List of Heating equipment/furnace products
- classification：Heating equipment/furnace
316～360 item / All 4742 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
No more need to lift heavy one-gallon cans! Enjoy comfortable liquid transfer in the central kitchen.
- Other Pumps
Decision to exhibit at the 1st Chubu Food Industry Creation Exhibition '26!
We will be exhibiting at the "1st Chubu Food Industry Creation Exhibition '26" to be held at Port Messe Nagoya from November 4 (Wednesday) to November 6 (Friday), 2026. As a new addition to our lineup, we will showcase the "Cordless Sanitary Handy Pump," which is a product we started selling in April last year, alongside our "Compact Sanitary Handy Pump Model MHS." - Cordless! Portable anywhere! Easy to use! Simple cleaning! It is compatible with standard 18L cans and BIB (Bag-in-Box) and features a structure that allows for easy disassembly and cleaning. We would like to invite you to visit us at this opportunity. - Venue: Port Messe Nagoya - Our exhibition booth: Hall 1 "C-66"
Introduction of case studies for the infrared heater type aluminum continuous melting furnace "IRM".
- Industrial Furnace
The establishment of a system to prepare for any potential abnormalities has also contributed to risk management on-site!
- Industrial Furnace
The IC temperature control allows for settings between 30°C and 45°C! Equipped with five safety devices, it is a versatile heating and warming heater that can be used with peace of mind.
- Other heaters
This is the comprehensive catalog for the microporous high-performance insulation material "Silsame."
- Industrial Furnace
- Other energy equipment
- Electric furnace
ThermoTech 2026 Exhibition | Real-time comparison of energy-saving effects of high-performance insulation material "Siltharm" using an electric furnace.
Silsarm Japan will exhibit at "Thermotech 2026," which will be held at Tokyo Big Sight from September 9 (Wednesday) to September 11 (Friday), 2026. At the venue, we will showcase an electric furnace using high-performance insulation material "Silsarm" alongside a standard insulated electric furnace, demonstrating the differences in surface temperature and cumulative power consumption in real-time. In preliminary tests, we have confirmed a reduction in power consumption of over 20% and a clear decrease in surface temperature in the Siltherm furnace. On the day of the event, we will also use thermography to visually demonstrate the differences in insulation performance. ■ Event Dates: September 9 (Wednesday) to September 11 (Friday), 2026 ■ Venue: Tokyo Big Sight, South Hall ■ Booth: Hall S2 P012 We invite you to visit our booth.
Tabletop small-sized experimental furnace - space-saving with a maximum operating temperature of 2000℃! We also manufacture metal furnaces for reducing atmospheres.
- Heating device
- Electric furnace
- Annealing furnace
【MiniLab】 Evaporation/Sputtering Dual Chamber System
Two thin film experimental devices are connected by a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected via the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB evaporation: 7cc crucible x 6 - Resistance heating evaporation x 2 - Organic evaporation limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron cathode x 4 for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma etching stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique "soft etching" technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)
Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace
- Heating device
- Annealing furnace
- Electric furnace
☆★☆ Spatter and Vapor Deposition Source Combined Film Formation Device 【nanoPVD-ST15A】 ☆★☆
Sputter Cathode and Co-evaporation Source Mixed Thin Film Experimental Device. Metal deposition, organic deposition, and sputter cathode are installed in a compact frame. A resistance heating evaporation source (for metal deposition), an organic evaporation source (for organic materials), and magnetron sputtering (for metals and insulating materials) are installed in the chamber, allowing for various thin film experimental setups within a single chamber. ◉ Three combinations available: 1. Sputter Cathode + Resistance Heating Evaporation Source x2 2. Sputter Cathode + Organic Evaporation Source x2 3. Sputter Cathode + Resistance Heating Source x1 + Organic Evaporation Source x1 (*DC sputtering only) 【Specifications】 ◉ Compatible substrates: up to Φ4 inches ◉ Sputtering: 2" cathode x up to 3 sources ◉ Vacuum deposition: Resistance heating evaporation (up to 2), organic evaporation (up to 4) ◉ 7" touch panel operation with PLC automatic process control ◉ APC automatic pressure control ◉ 1 line of Ar gas (standard) + expandable with N2, O2 ◉ Connects to a Windows PC via USB for recipe creation and storage. Data logging on PC ◉ Various other options available ◉ Easy operation with a 7" touch panel and PLC automatic process control
Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace
- Heating device
- Annealing furnace
- Electric furnace
【MiniLab】 Evaporation/Sputtering Dual Chamber System
Two thin film experimental devices are connected by a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected via the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB evaporation: 7cc crucible x 6 - Resistance heating evaporation x 2 - Organic evaporation limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron cathode x 4 for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma etching stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique "soft etching" technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)
Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace
- Heating device
■□【PyroMini】□■ Compact High-Performance Infrared Temperature Sensor
High-performance touch panel converter for easy setup, data logging, and data storage on microSD card. The PM2.2 model can also measure glossy metal surfaces. 【Overview】 With a highly visible high-brightness touch panel display, parameters such as temperature range, emissivity, and sampling rate can be intuitively operated and set. Long-term data storage and management are possible with a microSD card. (*An option for a converter without a display is also available.) The compact sensor head, measuring φ18mm x 45mm, allows for temperature measurement in tight spaces. It employs sensors and cables with excellent noise resistance, making it suitable for integration into moving equipment such as robotic arms. The PM2.2 model uses a short wavelength of 2.2um, supporting high temperatures (Max 2000℃) and measurements of glossy metal material surfaces. 【Features】 ◎ Wide range: -20 to 1000℃ (PM), 100 to 2000℃ (PM2.2) ◎ Excellent basic performance: Accuracy ±1%, reproducibility ±0.5%, 240msec fast response ◎ Measurement wavelength range: 8 to 14μm (PM), 2.0 to 2.2μm (PM2.2) ◎ Compact Φ18mm x 45mm
6 to 8 inch ultra-high temperature wafer annealing equipment, a high-performance machine that widely supports various purposes from research and development to small-scale production.
- Annealing furnace
- Heating device
- Electric furnace
【MiniLab】 Evaporation/Sputtering Dual Chamber System
Two thin film experimental devices are connected by a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected via the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB evaporation: 7cc crucible x 6 - Resistance heating evaporation x 2 - Organic evaporation limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron cathode x 4 for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma etching stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique "soft etching" technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)
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[Presentation of Materials] Explaining the Role of Owners' Engineers in Leading SMR Development to Success
- Industrial Furnace
Rapid heating up to 350℃! Since it is transparent, you can check the condition of the heated object through the heater.
- Food Processing Equipment
- Industrial Furnace
- Heating device
Products used in high-temperature environments! Heat-resistant steel canning and welding processing!
- Industrial Furnace
Separable junction. High inverter efficiency of over 97% at all frequencies.
- Electric furnace
- Power Supplies
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We will introduce the main components and key elements of the high-frequency induction heating device!
- Heating device
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We are introducing high-frequency dielectric heating, which allows for easy temperature control, in our company column!
- Heating device
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The generation of toxic gas and the surrounding environment do not become high temperature, creating a good working environment! We have many abundant application examples to introduce.
- Heating device
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About the expanding use of induction heating! We will provide detailed introductions by field.
- Heating device
It is possible to adopt various temperature control methods! The heating coil during heating can be freely raised and lowered, allowing for flexible temperature distribution.
- Heating device
The heating coil in operation allows for adjustable height and flexible temperature distribution! Data import to other devices is possible.
- Heating device
By utilizing the characteristics of each heating method, it is possible to use them according to thick meat products and thin skin products!
- Other heaters
Tablet handling and high-frequency heating automation equipment! Lineup including 3KW devices.
- Other heaters
Introducing the fully automatic high-frequency preheater from Aimex Corporation!
- Other heaters
Essential for food sample production! Can be arranged vertically or horizontally for heating.
- Other heaters
No need for water cooling cables, making maintenance a breeze! Can be integrated with the furnace body.
- Heating device
Providing high-frequency devices suitable for our customers! The culmination of manufacturing experience and wisdom is our asset!
- Heating device
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I will briefly explain the differences between induction heating and dielectric heating! Please take a moment to read it.
- Heating device
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We will provide a detailed introduction to what the high-frequency output is based on!
- Heating device
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We will provide a detailed introduction to high-frequency induction heating, which has various features such as easy temperature control and high reproducibility!
- Heating device
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The principle is the same as that of an induction cooker (IH heater) and microwave! High-frequency heating using power in the radio wave range (3kHz to 3GHz).
- Heating device
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The amount of heat generated changes depending on the electrical properties of the material (such as resistance)! Here, we introduce the heating objects for induction heating and dielectric heating.
- Heating device
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Automotive electronic components - Shortening molding cycles and improving insulation and durability! Introducing the application fields of dielectric heating.
- Heating device
Flexible arrangement of the heating section (coil section) is possible! Supports both atmospheric heating devices and ambient heating with a single power supply for two furnaces.
- Heating device
Easy one-touch clamp for replacing heating coils! Flexible arrangement of the heating section (coil section) is possible.
- Heating device
Ideal for molding machine parts with SMC/BMC and for molding tableware with melamine resin!
- Other heaters
Introducing our high-frequency preheater equipped with a robotic hand!
- Other heaters
Introducing the dedicated high-frequency preheater from Aimex Corporation!
- Other heaters
The cost of spare parts is significantly different! It's a space-saving device with flexible placement.
- Heating device