List of Wafer processing/polishing equipment products

  • classification:Wafer processing/polishing equipment

46~90 item / All 1031 items

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It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...

  • Sensors

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We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!

  • Other semiconductors
  • Processing Contract
  • Wafer

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Explanation of specialized terms in grinding and polishing.

  • Wafer processing/polishing equipment

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Achieving high-quality polishing that preserves the edge through automation.

  • Wafer processing/polishing equipment

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Surtech出展_イプロス500px.jpg

We will exhibit at the SURTECH 2025 trade show.

We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/

Achieving high-quality polishing that preserves edges through mechanization.

  • Wafer processing/polishing equipment

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Surtech出展_イプロス500px.jpg

We will exhibit at the SURTECH 2025 trade show.

We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/

Achieving high-quality polishing that retains the edge through mechanization.

  • Wafer processing/polishing equipment

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Surtech出展_イプロス500px.jpg

We will exhibit at the SURTECH 2025 trade show.

We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/

Achieving high-quality polishing that preserves edges through mechanization.

  • Wafer processing/polishing equipment

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Surtech出展_イプロス500px.jpg

We will exhibit at the SURTECH 2025 trade show.

We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/

Achieving high-quality polishing that preserves the edge through mechanization.

  • Wafer processing/polishing equipment

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Surtech出展_イプロス500px.jpg

We will exhibit at the SURTECH 2025 trade show.

We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/

Wide range of support from surface-treated steel plates to heavy processing! Combinations of polishing brushes, polishing wheels, vertical brushes, and wire brushes are available for selection.

  • Wafer processing/polishing equipment
  • Other abrasives
  • Other surface treatment equipment

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For those troubled by drill runout and cutting edge damage! Achieve improved processing accuracy and extended tool life with flat grinding methods.

  • 卓上型ドリル研磨機2.jpg
  • 卓上型ドリル研磨機3.jpg
  • 卓上型ドリル研磨機3.5.jpg
  • 卓上型ドリル研磨機4.jpg
  • 卓上型ドリル研磨機5.jpg
  • 卓上型ドリル研磨機6.jpg
  • Wafer processing/polishing equipment

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The adoption of a unique blade tip positioner and an adjustable collet holder allows for quick and accurate visual drill setup!

  • 卓上型ドリル研磨機2.jpg
  • 卓上型ドリル研磨機3.jpg
  • 卓上型ドリル研磨機3.5.jpg
  • 卓上型ドリル研磨機4.jpg
  • 卓上型ドリル研磨機5.jpg
  • 卓上型ドリル研磨機6.jpg
  • Wafer processing/polishing equipment

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For those troubled by drill runout and cutting edge damage! Achieve improved processing accuracy and extended tool life with flat surface grinding methods.

  • 卓上型ドリル研磨機2.jpg
  • drill_kenmaki2.jpg
  • drill_kenmaki3.jpg
  • drill_kenmaki4.jpg
  • drill_kenmaki7.jpg
  • Wafer processing/polishing equipment

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Instead of simply comparing drill grinding machines, determine "how far you want to rebuild tools in-house!"

  • Wafer processing/polishing equipment

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Explanation of specialized terms in grinding and polishing.

  • Wafer processing/polishing equipment
  • Grindstone

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Achieving a size and low price that large companies cannot offer. With a compact design that is easy to introduce into laboratories, customization to specifications that match wafers and special subst...

  • Wafer
  • lens
  • Wafer processing/polishing equipment

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"Unseen particles" undermine processing quality. What are the data-driven solutions that successfully achieve precise filtration of brittle materials?

  • Grinding Machine
  • Wafer processing/polishing equipment
  • Other semiconductor manufacturing equipment

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An innovative magnetic levitation centrifugal pump that does not use bearings with a lifespan or wear-prone seals!

  • Other pumps
  • CMP Equipment
  • Wafer processing/polishing equipment

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Better pump for Better Yields !

  • Levitronix BPS 4000 2.jpg
  • Wafer processing/polishing equipment
  • Special Pump

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[Must-see for the semiconductor industry] Check chips more accurately! Inspection possible without damaging integrated circuits using high-precision polishing technology!

  • Wafer processing/polishing equipment

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We would like to introduce our main products and achievements!

  • Wafer processing/polishing equipment

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High adhesion to prevent water infiltration! We offer two types of protective tape for back grinding processes: UV type and Non-UV type!

  • Non-ferrous metals
  • Wafer processing/polishing equipment
  • others

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Uniform stretching and high expandability! We have prepared tape for UV-type dicing processes!

  • Non-ferrous metals
  • Wafer processing/polishing equipment
  • others

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A semi-automatic polishing device that ensures stable processing quality without relying on skilled labor!

  • Wafer processing/polishing equipment

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