List of Wafer processing/polishing equipment products
- classification:Wafer processing/polishing equipment
46~90 item / All 1031 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
Explanation of specialized terms in grinding and polishing.
- Wafer processing/polishing equipment
Achieving high-quality polishing that preserves the edge through automation.
- Wafer processing/polishing equipment
We will exhibit at the SURTECH 2025 trade show.
We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/
Achieving high-quality polishing that preserves edges through mechanization.
- Wafer processing/polishing equipment
We will exhibit at the SURTECH 2025 trade show.
We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/
Achieving high-quality polishing that retains the edge through mechanization.
- Wafer processing/polishing equipment
We will exhibit at the SURTECH 2025 trade show.
We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/
Achieving high-quality polishing that preserves edges through mechanization.
- Wafer processing/polishing equipment
We will exhibit at the SURTECH 2025 trade show.
We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/
Achieving high-quality polishing that preserves the edge through mechanization.
- Wafer processing/polishing equipment
We will exhibit at the SURTECH 2025 trade show.
We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/
Wide range of support from surface-treated steel plates to heavy processing! Combinations of polishing brushes, polishing wheels, vertical brushes, and wire brushes are available for selection.
- Wafer processing/polishing equipment
- Other abrasives
- Other surface treatment equipment
For those troubled by drill runout and cutting edge damage! Achieve improved processing accuracy and extended tool life with flat grinding methods.
- Wafer processing/polishing equipment
The adoption of a unique blade tip positioner and an adjustable collet holder allows for quick and accurate visual drill setup!
- Wafer processing/polishing equipment
For those troubled by drill runout and cutting edge damage! Achieve improved processing accuracy and extended tool life with flat surface grinding methods.
- Wafer processing/polishing equipment
Instead of simply comparing drill grinding machines, determine "how far you want to rebuild tools in-house!"
- Wafer processing/polishing equipment
Explanation of specialized terms in grinding and polishing.
- Wafer processing/polishing equipment
- Grindstone
Achieving a size and low price that large companies cannot offer. With a compact design that is easy to introduce into laboratories, customization to specifications that match wafers and special subst...
- Wafer
- lens
- Wafer processing/polishing equipment
"Unseen particles" undermine processing quality. What are the data-driven solutions that successfully achieve precise filtration of brittle materials?
- Grinding Machine
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
An innovative magnetic levitation centrifugal pump that does not use bearings with a lifespan or wear-prone seals!
- Other pumps
- CMP Equipment
- Wafer processing/polishing equipment
Better pump for Better Yields !
- Wafer processing/polishing equipment
- Special Pump
[Must-see for the semiconductor industry] Check chips more accurately! Inspection possible without damaging integrated circuits using high-precision polishing technology!
- Wafer processing/polishing equipment
We would like to introduce our main products and achievements!
- Wafer processing/polishing equipment
High adhesion to prevent water infiltration! We offer two types of protective tape for back grinding processes: UV type and Non-UV type!
- Non-ferrous metals
- Wafer processing/polishing equipment
- others
Uniform stretching and high expandability! We have prepared tape for UV-type dicing processes!
- Non-ferrous metals
- Wafer processing/polishing equipment
- others