【MZ1-10ADP】
Robust GPU computing system
The 【MZ1-10ADP】 is a robust GPU computing embedded system equipped with Intel Alder Lake-S / Core-i i/Xeon TDP.
- Company：MiTAC Computing Technology Corporation
- Price：Other
Built-in Modules Product List and Ranking from 30 Manufacturers, Suppliers and Companies | IPROS GMS
Last Updated： Aggregation Period:Aug 12, 2026～Sep 08, 2026
This ranking is based on the number of page views on our site.
Built-in Modules Manufacturer, Suppliers and Company Rankings
Last Updated： Aggregation Period:Aug 12, 2026～Sep 08, 2026
This ranking is based on the number of page views on our site.
- ADLINKジャパン 東京本社 Tokyo//Industrial Electrical Equipment
- ミカサ商事 MIKASA SHOJI CO., LTD. Osaka//Trading company/Wholesale
- Kyoritsu Electric Corporation Shizuoka//Industrial Electrical Equipment
- 4 ポートウェルジャパン Tokyo//Industrial Electrical Equipment
- 5 富士ソフト インダストリービジネス事業部 Kanagawa//software
Built-in Modules Product ranking
Last Updated： Aggregation Period:Aug 12, 2026～Sep 08, 2026
This ranking is based on the number of page views on our site.
- [Development Case] Focus FX950 Kyoritsu Electric Corporation
- BOXER AI Series BOXER-8652AI ミカサ商事 MIKASA SHOJI CO., LTD.
- Blackwell equipped with 【EGX-MXM-BW5000】 ADLINKジャパン 東京本社
- 4 NXP i.MX95 series equipped OSM【OSM-IMX95】 ADLINKジャパン 東京本社
- 5 VIA AMOS-9100 VIA Technologies Japan
Built-in Modules Product List
31～60 item / All 74 items
Displayed results
COM Express Type 10 NANOCOM-MTU
Core Ultra × COM Express, a compact high-performance module with 28W.
The NanoCOM-MTU is a COM Express Type 10 (mini size) module offered by AAEON, featuring an Intel Core Ultra (Meteor Lake generation) processor. It is designed to achieve high performance and low power consumption, enabling the construction of compact and flexible embedded systems.
- Company：ミカサ商事 MIKASA SHOJI CO., LTD.
- Price：Other
COM-HPC HPC-ARHm
Bringing the power of Core Ultra to the edge with Micro COM-HPC.
HPC-ARHm is a high-performance and AI-capable embedded module equipped with the Intel Core Ultra series (1st/2nd generation), provided by AAEON, in the COM-HPC Mini (R1.2 size) module.
- Company：ミカサ商事 MIKASA SHOJI CO., LTD.
- Price：Other
Embedded module
Compact 2D scan engine – Industry-leading barcode scanner manufacturer RIOTEC
RIOTEC's 2D scan engine is a powerful and compact solution that caters to a wide range of applications, including industrial automation, warehouse management, and mobile data collection. It offers advanced technology for quickly and accurately scanning printed labels and barcodes on smartphone screens. The AI3250 2D scan engine is equipped with a hardware decoder, enabling fast and precise barcode reading. This engine is an ideal choice for industrial PDAs, tablets, data collectors, and other mobile devices. With a size of just 21.8 x 15.6 x 11 mm, it is extremely compact and can be easily integrated into limited spaces. Whether for 1D or 2D codes, the AI3250 guarantees reliable performance even in harsh environments. Please feel free to contact RIOTEC, and we will propose the appropriate solution tailored to your company's needs.
- Company：RIOTEC CO., LTD.
- Price：Other
AIB-MX13/23
DeviceEdge Jetson Series
The NVIDIA Jetson AGX Orin module offers up to 275 TOPS, which is eight times that of the NVIDIA Jetson AGX Xavier 32 GB module. With up to 2048 NVIDIA CUDA cores and 64 Tensor cores built into the NVIDIA Jetson AGX Orin module, it enables server-class AI inference at the edge with low latency. The AIB-MX13/23 is a highly expandable platform that includes an LTE/5G compatible M.2 B-Key x1, a storage-compatible M.2 M-Key x1, and a Wifi/Bluetooth/GPS compatible M.2 E-Key x1. It features an onboard 1 x 10 GbE port for networking, achieving data speeds of up to 100 billion bits per second, which is ten times that of the traditional GbE standard. The AIB-MX13/23 is designed to meet the demands of various embedded applications, particularly in harsh environments such as smart factories, smart cities, and smart transportation, with a wide operating temperature range from -25°C to 80°C and a broad input power range from 9 to 36 VDC.
- Company：Aetina Japan Aetina Japan
- Price：Other
AIB-MX11/12/21/22
DeviceEdge Jetson Series
● The NVIDIA Jetson AGX Orin module offers up to 275 TOPS, which is eight times that of the NVIDIA Jetson AGX Xavier 32 GB module. With up to 2048 NVIDIA CUDA cores and 64 Tensor cores built into the NVIDIA Jetson AGX Orin module, it enables server-class AI inference at the edge with low latency. ● It is a highly expandable platform with built-in LTE/5G compatible M.2 B-Key x 1, Wi-Fi/BT compatible M.2 E-Key x 1, and storage compatible M.2 M-Key x 1. The onboard 2 or 4 x PSE ports support 2 or 4 x POE cameras for networking. The 1 x 10 GbE port achieves data speeds of up to 10 times the traditional GbE standard, reaching up to 10 billion bits per second. ● To accommodate various embedded applications, especially in harsh environments such as smart factories, smart cities, and smart transportation, it supports a wide operating temperature range from -25°C to 80°C and a broad input power range from 9 to 36 VDC.
- Company：Aetina Japan Aetina Japan
- Price：Other
AIB-SO21/31 | AIB-SN31/41
DeviceEdge Jetson Series
● The NVIDIA Jetson Orin NX module achieves up to 100 TOPS, which is more than three times that of the NVIDIA Jetson AGX Xavier module and about five times that of the NVIDIA Jetson Xavier NX module. The NVIDIA Jetson Orin Nano achieves a maximum of 40 TOPS, which is 80 times that of the NVIDIA Jetson NanoTM module. ● It is equipped with 1 x M.2 E-Key for Wi-Fi/BT and 1 x M.2 M-Key for storage. To ensure sufficient data storage for edge computing, it supports external M.2 2242 NVMe with high-speed data transmission capabilities. ● It is adapted to operate in challenging environments for various embedded applications, particularly in smart factories, smart cities, and smart transportation, with an operating temperature range from -25°C to 80°C and a wide input power range from 12 to 24 VDC.
- Company：Aetina Japan Aetina Japan
- Price：Other
AIE-KX11/12/21/22
DeviceEdge Jetson Series
● The NVIDIA Jetson AGX Orin module delivers up to 275 TOPS, which is eight times that of the NVIDIA Jetson AGX Xavier 32 GB module. The NVIDIA Jetson AGX Orin 64 GB module, consisting of 2048 NVIDIA CUDA cores and 64 Tensor cores, enables server-class AI inference at the edge with low latency. ● It is a highly expandable system with built-in LTE/5G compatible M.2 B-Key x 1, Wifi/BT compatible M.2 E-Key x 1, and storage compatible M.2 M-Key x 1. The onboard network supports 2 or 4 x PSE ports for 2 or 4 x POE cameras. The 1 x 10 GbE port achieves data speeds of up to 100 billion bits per second, which is ten times that of the conventional GbE standard. ● To accommodate various embedded applications, especially in harsh environments such as smart factories, smart cities, and smart transportation, it supports a wide operating temperature range from -25°C to 70°C and a broad input power range from 9 to 36 VDC.
- Company：Aetina Japan Aetina Japan
- Price：Other
AIE-KO22/32 | AIE-KN32/42
DeviceEdge Jetson Series
● The NVIDIA Jetson Orin NX module delivers up to 100 TOPS, which is more than three times that of the NVIDIA Jetson AGX Xavier module and about five times that of the NVIDIA Jetson Xavier NX module. The NVIDIA Jetson Orin Nano achieves a maximum of 40 TOPS, which is 80 times that of the NVIDIA Jetson NanoTM module. ● It is equipped with 1 x M.2 E-Key for Wi-Fi/BT and 1 x M.2 M-Key for storage. To ensure sufficient data storage for edge computing, the AIB-MO22/32 and AIB-MN32/42 support external M.2 2242 NVMe with high-speed data transmission capabilities. ● To accommodate various embedded applications, especially in challenging environments such as smart factories, smart cities, and smart transportation, it is adapted to operate in a temperature range of -25°C to 70°C and a wide input power range of 12 to 24 VDC.
- Company：Aetina Japan Aetina Japan
- Price：Other
CoreEdge – MXM AI Module
Compact high performance for next-generation edge AI.
Aetina offers a variety of small form factor (SFF) modules with a compact architecture, targeting applications that typically require high-performance computing in limited spaces. These SFF modules include mobile PCIe modules (MXM) and M.2 modules, proprietary evaluation expansion kits, and one-stop thermal services. The mobile PCI Express modules (MXM) feature compact commercial off-the-shelf (COTS) solutions. Aetina leverages cutting-edge NVIDIA GPUs and AI ASIC processors to deliver unmatched power efficiency and high-level computing capabilities. This enables the optimization of size, weight, and power (SWaP) for edge AI applications, making them ideal for use in embedded systems that require high performance.
- Company：Aetina Japan Aetina Japan
- Price：Other
Reasons why Takaya's RFID is chosen: Embedded module product lineup
We are a reliable domestic and long-established RFID reader/writer manufacturer. We also provide technical information, customization, and application support.
Takaya is a long-established manufacturer that has been producing highly reliable RFID reader/writers for over a quarter of a century. We will introduce the features of Takaya, which consistently handles everything from the development to the manufacturing and sales of RFID reader/writers. Takaya also has extensive experience in embedding RFID modules in medical devices and electronic equipment. We offer a lineup of embedded RFID reader/writer module products at various frequencies. For manufacturers engaged in equipment design and development, we can propose the optimization of antennas suited to installation conditions, and we also accommodate module customization. In addition to hardware, we can also propose solutions such as management systems for portable items. By introducing partner tag manufacturers, you can purchase the most suitable RFID tags that meet your usage conditions. Our support system is robust, providing various technical information, assistance with demonstration tests, and support for radio usage applications based on the Radio Law. We have a solid framework in place to thoroughly support the design and development of devices incorporating RFID. For detailed information about our embedded module products, please check the official website linked here.
- Company：TAKAYA Corporation
- Price：Other
Embedded module
A variety of communication modules that can be selected based on purpose and design method!
This module is a complete execution-type solution that integrates hardware and software. In addition to supporting five types of industrial network masters and twelve types of slaves, it also supports IoT communication (OPC UA, MQTT), achieving all communication environments that are supported in common with the host board and drivers. We can provide a one-stop solution for development and evaluation environments as well as network diagnostic environments. 【Product Lineup】 ■ General-purpose type with mechanical mount ■ Slave-only module with surface mount type advantageous for mass production ■ Slave-only module with DIL-32 socket type ■ Slide-in module compatible with PCI Express, interchangeable in the market *For more details, please refer to the PDF document or feel free to contact us.
- Company：ヒルシャー・ジャパン
- Price：Other
Bluetooth Serial UART Embedded Module
Built-in (onboard) antenna type, with a communication distance of up to 30m under standard specifications.
A Class 1 embedded Bluetooth module that wirelessly connects your serial devices via Bluetooth. 【Direct Inquiry Contact】support@intersolutionmarketing.jp Our company proposes solutions to problems with the keyword "connect."
- Company：インターソリューションマーケティング
- Price：Other
COM-Express Type 6『PCOM-B656VGL』
Supports 4 lanes of PCI-Express Gen4 and 5 lanes of PCI-Express Gen3!
The PCOM-B656VGL is a COM-Express Type 6 module equipped with Intel's 11th generation Core processor (Tiger Lake-UP3). It now supports DDR4 memory, USB 3.1 Gen 2, and PCI-Express Gen 4. Additionally, it is possible to utilize extra PCI-Express Gen 3 ports to incorporate high-speed interfaces. 【Features】 ■ Equipped with Intel 11th generation Core processor (Tiger Lake-UP3) ■ Supports up to 2 DDR4-3200 So-DIMMs ■ Supports 4 lanes of PCI-Express Gen 4 and 5 lanes of PCI-Express Gen 3 ■ Equipped with Intel Xe graphics (up to 96 EU) *For more details, please download the PDF or feel free to contact us.
- Company：ポートウェルジャパン
- Price：Other
COM-HPC client module "PCOM-B887"
A variety of interfaces including USB4! Capable of installing up to four DDR5-4800MT/s So-DIMMs.
The PCOM-B887 is a COM-HPC client module compatible with Intel Core Ultra200 socket type CPUs, with a size of C (160 x 120mm). It supports PCIe Gen5x16, PCIe Gen5x4, and PCIe Gen4. It features an integrated NPU for AI acceleration. Please feel free to contact us if you have any inquiries. 【Features】 ■ Compatible with Intel Core Ultra200 socket type CPUs ■ Supports PCIe Gen5x16, PCIe Gen5x4, and PCIe Gen4 ■ Can accommodate up to 4 DDR5-4800MT/s So-DIMMs ■ A variety of interfaces including USB4 ■ Integrated NPU for AI acceleration *For more details, please download the PDF or feel free to contact us.
- Company：ポートウェルジャパン
- Price：Other
Ci3-6100H110.W7P32/BT/4G
Expandable parallel port! Introducing a product with excellent cost performance that is necessary and sufficient.
The "Ci3-6100H110.W7P32/BT/4G" is an affordable and stable industrial system with a compact and quiet chassis. It is equipped with advanced features such as M.2 and USB 3.0. It has specifications that allow for the utilization of legacy assets such as COM ports, PS/2, and PCI slots. It can accommodate various inspection devices. 【Features】 - Uses parts that ensure stable supply - Equipped with advanced features such as M.2 and USB 3.0 - Specifications that allow for the utilization of legacy assets such as COM ports, PS/2, and PCI slots - Expandable parallel port - Compact and quiet chassis *For more details, please refer to the PDF document or feel free to contact us.
- Company：テクパル
- Price：Other
i.MX6UL Embedded Module "ConnectCore 6UL"
An NXP i.MX6UL-based embedded network module with a compact form factor and Linux software support.
The ConnectCore for i.MX6UL module provides a secure and highly cost-effective network-enabled system-on-module platform that is slightly larger than a postage stamp. Built on the NXP i.MX6UL application processor, this module serves as an intelligent communication engine for today's secure network devices. It seamlessly integrates dual-band Wi-Fi (802.11a/b/g/n/ac) with dual Ethernet and Bluetooth 5, which has obtained radio law certification.
- Company：ディジインターナショナル
- Price：Other
VIA SOM-3000
The VIA SOM-3000 module can shorten the time to market for innovative new edge AI devices.
The VIA SOM-3000 module can shorten the time to market for innovative new edge AI devices. This flexible and high-performance module, equipped with the low-power MediaTek Genio 350 quad-core SoC, is ideal for mainstream edge AI and IoT applications that require visual and audio edge processing, such as facial recognition, object identification, motion tracking, OCR, and biometrics. With advanced multimedia features including dual cameras and an HD display, as well as a rich set of I/O interfaces, this module serves as an optimal platform for a wide range of use cases in consumer, commercial, medical, and educational sectors.
- Company：VIA Technologies Japan
- Price：10,000 yen-100,000 yen
VIA SOM-9X50
The VIA SOM-9X50 module streamlines the development of next-generation edge AI devices.
The VIA SOM-9X50 module streamlines the development of next-generation edge AI devices. This highly integrated module, centered around the powerful and energy-efficient MediaTek Genio 500 octa-core SoC, delivers exceptional performance for a wide range of AI displays, object recognition, and voice applications.
- Company：VIA Technologies Japan
- Price：10,000 yen-100,000 yen
![Embedded MXM Module [MXM-Axe]](https://image.mono.ipros.com/public/product/image/380/2000813670/IPROS19681542167471635987.png?w=280&h=280)
Embedded MXM Module [MXM-Axe]
Intel Arc GPU equipped MXM 3.1 Type A
ADLINK's MXM-AXe offers up to 8 hardware ray tracing cores, 128 execution units, 4GB GDDR6, and a maximum TGP of 50W with 8x PCIe Gen4. It provides a 50W TGP and the industry's first full AV1 hardware encoding. This module, which significantly enhances graphics rendering, is key to adapting to next-generation graphics workloads. The MXM-AXe leverages Intel's established graphics ecosystem, which edge developers have enjoyed and trusted for years, including OpenVINO for AI and Intel OneAPI management tools. Rather than a new lineup of GPUs, it is designed to seamlessly transition from integrated graphics to discrete graphics as before. Supporting Intel Deep Link technology, the MXM AXe, when combined with 12th and 13th generation Intel Core processors, achieves even higher performance and power efficiency through automatic workload allocation between integrated GPU, discrete GPU, and CPU.
- Company：ADLINKジャパン 東京本社
- Price：Other
Blackwell equipped with 【EGX-MXM-BW4000】
NVIDIA RTX PRO 4000 Blackwell equipped embedded MXM GPU module
High-performance AI and graphics for advanced edge systems The EGX-MXM-BW4000 combines powerful AI acceleration and advanced graphics performance in an MXM 3.1 Type B module, achieving up to 1,334 AI TOPS. This product, enhanced with GPU resources and memory bandwidth, is designed for demanding applications in computer vision, industrial AI, medical imaging, and real-time visualization.
- Company：ADLINKジャパン 東京本社
- Price：Other
USB2.0 Extension Embedded Module RG23xxA Core
We have a proven track record of many adoptions in fields such as healthcare, industry, commerce, education, and broadcasting.
The RG23xxA Core series is an embedded module for extending USB 2.0. It extends USB 2.0 over Cat5e cables, fiber optics, and LAN (2310A). Icron Technologies is a leading company in USB extenders, with many applications in fields such as medical, industrial, commercial, education, and broadcasting. For more details, please contact us or refer to the catalog.
- Company：ベイテクノロジーズ
- Price：Other
![[Development Case] Focus FX950](https://image.mono.ipros.com/public/product/image/cc5/2000720394/IPROS54958986512451567539.jpeg?w=280&h=280)
[Development Case] Focus FX950
Display and planning development from inquiries by game device manufacturers! Color and brightness inspection is possible.
We would like to introduce a development case of the "Focus FX950." (The product is sold through Kyoritsu Test System.) This is an embedded module for LED inspection, developed in response to inquiries from display and gaming device manufacturers. It can perform color and brightness inspections and is typically integrated into standard function checkers for functional testing. The Technology Development Department will provide proposals based on the experience and achievements cultivated in FA and PA. 【Areas of Expertise and Key Technologies】 ■ Analog and digital circuit design ■ Signal processing such as filtering and noise reduction ■ Wired communication and wireless transmission circuit design ■ Circuit design for standards (PCIe, USB, etc.) ■ Inspection systems and fixture design ■ Firmware design ■ PC application design *Please feel free to contact our sales department for inquiries. *For more details, please refer to the PDF materials or feel free to contact us.
- Company：Kyoritsu Electric Corporation
- Price：Other
CAD-0231
Desktop system equipped with Intel's Atom Rangeley C2358 processor.
- Adopts Intel Atom C2000 series - Built-in Intel QAT - Equipped with 4 Gigabit Ethernet ports - Uses DDR3L memory - miniPCIexpress socket x 1 - Proposal possible using Intel WiFi/Bluetooth module/antenna with TELEC certification - Supports security using McAfee Embedded Control
- Company：CASO
- Price：10,000 yen-100,000 yen
![Industrial SMARC Module [uCOM-M700/M510]](https://image.mono.ipros.com/public/product/image/382/2001531609/IPROS7646721555083116828.jpg?w=280&h=280)
Industrial SMARC Module [uCOM-M700/M510]
AAEON Industrial SMARC Module equipped with ARM MediaTek Genio 700/510
Features: ● Equipped with ARM MediaTek Genio 700 / 510 ● Onboard LPDDR4 8GB ● HDMI 2.0 x 1, DP 1.4 x 1 ● eDP 2 lanes x 1, MIPI-DSI 4 lanes x 1 ● GbE x 1 ● USB 3.0 + 2.0 x 1, USB 2.0 x 5 ● UART x 4, GPIO x 12, MIPI CSI x 2, TPM 2.0 ● Fan-equipped heatsink, heatsink available separately ● Carrier board available separately
- Company：V-net AAEON
- Price：Other
ZU7/ZU5/ZU4 3U VPX plugin module
It offers 8GB eMMC flash expandable up to 128GB and various interfaces!
The "Zynq UltraScale+ MPSoC (ZU7/ZU5/ZU4) 3U-VPX Plug-in Module iW-RainboW-G30V" is equipped with AMD Xilinx's ZU7/5/4 Zynq UltraScale+ MPSoC. Additionally, it provides up to 504K logic cells and 230K LUTs, along with 64-bit 4GB PS DDR4 RAM with ECC (expandable up to 8GB) and 16-bit 1GB PL DDR4 RAM (expandable up to 2GB). It also offers 8GB eMMC flash (expandable up to 128GB) and various interfaces (Gigabit Ethernet, USB 3.0, USB 2.0, PCIe Gen3, etc.). 【Features (partial)】 ■ 16bit, 1GB PL DDR4 RAM (Upgradable) ■ 8GB eMMC Flash (Upgradable) *For more details, please download the PDF or feel free to contact us.
- Company：富士ソフト インダストリービジネス事業部
- Price：Other
SoMプラットフォーム『SOG72』
高度なAIワークロード、先進のディスプレイ技術、そしてインテリジェントなエッジ処理をサポートします！
『SOG72』は、高度なAI機能、スケーラブルな処理能力、そして高い 電力効率を必要とするエッジコンピューティングアプリケーション およびスマート組み込みシステム向けに設計されたAIoT SoM プラットフォームです。 先進の組み込み開発向けに構築されたこれらのプラットフォームは、 シームレスな接続性、豊富なマルチメディアサポート、そして産業、 リテール製品、スマートホーム、商業環境における柔軟な統合性を 兼ね備えています。 高度なAIワークロード、先進のディスプレイ技術、そしてインテリジェントな エッジ処理をサポートする当製品は、コネクテッドデバイス、組み込みAI システム、そしてAIoT製品設計のための信頼性の高い基盤を提供します。 【機能(一部)】 ■Processer：MediaTek Genio720 ■CPU：2xArm Cortex-A78 2.6GHz、6xArm Cortex-A55 2.0GHz ※詳しくはPDFをダウンロードしていただくか、お気軽にお問い合わせください。
- Company：富士ソフト インダストリービジネス事業部
- Price：Other
Embedded COM System
Excellent modular cooling solutions. Easily adaptable to various processor performance levels and environmental conditions.
• Embedded system equipped with x86 COM Express Type 6 module • Various interfaces such as PCIe, mPCIe, USB, and DisplayPort • Internal interfaces for additional boards to enhance functionality For fieldbus interface or TFT connector • Power supply designed as a plug-in module 18 to 26.4 VDC input • Excellent modular cooling solution. Easily adaptable to various processor performance levels and environmental conditions
- Company：エヌヴェントジャパン エンクロージャー事業部
- Price：Other
Fanless embedded system "EC70B-SU"
A fanless embedded system that combines an impressive and smart design with excellent computing capabilities!
The "EC70B-SU" is a fanless embedded system equipped with high-end 6th generation Intel(R) Core(TM) i7/i5/i3 processors, providing excellent processing power in a compact, fanless chassis. It is ideal for smart factories, digital healthcare, and surveillance, where space is limited and computationally intensive solutions are required. 【Features】 - Fanless embedded system with 6th/7th generation Intel(R) Core(TM) - Equipped with 4GB/8GB DDR4 memory - 1xmSATA-mini and 1xM.2/CFast for storage - Supports two mini PCIe for wireless applications - Abundant I/O ports: 2 PoE, 2 Intel GbE, 6 COM, 6 USB 3.0 - 15 years of CPU lifecycle support until Q3 2030 (Based on Intel IOTG Roadmap) *For more details, please download the PDF (English version) or feel free to contact us.
- Company：ディエフアイ
- Price：Other
