List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
406～450 item / All 5089 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
<Column demonstration in progress> Analyzing aggregate and drug-antibody ratio (DAR) using SEC column and HIC column.
- Chromatographic resins and packing materials
We have launched a video distribution site for pharmaceutical companies.
We are distributing topics that are particularly noteworthy in the biopharmaceutical industry in an on-demand video format. We will regularly update the latest videos, so please take this opportunity to watch them. 【Register to view here】 *Please copy the URL and watch it in your browser. https://portal.stream.jp/eqk212ojxt
Due to its modular embedded design, it is possible to flexibly assemble dedicated machines according to the required film formation methods. A compact thin-film experimental device that can accommodat...
- Sputtering Equipment
- Evaporation Equipment
- Annealing furnace
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.
- Evaporation Equipment
- Sputtering Equipment
- Etching Equipment
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
Flexible configuration available upon request for processes such as evaporation, sputtering, and EB. Adopts a tall chamber with a height of 570mm, contributing to improved uniformity during evaporatio...
- Evaporation Equipment
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)
- Sputtering Equipment
- Evaporation Equipment
- Etching Equipment
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
Two thin-film experimental devices are connected with a load-lock mechanism. Different film deposition devices (sputtering, evaporation, etc.) are seamlessly connected with the load-lock.
- Sputtering Equipment
- Evaporation Equipment
- Etching Equipment
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
Compact and space-saving! Ideal for organic thin film development, all processes such as deposition, sputtering, and annealing can be seamlessly performed within the glove box.
- Evaporation Equipment
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
For the semiconductor industry! Process analyzer / Online analyzer for monitoring tetramethylammonium hydroxide (TMAH) in developer solutions!
- Analytical Equipment and Devices
- Wafer
- Semiconductor inspection/test equipment
Measurement of hydrogen peroxide trimethylamine and standard cations for semiconductor manufacturing using ion chromatography.
- Ion Chromatography
- Semiconductor inspection/test equipment
- Analytical Equipment and Devices
The standard seismic isolation device "ISO-Base" can be retrofitted, reconfigured, and reused! Earthquake protection for IT equipment has become surprisingly easy.
- Other semiconductor manufacturing equipment
We will be exhibiting at the 32nd Industrial Technology Exhibition "Technical Show Yokohama" from February 2 (Wednesday) to February 4 (Friday), 2011.
We will be exhibiting at the Technical Show Yokohama held at Pacifico Yokohama. The exhibits will include: - Key management made easy! "IC Key Terminal" - Access control system - Production management system, production scheduler and more. We invite you to take this opportunity to see our products. If you would like an invitation ticket, please write "Request for invitation ticket" to info@biss.co.jp and provide your contact information. You can also do this through the Ipros page. You can find more details below: http://www.ipros.jp/company/254201/products_detail000000040.html
Continuous manufacturing process of single micron particles (wet adjustment method)
- Lithium-ion battery
- Capacitor
- Other semiconductor manufacturing equipment
【Exhibition Participation!】Ideal for surface modification of BGA substrates and lead frames! Achieves processing effects close to vacuum RIE plasma through the adoption of a unique system!
- Ashing device
1μm filtration! Contributing to improved yield in semiconductor manufacturing.
- Grinding Machine
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
1μm filtration! Extends tool life and contributes to cost reduction.
- Grinding Machine
- Other machine tools
- Wafer processing/polishing equipment
Widely usable for deburring, edge removal, chamfering, polishing finish, scale removal, etc., with various materials.
- Wafer processing/polishing equipment
Tungsten core wire is the core wire for next-generation semiconductor production diamond multi-wire saws.
- Wafer processing/polishing equipment
Ultra-fine tungsten core diamond wire is a material for next-generation semiconductor production.
- Wafer processing/polishing equipment
Three-dimensional relative motion! Ideal for precision parts, jewelry, and other fine work.
- Wafer processing/polishing equipment
Achieving excellent film thickness distribution and reproducibility! Multi-chamber specifications and various custom-made options are also available.
- CVD Equipment
Controllable extensive membrane properties! Significant particle reduction and improved productivity.
- CVD Equipment
Compatible with highly corrosive chemicals!! GEMÜ high-purity fluoropolymer valves
- valve
- Resist Device
- CMP Equipment
Achieving stable slurry supply! GEMU slurry supply application case for semiconductor manufacturing.
- valve
- Other semiconductor manufacturing equipment
All-fluoropolymer durable pressure gauge!!
- Pressure
- CMP Equipment
- Other semiconductor manufacturing equipment
Custom-made modular type! Easy maintenance and flexible combinations realized by the customer!
- valve
- Other semiconductor manufacturing equipment
We propose a solution for pressure relief valves related to semiconductor chemical supply in a new form! It can be selected for a wide range of applications.
- valve
- Other semiconductor manufacturing equipment
GEMÜ stainless steel diaphragm valve for high-purity organic solvents
- valve
- Resist Device
Guaranteeing the quality of sheet substrates! Contributing to the reliability improvement of automotive parts.
- Other inspection equipment and devices
- Circuit Board Inspection Equipment
- Semiconductor inspection/test equipment
Half-day estimate at the shortest / A must-see for those who are thinking, 'I want to ask...'
- Semiconductor inspection/test equipment
Efficient procurement operations. Increase productivity by reducing time costs.
Procure "high-quality" parts from just one piece! We will source them at a "reasonable" price. The manufacturing industry's downturn continues, and the future remains uncertain. In such times, what we can propose is... The necessity for streamlining and smoothing out manufacturing processes. It's not just about smart factories and IoT. ➡ Our company has a unique procurement model that simplifies procurement operations and process management. We purchase a variety of machined parts, such as milling, turning, and sheet metal, from a single source. We manage everything from quotations, processing, surface treatment, to quality assurance, completing the entire process in a one-stop manner. With partnerships with approximately 800 cooperating companies both domestically and internationally, we can provide stable parts supply that meets delivery times, precision, and processing needs. High-quality products. Poor quality of incoming parts often leads to corrections and re-manufacturing. The number of defective products during inspection tends to increase... ➡ Our company conducts a thorough inspection of all procured parts in our own precision inspection room before delivery. We address defects in advance, which helps reduce your inspection burden. Want to keep costs down? We can accommodate from just one drawing or one part. Even so, it's reasonable. ➡ We achieve prices comparable to processing shops. Simply send us your drawings in PDF format, and try our free quotation service.
Analytical methods essential for the processes and quality control in semiconductor manufacturing.
- Wafer
- Semiconductor inspection/test equipment
- Semiconductors and ICs
Process analyzer / Online analyzer for continuous monitoring of hydrogen peroxide concentration in the CMT process!
- Analytical Equipment and Devices
- Semiconductor inspection/test equipment
- Wafer
Introducing an AI visual inspection system at a low cost! Automatically detects misalignment in printed materials.
- Visual Inspection Equipment
- Semiconductor inspection/test equipment
- Inspection fixture
Significant cost reduction for AI appearance inspection systems! Start distortion inspection immediately.
- Visual Inspection Equipment
- Semiconductor inspection/test equipment
- Inspection fixture
Reduce food shortages with AI! An appearance inspection starter set that can be used immediately after installation.
- Visual Inspection Equipment
- Semiconductor inspection/test equipment
- Inspection fixture
Significant cost reduction for AI appearance inspection systems! Easy detection of pattern anomalies.
- Visual Inspection Equipment
- Semiconductor inspection/test equipment
- Inspection fixture
Significant cost reduction for AI appearance inspection systems! A starter set that can be used immediately after purchase.
- Visual Inspection Equipment
- Semiconductor inspection/test equipment
- Inspection fixture
Introducing an AI visual inspection system at a low cost! Early detection of foreign matter contamination.
- Visual Inspection Equipment
- Semiconductor inspection/test equipment
- Inspection fixture
Significant cost reduction for AI appearance inspection systems! Ready-to-use starter set.
- Visual Inspection Equipment
- Semiconductor inspection/test equipment
- Inspection fixture
High-precision detection of defects in semiconductor wafers. Contributes to improved production efficiency.
- Monochrome camera
- Color camera
- Semiconductor inspection/test equipment
Combining display devices with cover panels and films! Contributes to the enhancement of functionality and design.
- Bonding Equipment
- Processing Contract