultrasonic Oscillator
Regular inspection methods for ultrasonic flaw detection devices to ensure the safety of weapons.
- Ultrasonic Oscillator
Wheel inspection using ultrasonic flaw detection devices that support the safe operation of railways.
- Ultrasonic Oscillator
Regular inspection methods for ultrasonic flaw detection devices to ensure the safety of piping.
- Ultrasonic Oscillator
Regular inspection methods for ultrasonic flaw detection devices that ensure plant safety.
- Ultrasonic Oscillator
Method for regular inspection of ultrasonic flaw detection devices to improve the quality of automotive parts.
- Ultrasonic Oscillator
Regular inspection methods for ultrasonic testing devices to ensure the safety of hull welding.
- Ultrasonic Oscillator
Comparing the differences in conductivity, cost, and weight!
- transformer
The participation in the JECAFAIR 2026 Electrical Industry Exhibition has been confirmed.
We have decided to exhibit at "JECAFAIR 2026 Electric Construction Industry Exhibition," which will be held at Tokyo Big Sight from May 27 (Wednesday) to May 29 (Friday). We will be exhibiting right at the entrance of booth number 1-54 in Hall 1 East. On the final day, our on-site workers, who process 150 tons of copper busbars annually, will share insights about the characteristics of copper, the challenges of processing, and information that only those on-site would know during the exhibitor seminar! For more details, please visit the official website! We sincerely look forward to your visit!
Regular inspection methods for ultrasonic flaw detection devices that ensure the safety of bridges.
- Ultrasonic Oscillator
Regular inspection methods for ultrasonic flaw detection devices that support the safe operation of turbines.
- Ultrasonic Oscillator
Quick response for copper busbar processing for electrical equipment.
- transformer
The participation in the JECAFAIR 2026 Electrical Industry Exhibition has been confirmed.
We have decided to exhibit at "JECAFAIR 2026 Electric Construction Industry Exhibition," which will be held at Tokyo Big Sight from May 27 (Wednesday) to May 29 (Friday). We will be exhibiting right at the entrance of booth number 1-54 in Hall 1 East. On the final day, our on-site workers, who process 150 tons of copper busbars annually, will share insights about the characteristics of copper, the challenges of processing, and information that only those on-site would know during the exhibitor seminar! For more details, please visit the official website! We sincerely look forward to your visit!
Introducing the regular inspection methods for ultrasonic testing devices in the aerospace field.
- Ultrasonic Oscillator
Zero wear with air levitation and linear motor. Maximum speed 2 m/s, sensor resolution 1 nm.
- Other machine elements
- Cartesian Robot
- encoder
High-rigidity rotary stage with an opening, achieving less than 1µm of eccentricity and flatness with high speed and high precision.
- Actuator
- Other industrial robots
- encoder