Last Updated： Aggregation Period:Mar 25, 2026～Apr 21, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Mar 25, 2026～Apr 21, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Mar 25, 2026～Apr 21, 2026
This ranking is based on the number of page views on our site.
31～60 item / All 62 items
Core Ultra × COM Express, a compact high-performance module with 28W.
The NanoCOM-MTU is a COM Express Type 10 (mini size) module offered by AAEON, featuring an Intel Core Ultra (Meteor Lake generation) processor. It is designed to achieve high performance and low power consumption, enabling the construction of compact and flexible embedded systems.
Bringing the power of Core Ultra to the edge with Micro COM-HPC.
HPC-ARHm is a high-performance and AI-capable embedded module equipped with the Intel Core Ultra series (1st/2nd generation), provided by AAEON, in the COM-HPC Mini (R1.2 size) module.
Compact 2D scan engine – Industry-leading barcode scanner manufacturer RIOTEC
RIOTEC's 2D scan engine is a powerful and compact solution that caters to a wide range of applications, including industrial automation, warehouse management, and mobile data collection. It offers advanced technology for quickly and accurately scanning printed labels and barcodes on smartphone screens. The AI3250 2D scan engine is equipped with a hardware decoder, enabling fast and precise barcode reading. This engine is an ideal choice for industrial PDAs, tablets, data collectors, and other mobile devices. With a size of just 21.8 x 15.6 x 11 mm, it is extremely compact and can be easily integrated into limited spaces. Whether for 1D or 2D codes, the AI3250 guarantees reliable performance even in harsh environments. Please feel free to contact RIOTEC, and we will propose the appropriate solution tailored to your company's needs.
DeviceEdge Jetson Series
The NVIDIA Jetson AGX Orin module offers up to 275 TOPS, which is eight times that of the NVIDIA Jetson AGX Xavier 32 GB module. With up to 2048 NVIDIA CUDA cores and 64 Tensor cores built into the NVIDIA Jetson AGX Orin module, it enables server-class AI inference at the edge with low latency. The AIB-MX13/23 is a highly expandable platform that includes an LTE/5G compatible M.2 B-Key x1, a storage-compatible M.2 M-Key x1, and a Wifi/Bluetooth/GPS compatible M.2 E-Key x1. It features an onboard 1 x 10 GbE port for networking, achieving data speeds of up to 100 billion bits per second, which is ten times that of the traditional GbE standard. The AIB-MX13/23 is designed to meet the demands of various embedded applications, particularly in harsh environments such as smart factories, smart cities, and smart transportation, with a wide operating temperature range from -25°C to 80°C and a broad input power range from 9 to 36 VDC.
DeviceEdge Jetson Series
● The NVIDIA Jetson AGX Orin module offers up to 275 TOPS, which is eight times that of the NVIDIA Jetson AGX Xavier 32 GB module. With up to 2048 NVIDIA CUDA cores and 64 Tensor cores built into the NVIDIA Jetson AGX Orin module, it enables server-class AI inference at the edge with low latency. ● It is a highly expandable platform with built-in LTE/5G compatible M.2 B-Key x 1, Wi-Fi/BT compatible M.2 E-Key x 1, and storage compatible M.2 M-Key x 1. The onboard 2 or 4 x PSE ports support 2 or 4 x POE cameras for networking. The 1 x 10 GbE port achieves data speeds of up to 10 times the traditional GbE standard, reaching up to 10 billion bits per second. ● To accommodate various embedded applications, especially in harsh environments such as smart factories, smart cities, and smart transportation, it supports a wide operating temperature range from -25°C to 80°C and a broad input power range from 9 to 36 VDC.
DeviceEdge Jetson Series
● The NVIDIA Jetson Orin NX module achieves up to 100 TOPS, which is more than three times that of the NVIDIA Jetson AGX Xavier module and about five times that of the NVIDIA Jetson Xavier NX module. The NVIDIA Jetson Orin Nano achieves a maximum of 40 TOPS, which is 80 times that of the NVIDIA Jetson NanoTM module. ● It is equipped with 1 x M.2 E-Key for Wi-Fi/BT and 1 x M.2 M-Key for storage. To ensure sufficient data storage for edge computing, it supports external M.2 2242 NVMe with high-speed data transmission capabilities. ● It is adapted to operate in challenging environments for various embedded applications, particularly in smart factories, smart cities, and smart transportation, with an operating temperature range from -25°C to 80°C and a wide input power range from 12 to 24 VDC.
DeviceEdge Jetson Series
● The NVIDIA Jetson AGX Orin module delivers up to 275 TOPS, which is eight times that of the NVIDIA Jetson AGX Xavier 32 GB module. The NVIDIA Jetson AGX Orin 64 GB module, consisting of 2048 NVIDIA CUDA cores and 64 Tensor cores, enables server-class AI inference at the edge with low latency. ● It is a highly expandable system with built-in LTE/5G compatible M.2 B-Key x 1, Wifi/BT compatible M.2 E-Key x 1, and storage compatible M.2 M-Key x 1. The onboard network supports 2 or 4 x PSE ports for 2 or 4 x POE cameras. The 1 x 10 GbE port achieves data speeds of up to 100 billion bits per second, which is ten times that of the conventional GbE standard. ● To accommodate various embedded applications, especially in harsh environments such as smart factories, smart cities, and smart transportation, it supports a wide operating temperature range from -25°C to 70°C and a broad input power range from 9 to 36 VDC.
DeviceEdge Jetson Series
● The NVIDIA Jetson Orin NX module delivers up to 100 TOPS, which is more than three times that of the NVIDIA Jetson AGX Xavier module and about five times that of the NVIDIA Jetson Xavier NX module. The NVIDIA Jetson Orin Nano achieves a maximum of 40 TOPS, which is 80 times that of the NVIDIA Jetson NanoTM module. ● It is equipped with 1 x M.2 E-Key for Wi-Fi/BT and 1 x M.2 M-Key for storage. To ensure sufficient data storage for edge computing, the AIB-MO22/32 and AIB-MN32/42 support external M.2 2242 NVMe with high-speed data transmission capabilities. ● To accommodate various embedded applications, especially in challenging environments such as smart factories, smart cities, and smart transportation, it is adapted to operate in a temperature range of -25°C to 70°C and a wide input power range of 12 to 24 VDC.
Compact high performance for next-generation edge AI.
Aetina offers a variety of small form factor (SFF) modules with a compact architecture, targeting applications that typically require high-performance computing in limited spaces. These SFF modules include mobile PCIe modules (MXM) and M.2 modules, proprietary evaluation expansion kits, and one-stop thermal services. The mobile PCI Express modules (MXM) feature compact commercial off-the-shelf (COTS) solutions. Aetina leverages cutting-edge NVIDIA GPUs and AI ASIC processors to deliver unmatched power efficiency and high-level computing capabilities. This enables the optimization of size, weight, and power (SWaP) for edge AI applications, making them ideal for use in embedded systems that require high performance.
We are a reliable domestic and long-established RFID reader/writer manufacturer. We also provide technical information, customization, and application support.
Takaya is a long-established manufacturer that has been producing highly reliable RFID reader/writers for over a quarter of a century. We will introduce the features of Takaya, which consistently handles everything from the development to the manufacturing and sales of RFID reader/writers. Takaya also has extensive experience in embedding RFID modules in medical devices and electronic equipment. We offer a lineup of embedded RFID reader/writer module products at various frequencies. For manufacturers engaged in equipment design and development, we can propose the optimization of antennas suited to installation conditions, and we also accommodate module customization. In addition to hardware, we can also propose solutions such as management systems for portable items. By introducing partner tag manufacturers, you can purchase the most suitable RFID tags that meet your usage conditions. Our support system is robust, providing various technical information, assistance with demonstration tests, and support for radio usage applications based on the Radio Law. We have a solid framework in place to thoroughly support the design and development of devices incorporating RFID. For detailed information about our embedded module products, please check the official website linked here.
A variety of communication modules that can be selected based on purpose and design method!
This module is a complete execution-type solution that integrates hardware and software. In addition to supporting five types of industrial network masters and twelve types of slaves, it also supports IoT communication (OPC UA, MQTT), achieving all communication environments that are supported in common with the host board and drivers. We can provide a one-stop solution for development and evaluation environments as well as network diagnostic environments. 【Product Lineup】 ■ General-purpose type with mechanical mount ■ Slave-only module with surface mount type advantageous for mass production ■ Slave-only module with DIL-32 socket type ■ Slide-in module compatible with PCI Express, interchangeable in the market *For more details, please refer to the PDF document or feel free to contact us.
Built-in (onboard) antenna type, with a communication distance of up to 30m under standard specifications.
A Class 1 embedded Bluetooth module that wirelessly connects your serial devices via Bluetooth. 【Direct Inquiry Contact】support@intersolutionmarketing.jp Our company proposes solutions to problems with the keyword "connect."
Supports 4 lanes of PCI-Express Gen4 and 5 lanes of PCI-Express Gen3!
The PCOM-B656VGL is a COM-Express Type 6 module equipped with Intel's 11th generation Core processor (Tiger Lake-UP3). It now supports DDR4 memory, USB 3.1 Gen 2, and PCI-Express Gen 4. Additionally, it is possible to utilize extra PCI-Express Gen 3 ports to incorporate high-speed interfaces. 【Features】 ■ Equipped with Intel 11th generation Core processor (Tiger Lake-UP3) ■ Supports up to 2 DDR4-3200 So-DIMMs ■ Supports 4 lanes of PCI-Express Gen 4 and 5 lanes of PCI-Express Gen 3 ■ Equipped with Intel Xe graphics (up to 96 EU) *For more details, please download the PDF or feel free to contact us.
A variety of interfaces including USB4! Capable of installing up to four DDR5-4800MT/s So-DIMMs.
The PCOM-B887 is a COM-HPC client module compatible with Intel Core Ultra200 socket type CPUs, with a size of C (160 x 120mm). It supports PCIe Gen5x16, PCIe Gen5x4, and PCIe Gen4. It features an integrated NPU for AI acceleration. Please feel free to contact us if you have any inquiries. 【Features】 ■ Compatible with Intel Core Ultra200 socket type CPUs ■ Supports PCIe Gen5x16, PCIe Gen5x4, and PCIe Gen4 ■ Can accommodate up to 4 DDR5-4800MT/s So-DIMMs ■ A variety of interfaces including USB4 ■ Integrated NPU for AI acceleration *For more details, please download the PDF or feel free to contact us.
Expandable parallel port! Introducing a product with excellent cost performance that is necessary and sufficient.
The "Ci3-6100H110.W7P32/BT/4G" is an affordable and stable industrial system with a compact and quiet chassis. It is equipped with advanced features such as M.2 and USB 3.0. It has specifications that allow for the utilization of legacy assets such as COM ports, PS/2, and PCI slots. It can accommodate various inspection devices. 【Features】 - Uses parts that ensure stable supply - Equipped with advanced features such as M.2 and USB 3.0 - Specifications that allow for the utilization of legacy assets such as COM ports, PS/2, and PCI slots - Expandable parallel port - Compact and quiet chassis *For more details, please refer to the PDF document or feel free to contact us.
An NXP i.MX6UL-based embedded network module with a compact form factor and Linux software support.
The ConnectCore for i.MX6UL module provides a secure and highly cost-effective network-enabled system-on-module platform that is slightly larger than a postage stamp. Built on the NXP i.MX6UL application processor, this module serves as an intelligent communication engine for today's secure network devices. It seamlessly integrates dual-band Wi-Fi (802.11a/b/g/n/ac) with dual Ethernet and Bluetooth 5, which has obtained radio law certification.
The VIA SOM-3000 module can shorten the time to market for innovative new edge AI devices.
The VIA SOM-3000 module can shorten the time to market for innovative new edge AI devices. This flexible and high-performance module, equipped with the low-power MediaTek Genio 350 quad-core SoC, is ideal for mainstream edge AI and IoT applications that require visual and audio edge processing, such as facial recognition, object identification, motion tracking, OCR, and biometrics. With advanced multimedia features including dual cameras and an HD display, as well as a rich set of I/O interfaces, this module serves as an optimal platform for a wide range of use cases in consumer, commercial, medical, and educational sectors.
The VIA SOM-9X50 module streamlines the development of next-generation edge AI devices.
The VIA SOM-9X50 module streamlines the development of next-generation edge AI devices. This highly integrated module, centered around the powerful and energy-efficient MediaTek Genio 500 octa-core SoC, delivers exceptional performance for a wide range of AI displays, object recognition, and voice applications.
![Embedded MXM Module [MXM-Axe]](https://image.mono.ipros.com/public/product/image/380/2000813670/IPROS19681542167471635987.png?w=280&h=280)
Intel Arc GPU equipped MXM 3.1 Type A
ADLINK's MXM-AXe offers up to 8 hardware ray tracing cores, 128 execution units, 4GB GDDR6, and a maximum TGP of 50W with 8x PCIe Gen4. It provides a 50W TGP and the industry's first full AV1 hardware encoding. This module, which significantly enhances graphics rendering, is key to adapting to next-generation graphics workloads. The MXM-AXe leverages Intel's established graphics ecosystem, which edge developers have enjoyed and trusted for years, including OpenVINO for AI and Intel OneAPI management tools. Rather than a new lineup of GPUs, it is designed to seamlessly transition from integrated graphics to discrete graphics as before. Supporting Intel Deep Link technology, the MXM AXe, when combined with 12th and 13th generation Intel Core processors, achieves even higher performance and power efficiency through automatic workload allocation between integrated GPU, discrete GPU, and CPU.
We have a proven track record of many adoptions in fields such as healthcare, industry, commerce, education, and broadcasting.
The RG23xxA Core series is an embedded module for extending USB 2.0. It extends USB 2.0 over Cat5e cables, fiber optics, and LAN (2310A). Icron Technologies is a leading company in USB extenders, with many applications in fields such as medical, industrial, commercial, education, and broadcasting. For more details, please contact us or refer to the catalog.
![[Development Case] Focus FX950](https://image.mono.ipros.com/public/product/image/cc5/2000720394/IPROS54958986512451567539.jpeg?w=280&h=280)
Display and planning development from inquiries by game device manufacturers! Color and brightness inspection is possible.
We would like to introduce a development case of the "Focus FX950." (The product is sold through Kyoritsu Test System.) This is an embedded module for LED inspection, developed in response to inquiries from display and gaming device manufacturers. It can perform color and brightness inspections and is typically integrated into standard function checkers for functional testing. The Technology Development Department will provide proposals based on the experience and achievements cultivated in FA and PA. 【Areas of Expertise and Key Technologies】 ■ Analog and digital circuit design ■ Signal processing such as filtering and noise reduction ■ Wired communication and wireless transmission circuit design ■ Circuit design for standards (PCIe, USB, etc.) ■ Inspection systems and fixture design ■ Firmware design ■ PC application design *Please feel free to contact our sales department for inquiries. *For more details, please refer to the PDF materials or feel free to contact us.
Desktop system equipped with Intel's Atom Rangeley C2358 processor.
- Adopts Intel Atom C2000 series - Built-in Intel QAT - Equipped with 4 Gigabit Ethernet ports - Uses DDR3L memory - miniPCIexpress socket x 1 - Proposal possible using Intel WiFi/Bluetooth module/antenna with TELEC certification - Supports security using McAfee Embedded Control
It offers 8GB eMMC flash expandable up to 128GB and various interfaces!
The "Zynq UltraScale+ MPSoC (ZU7/ZU5/ZU4) 3U-VPX Plug-in Module iW-RainboW-G30V" is equipped with AMD Xilinx's ZU7/5/4 Zynq UltraScale+ MPSoC. Additionally, it provides up to 504K logic cells and 230K LUTs, along with 64-bit 4GB PS DDR4 RAM with ECC (expandable up to 8GB) and 16-bit 1GB PL DDR4 RAM (expandable up to 2GB). It also offers 8GB eMMC flash (expandable up to 128GB) and various interfaces (Gigabit Ethernet, USB 3.0, USB 2.0, PCIe Gen3, etc.). 【Features (partial)】 ■ 16bit, 1GB PL DDR4 RAM (Upgradable) ■ 8GB eMMC Flash (Upgradable) *For more details, please download the PDF or feel free to contact us.
A fanless embedded system that combines an impressive and smart design with excellent computing capabilities!
The "EC70B-SU" is a fanless embedded system equipped with high-end 6th generation Intel(R) Core(TM) i7/i5/i3 processors, providing excellent processing power in a compact, fanless chassis. It is ideal for smart factories, digital healthcare, and surveillance, where space is limited and computationally intensive solutions are required. 【Features】 - Fanless embedded system with 6th/7th generation Intel(R) Core(TM) - Equipped with 4GB/8GB DDR4 memory - 1xmSATA-mini and 1xM.2/CFast for storage - Supports two mini PCIe for wireless applications - Abundant I/O ports: 2 PoE, 2 Intel GbE, 6 COM, 6 USB 3.0 - 15 years of CPU lifecycle support until Q3 2030 (Based on Intel IOTG Roadmap) *For more details, please download the PDF (English version) or feel free to contact us.
MEDIATEK GENIO700 equipped SMARC module opens new possibilities for embedded systems.
The "SOM-SMARC-Genio700" is a high-performance product equipped with a multimedia Arm processor and AI accelerator capabilities. It features an 8-core CPU and has an APU performance of 4 TOPS, with a guaranteed supply for embedded applications for ten years. The module complies with the SMARC standard and offers various I/O options. It provides users of SMARC modules in fields such as retail, healthcare, smart homes, and digital signage with a new replacement option. 【Features】 ■ Processor - 2x Arm Cortex-A78 @2.2GHz - 6x Arm Cortex-A55 @2.0GHz - Mali G57 MC3 GPU - AI Accelerator: Mediatek APU3.0 equipped Cadence *For more details, please refer to the PDF document or feel free to contact us.
Thinnest size, high-speed reading two-dimensional module engine.
The MDI-4150 is an industry-class compact two-dimensional scanner module engine. Weighing only 5.5g with a decoder included, it is ideal for integration into devices. As a two-dimensional scanner module, it supports the reading of not only barcodes but also two-dimensional codes such as QR codes. With a newly developed decoding algorithm, a maximum 100-frame CMOS sensor, and the latest high-performance CPU, it can read moving objects and 1D/2D codes at high speed, approximately 30ms. Furthermore, it achieves overwhelming reading speed that is independent of the reading angle. It maintains consistent reading response even in cases of hand shake, low light, or bright environments. Additionally, it realizes low power consumption during reading, standby, and low power modes, allowing for various power-saving settings based on configuration. The sharp green LED single-line aiming provides high visibility, safety, and long lifespan. Moreover, the adoption of warm white LED lighting reduces eye strain during reading. 【Features】 ■ High reading speed and low power consumption ■ Highly visible LED aiming and warm white LED lighting *QR Code is a registered trademark of DENSO WAVE INCORPORATED.
DeviceEdge Jetson Series
● The NVIDIA Jetson AGX Orin module offers up to 275 TOPS, which is eight times that of the NVIDIA Jetson AGX Xavier 32 GB module. With up to 2048 NVIDIA CUDA cores and 64 Tensor cores built into the NVIDIA Jetson AGX Orin module, it enables server-class AI inference at low latency on the edge. ● It is a highly expandable system that includes one M.2 B-Key for LTE/5G support, one M.2 M-Key for storage support, and one M.2 E-Key for Wifi/Bluetooth/GPS support. An onboard 1 x 10 GbE port provides network connectivity, achieving data speeds of up to 100 billion bits per second, which is ten times the traditional GbE standard. ● To accommodate various embedded applications, particularly in harsh environments such as smart factories, smart cities, and smart transportation, it supports a wide operating temperature range from -25°C to 70°C and a broad input power range from 9 to 36 VDC.
DeviceEdge Jetson Series
● The NVIDIA Jetson Orin NX module delivers up to 100 TOPS, which is more than three times that of the NVIDIA Jetson AGX Xavier module and about five times that of the NVIDIA Jetson Xavier NX module. The NVIDIA Jetson Orin Nano achieves a maximum of 40 TOPS, which is 80 times that of the NVIDIA Jetson NanoTM module. ● It includes one M.2 E-Key for Wi-Fi/BT and one M.2 M-Key for storage. To ensure sufficient data storage for edge computing, the AIE-KO21/31 and AIE-KN31/41 support external M.2 2242 NVMe with high-speed data transmission capabilities. ● To accommodate various embedded applications, especially in challenging environments such as smart factories, smart cities, and smart transportation, it is adapted to operate in a temperature range of -25°C to 70°C and a wide input power range of 12 to 24 VDC.
Edge AI systems designed for cutting-edge applications in the industrial sector, such as autonomous mobile robots (AMR) and automated guided vehicles (AGV).
The VIA AMOS-9100 is an edge AI system designed for cutting-edge applications in the industry, such as autonomous mobile robots (AMRs) and automated guided vehicles (AGVs). Equipped with a 2.0 GHz NVIDIA Jetson Orin NX processor, it delivers up to 70 TOPS of AI performance. This performance enables efficient processing of data-intensive tasks by leveraging the NVIDIA Deep Learning Accelerator (NVDLA). Additionally, it features advanced video processing capabilities that support 8K video decoding and 4K encoding, making it ideal for real-time analytics and machine vision applications. Furthermore, long-range communication through LoRa wireless connectivity options and dual gigabit Ethernet ports (with optional PoE support) facilitate smooth integration into diverse industrial networks and infrastructures. With these features, the VIA AMOS-9100 provides a reliable and efficient solution for industrial environments that require advanced data processing.
![For drone control: Qualcomm-equipped [LEC-RB5N]](https://image.mono.ipros.com/public/product/image/323835/IPROS260656643881840936.png?w=280&h=280)
Qualcomm QRB5165 Series Octa-Core SoC Equipped SMARC Short Size Module
In the drone industry, flight control systems require real-time capabilities, high processing power, and safety and reliability. In particular, to achieve functions such as stability during flight, accurate positioning, and obstacle avoidance, high-performance processors and robust systems that support them are essential. The ADLINK SMARC LEC-RB5N module is a Linux microprocessor-based COM. This solution is based on Qualcomm's QRB5165 octa-core CPU, equipped with an integrated NPU, providing up to 15 TOPS of performance to handle demanding AI tasks. It also features a powerful GPU compatible with OpenGL and Vulkan for processing visual data. Additionally, it comes with a wide range of video and display interfaces.
