Polymer Materialsの製品一覧

Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

• Other conveying machines

Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.

• Other safety and hygiene products

Spherical cellulose particles made from wood pulp! They are biodegradable not only in soil but also in seawater, making them suitable as an alternative material to plastic micro-particles!

• Other polymer materials
• Organic Natural Materials

This is the exhibition material for the Automotive Exhibition 2023 Fall.

• Composite Materials

Hazy (high turbidity) luminaire for electrical insulation applications.

• plastic
• Processing Contract

High transparency lumira for applications such as labels and OHP.

• plastic
• Processing Contract

Standard type luminaire for a wide range of industrial applications.

• plastic
• Processing Contract

Adhesiveness, flexibility, hardness! Usable for laminate adhesives and surface coatings, etc.

• Plastic utensils and containers
• Other polymer materials

The deformation and fracture of plastic washers, gaskets, etc., due to localized compressive stress can be estimated using a TMA and stress-strain measurement device.

• Contract Analysis
• plastic
• Other polymer materials

A new sliding polyacetal that exhibits high sliding properties and wear resistance.

• Engineering Plastics
• plastic
• Composite Materials

Simultaneous processing of multiple materials on a single worksheet for smartphones, automotive, and wearable fields.

• Printed Circuit Board
• Engineering Plastics
• Processing Contract

Simultaneous punching of polyimide films with adhesive, varying in size and thickness.

• Printed Circuit Board
• Engineering Plastics
• Processing Contract

Numerous processing achievements of cushioning materials for smartphone screens, speakers, camera modules, etc.

• Printed Circuit Board
• Processing Contract
• plastic

VHB tape that achieves bonding and sealing, with tabbed processing for improved workability.

• Other electronic parts
• Processing Contract
• plastic

For use in smartphones, automotive, and wearable fields, such as reinforcement plates and for conductive, shielding, and heat dissipation applications.

• Printed Circuit Board
• Engineering Plastics
• Processing Contract

Curved and uneven-shaped automotive panels, bonded with touch centers and OCA, etc.

• Engineering Plastics
• Processing Contract
• Other electronic parts

Silicone glass laminate with excellent high-frequency characteristics and arc resistance.

• plastic

Consistent support from polyimide cutting to vacuum temporary bonding and complete curing for FPC.

• Processing Contract
• Other electronic parts
• plastic

Bonding processing of optical materials such as OCA with substrates like plastic and glass.

• Engineering Plastics
• Processing Contract
• Other electronic parts

Agar-epoxy laminate (equivalent to EL-GEH) with excellent compressive creep characteristics and chemical resistance.

• plastic

Excellent dimensional stability and high-temperature strength retention - Gal epoxy laminate (equivalent to EL-GEH)

• plastic

Electromagnetic wave shielding measures: from cutting sheets and films to laminating processes.

• Printed Circuit Board
• Engineering Plastics
• Processing Contract

Conductive bonding film + SUS material allows external extraction of FPC's GND.

• Other electronic parts
• Processing Contract
• Other polymer materials

Tape application for jig use - Router processing of glass epoxy with minimized misalignment.

• Other electronic parts
• Processing Contract
• plastic

Electromagnetic wave shielding film processed products for FPC in electronic devices pursuing lightness, compactness, and brevity.

• Other electronic parts
• Processing Contract
• Other polymer materials

This is a flexible epoxy resin of a two-component mixed type with thermal conductivity. It has a thermal conductivity of 1.1 W/mK, flame retardancy equivalent to V-0, and is characterized by crack res...

• Other polymer materials
• Other electronic parts

Low viscosity high thermal conductivity epoxy resin. It is ideal for potting electrical and electronic components that require heat dissipation.

• Other polymer materials
• Other consumables

It is a fast-curing, low-viscosity epoxy resin with high thermal conductivity. Please use it for heat dissipation insulation sealing of electronic devices such as motors, coils, and capacitors.

• Other polymer materials
• Other consumables

This is an epoxy resin recommended for heat dissipation and insulation sealing of motors, coils, capacitors, and more. It offers good workability due to its short curing time and low viscosity.

• Other polymer materials
• Other consumables

Metal-based fillers are dispersed and blended into epoxy resin to achieve high thermal conductivity. This formulation aims to balance high thermal conductivity with usability.

• Other polymer materials
• Other consumables

This is a low-viscosity general-purpose potting resin equivalent to flame retardant UL94 V-0, environmentally friendly. It can cure at room temperature through amine curing.

• Other polymer materials
• Other consumables

It is a two-component epoxy resin that cures at room temperature, has high bending strength (high strength), and low viscosity.

• Other polymer materials
• Other consumables

The general-purpose potting resin is endowed with high thixotropy and low elasticity. Due to the anhydride curing, it is characterized by a long usable time after mixing the two components (approximat...

• Other polymer materials
• Other consumables

General-purpose potting resin with flame retardancy (equivalent to UL94 V-0) and thermal conductivity (1.0 W/mK). It is a high-strength, crack-resistant epoxy resin.

• Other polymer materials
• Other consumables

It is a low viscosity, high strength general-purpose potting resin. Due to the anhydride curing, it is characterized by a long usable time after mixing the two components (approximately 6 to 8 hours).

• Other polymer materials
• Other consumables

This is a general-purpose epoxy potting resin. It is flame-retardant equivalent to V-0 and has a long usable time of 6 to 8 hours after mixing the two components, making it easy to use.

• Other polymer materials
• Other consumables

ANSI Grade G-11 certified heat-resistant class H glass epoxy laminate.

• plastic

Using tape and tabbed separators for temporary adhesion to shorten the process.

• Other electronic parts
• Processing Contract
• plastic

Adopted for the manufacturing of products that support the IT industry, such as insulating plates and machine parts.

• plastic

This is a rigid PVC plate that combines excellent processability and flame retardancy (equivalent to UL-94 V-0), with appearance characteristics free of interference stripes.

• Other polymer materials

We are currently offering a free sample of your preferred variety and thickness in the specified size! Try our circularly recycled acrylic sheet "Realight(R)"!

• plastic

This is a plate made with over 60% recycled materials, primarily recycled PET bottles.

• Other polymer materials

Flame-retardant glass epoxy laminate (equivalent to EL-GEF, UL-94V-0 certified)

• plastic

Two-component epoxy adhesive. Curing time is shortened, and it can cure in 6 hours at room temperature. Please use it as an adhesive or sealant.

• glue
• Other polymer materials
• Other consumables

Two-component epoxy adhesive. Cures at room temperature. This type has enhanced adhesive strength. It can be used not only as an adhesive but also as a sealant.

• glue
• Other polymer materials
• Other consumables

We offer one-component heat-curing types, two-component room temperature curing types, and anaerobic curing types. Samples are also available.

• glue
• Other polymer materials
• Other electronic parts