Last Updated： Aggregation Period:Dec 24, 2025～Jan 20, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Dec 24, 2025～Jan 20, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Dec 24, 2025～Jan 20, 2026
This ranking is based on the number of page views on our site.
46～54 item / All 54 items
Desktop system equipped with Intel's Atom Rangeley C2358 processor.
- Adopts Intel Atom C2000 series - Built-in Intel QAT - Equipped with 4 Gigabit Ethernet ports - Uses DDR3L memory - miniPCIexpress socket x 1 - Proposal possible using Intel WiFi/Bluetooth module/antenna with TELEC certification - Supports security using McAfee Embedded Control
It offers 8GB eMMC flash expandable up to 128GB and various interfaces!
The "Zynq UltraScale+ MPSoC (ZU7/ZU5/ZU4) 3U-VPX Plug-in Module iW-RainboW-G30V" is equipped with AMD Xilinx's ZU7/5/4 Zynq UltraScale+ MPSoC. Additionally, it provides up to 504K logic cells and 230K LUTs, along with 64-bit 4GB PS DDR4 RAM with ECC (expandable up to 8GB) and 16-bit 1GB PL DDR4 RAM (expandable up to 2GB). It also offers 8GB eMMC flash (expandable up to 128GB) and various interfaces (Gigabit Ethernet, USB 3.0, USB 2.0, PCIe Gen3, etc.). 【Features (partial)】 ■ 16bit, 1GB PL DDR4 RAM (Upgradable) ■ 8GB eMMC Flash (Upgradable) *For more details, please download the PDF or feel free to contact us.
A fanless embedded system that combines an impressive and smart design with excellent computing capabilities!
The "EC70B-SU" is a fanless embedded system equipped with high-end 6th generation Intel(R) Core(TM) i7/i5/i3 processors, providing excellent processing power in a compact, fanless chassis. It is ideal for smart factories, digital healthcare, and surveillance, where space is limited and computationally intensive solutions are required. 【Features】 - Fanless embedded system with 6th/7th generation Intel(R) Core(TM) - Equipped with 4GB/8GB DDR4 memory - 1xmSATA-mini and 1xM.2/CFast for storage - Supports two mini PCIe for wireless applications - Abundant I/O ports: 2 PoE, 2 Intel GbE, 6 COM, 6 USB 3.0 - 15 years of CPU lifecycle support until Q3 2030 (Based on Intel IOTG Roadmap) *For more details, please download the PDF (English version) or feel free to contact us.
MEDIATEK GENIO700 equipped SMARC module opens new possibilities for embedded systems.
The "SOM-SMARC-Genio700" is a high-performance product equipped with a multimedia Arm processor and AI accelerator capabilities. It features an 8-core CPU and has an APU performance of 4 TOPS, with a guaranteed supply for embedded applications for ten years. The module complies with the SMARC standard and offers various I/O options. It provides users of SMARC modules in fields such as retail, healthcare, smart homes, and digital signage with a new replacement option. 【Features】 ■ Processor - 2x Arm Cortex-A78 @2.2GHz - 6x Arm Cortex-A55 @2.0GHz - Mali G57 MC3 GPU - AI Accelerator: Mediatek APU3.0 equipped Cadence *For more details, please refer to the PDF document or feel free to contact us.
Thinnest size, high-speed reading two-dimensional module engine.
The MDI-4150 is an industry-class compact two-dimensional scanner module engine. Weighing only 5.5g with a decoder included, it is ideal for integration into devices. As a two-dimensional scanner module, it supports the reading of not only barcodes but also two-dimensional codes such as QR codes. With a newly developed decoding algorithm, a maximum 100-frame CMOS sensor, and the latest high-performance CPU, it can read moving objects and 1D/2D codes at high speed, approximately 30ms. Furthermore, it achieves overwhelming reading speed that is independent of the reading angle. It maintains consistent reading response even in cases of hand shake, low light, or bright environments. Additionally, it realizes low power consumption during reading, standby, and low power modes, allowing for various power-saving settings based on configuration. The sharp green LED single-line aiming provides high visibility, safety, and long lifespan. Moreover, the adoption of warm white LED lighting reduces eye strain during reading. 【Features】 ■ High reading speed and low power consumption ■ Highly visible LED aiming and warm white LED lighting *QR Code is a registered trademark of DENSO WAVE INCORPORATED.
DeviceEdge Jetson Series
● The NVIDIA Jetson AGX Orin module offers up to 275 TOPS, which is eight times that of the NVIDIA Jetson AGX Xavier 32 GB module. With up to 2048 NVIDIA CUDA cores and 64 Tensor cores built into the NVIDIA Jetson AGX Orin module, it enables server-class AI inference at low latency on the edge. ● It is a highly expandable system that includes one M.2 B-Key for LTE/5G support, one M.2 M-Key for storage support, and one M.2 E-Key for Wifi/Bluetooth/GPS support. An onboard 1 x 10 GbE port provides network connectivity, achieving data speeds of up to 100 billion bits per second, which is ten times the traditional GbE standard. ● To accommodate various embedded applications, particularly in harsh environments such as smart factories, smart cities, and smart transportation, it supports a wide operating temperature range from -25°C to 70°C and a broad input power range from 9 to 36 VDC.
DeviceEdge Jetson Series
● The NVIDIA Jetson Orin NX module delivers up to 100 TOPS, which is more than three times that of the NVIDIA Jetson AGX Xavier module and about five times that of the NVIDIA Jetson Xavier NX module. The NVIDIA Jetson Orin Nano achieves a maximum of 40 TOPS, which is 80 times that of the NVIDIA Jetson NanoTM module. ● It includes one M.2 E-Key for Wi-Fi/BT and one M.2 M-Key for storage. To ensure sufficient data storage for edge computing, the AIE-KO21/31 and AIE-KN31/41 support external M.2 2242 NVMe with high-speed data transmission capabilities. ● To accommodate various embedded applications, especially in challenging environments such as smart factories, smart cities, and smart transportation, it is adapted to operate in a temperature range of -25°C to 70°C and a wide input power range of 12 to 24 VDC.
Edge AI systems designed for cutting-edge applications in the industrial sector, such as autonomous mobile robots (AMR) and automated guided vehicles (AGV).
The VIA AMOS-9100 is an edge AI system designed for cutting-edge applications in the industry, such as autonomous mobile robots (AMRs) and automated guided vehicles (AGVs). Equipped with a 2.0 GHz NVIDIA Jetson Orin NX processor, it delivers up to 70 TOPS of AI performance. This performance enables efficient processing of data-intensive tasks by leveraging the NVIDIA Deep Learning Accelerator (NVDLA). Additionally, it features advanced video processing capabilities that support 8K video decoding and 4K encoding, making it ideal for real-time analytics and machine vision applications. Furthermore, long-range communication through LoRa wireless connectivity options and dual gigabit Ethernet ports (with optional PoE support) facilitate smooth integration into diverse industrial networks and infrastructures. With these features, the VIA AMOS-9100 provides a reliable and efficient solution for industrial environments that require advanced data processing.
![[July 15th Event] Invitation to the Web Seminar hosted by Rihyo Electro](https://image.mono.ipros.com/public/product/image/873/2000527528/IPROS78782146602228659352.png?w=280&h=280)
Everything you need to know about the FA machine platform! - From Intel CPUs to module products, hypervisors, and AI tools -
Rihyo Electro Co., Ltd. will hold a webinar titled "Everything You Need to Know About Platforms for FA Equipment! - From Intel CPUs to Module Products, Hypervisors, and AI Tools" on Wednesday, July 15, 2020. In this seminar, we will introduce the latest products from Congatec, which are optimal for FA equipment, as well as the latest information on Realtime Hypervisor, Windows 10 IoT Enterprise, Azure IoT Edge certification, and Intel embedded products and AI tools like OpenVINO, incorporating case studies related to FA and manufacturing industries. We invite you to register for this seminar. 【Event Overview】 ■ Date and Time: July 15, 2020 (Wednesday) 16:00 - 17:30 (Entry available 10 minutes before start) ■ Participation Fee: Free <Pre-registration required> ■ Venue: Webinar tool "Cocripo" (https://www.cocripo.co.jp/) ■ Registration Method: Registration can only be done through our company website. *For more details, please refer to the PDF document or feel free to contact us.
