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Built-in Modules Product List and Ranking from 28 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

Built-in Modules Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

  1. ADLINKジャパン 東京本社 Tokyo//Industrial Electrical Equipment
  2. CASO Tokyo//IT/Telecommunications
  3. アスメック Kanagawa//Optical Instruments
  4. 4 オートフォームジャパン Tokyo//software
  5. 4 Aetina Japan Aetina Japan Tokyo//IT/Telecommunications
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Built-in Modules Product ranking

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

  1. NXP i.MX95 series equipped OSM【OSM-IMX95】 ADLINKジャパン 東京本社
  2. CAD-0231 CASO
  3. MX5000B-XA | Embedded GPU Module アスメック
  4. 4 『AutoForm-QuickLinkforNX』 オートフォームジャパン
  5. 4 COM Express Type 10　NANOCOM-MTU ミカサ商事　MIKASA SHOJI CO., LTD.

Built-in Modules Product List

31～45 item / All 54 items

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AIB-MX13/23

AIB-MX13/23

DeviceEdge Jetson Series

The NVIDIA Jetson AGX Orin module offers up to 275 TOPS, which is eight times that of the NVIDIA Jetson AGX Xavier 32 GB module. With up to 2048 NVIDIA CUDA cores and 64 Tensor cores built into the NVIDIA Jetson AGX Orin module, it enables server-class AI inference at the edge with low latency. The AIB-MX13/23 is a highly expandable platform that includes an LTE/5G compatible M.2 B-Key x1, a storage-compatible M.2 M-Key x1, and a Wifi/Bluetooth/GPS compatible M.2 E-Key x1. It features an onboard 1 x 10 GbE port for networking, achieving data speeds of up to 100 billion bits per second, which is ten times that of the traditional GbE standard. The AIB-MX13/23 is designed to meet the demands of various embedded applications, particularly in harsh environments such as smart factories, smart cities, and smart transportation, with a wide operating temperature range from -25°C to 80°C and a broad input power range from 9 to 36 VDC.

  • Industrial PCs

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AIB-MX11/12/21/22

AIB-MX11/12/21/22

DeviceEdge Jetson Series

● The NVIDIA Jetson AGX Orin module offers up to 275 TOPS, which is eight times that of the NVIDIA Jetson AGX Xavier 32 GB module. With up to 2048 NVIDIA CUDA cores and 64 Tensor cores built into the NVIDIA Jetson AGX Orin module, it enables server-class AI inference at the edge with low latency. ● It is a highly expandable platform with built-in LTE/5G compatible M.2 B-Key x 1, Wi-Fi/BT compatible M.2 E-Key x 1, and storage compatible M.2 M-Key x 1. The onboard 2 or 4 x PSE ports support 2 or 4 x POE cameras for networking. The 1 x 10 GbE port achieves data speeds of up to 10 times the traditional GbE standard, reaching up to 10 billion bits per second. ● To accommodate various embedded applications, especially in harsh environments such as smart factories, smart cities, and smart transportation, it supports a wide operating temperature range from -25°C to 80°C and a broad input power range from 9 to 36 VDC.

  • Industrial PCs

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AIE-KX11/12/21/22

AIE-KX11/12/21/22

DeviceEdge Jetson Series

● The NVIDIA Jetson AGX Orin module delivers up to 275 TOPS, which is eight times that of the NVIDIA Jetson AGX Xavier 32 GB module. The NVIDIA Jetson AGX Orin 64 GB module, consisting of 2048 NVIDIA CUDA cores and 64 Tensor cores, enables server-class AI inference at the edge with low latency. ● It is a highly expandable system with built-in LTE/5G compatible M.2 B-Key x 1, Wifi/BT compatible M.2 E-Key x 1, and storage compatible M.2 M-Key x 1. The onboard network supports 2 or 4 x PSE ports for 2 or 4 x POE cameras. The 1 x 10 GbE port achieves data speeds of up to 100 billion bits per second, which is ten times that of the conventional GbE standard. ● To accommodate various embedded applications, especially in harsh environments such as smart factories, smart cities, and smart transportation, it supports a wide operating temperature range from -25°C to 70°C and a broad input power range from 9 to 36 VDC.

  • Industrial PCs

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Reasons why Takaya's RFID is chosen: Embedded module product lineup

Reasons why Takaya's RFID is chosen: Embedded module product lineup

We are a reliable domestic and long-established RFID reader/writer manufacturer. We also provide technical information, customization, and application support.

Takaya is a long-established manufacturer that has been producing highly reliable RFID reader/writers for over a quarter of a century. We will introduce the features of Takaya, which consistently handles everything from the development to the manufacturing and sales of RFID reader/writers. Takaya also has extensive experience in embedding RFID modules in medical devices and electronic equipment. We offer a lineup of embedded RFID reader/writer module products at various frequencies. For manufacturers engaged in equipment design and development, we can propose the optimization of antennas suited to installation conditions, and we also accommodate module customization. In addition to hardware, we can also propose solutions such as management systems for portable items. By introducing partner tag manufacturers, you can purchase the most suitable RFID tags that meet your usage conditions. Our support system is robust, providing various technical information, assistance with demonstration tests, and support for radio usage applications based on the Radio Law. We have a solid framework in place to thoroughly support the design and development of devices incorporating RFID. For detailed information about our embedded module products, please check the official website linked here.

  • IC tag reader/writer

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Embedded module

Embedded module

A variety of communication modules that can be selected based on purpose and design method!

This module is a complete execution-type solution that integrates hardware and software. In addition to supporting five types of industrial network masters and twelve types of slaves, it also supports IoT communication (OPC UA, MQTT), achieving all communication environments that are supported in common with the host board and drivers. We can provide a one-stop solution for development and evaluation environments as well as network diagnostic environments. 【Product Lineup】 ■ General-purpose type with mechanical mount ■ Slave-only module with surface mount type advantageous for mass production ■ Slave-only module with DIL-32 socket type ■ Slide-in module compatible with PCI Express, interchangeable in the market *For more details, please refer to the PDF document or feel free to contact us.

  • Other embedded systems (software and hardware)

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Bluetooth Serial UART Embedded Module

Bluetooth Serial UART Embedded Module

Built-in (onboard) antenna type, with a communication distance of up to 30m under standard specifications.

A Class 1 embedded Bluetooth module that wirelessly connects your serial devices via Bluetooth. 【Direct Inquiry Contact】support@intersolutionmarketing.jp Our company proposes solutions to problems with the keyword "connect."

  • Other electronic parts

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COM-Express Type 6『PCOM-B656VGL』

COM-Express Type 6『PCOM-B656VGL』

Supports 4 lanes of PCI-Express Gen4 and 5 lanes of PCI-Express Gen3!

The PCOM-B656VGL is a COM-Express Type 6 module equipped with Intel's 11th generation Core processor (Tiger Lake-UP3). It now supports DDR4 memory, USB 3.1 Gen 2, and PCI-Express Gen 4. Additionally, it is possible to utilize extra PCI-Express Gen 3 ports to incorporate high-speed interfaces. 【Features】 ■ Equipped with Intel 11th generation Core processor (Tiger Lake-UP3) ■ Supports up to 2 DDR4-3200 So-DIMMs ■ Supports 4 lanes of PCI-Express Gen 4 and 5 lanes of PCI-Express Gen 3 ■ Equipped with Intel Xe graphics (up to 96 EU) *For more details, please download the PDF or feel free to contact us.

  • Other semiconductors

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COM-HPC client module "PCOM-B887"

COM-HPC client module "PCOM-B887"

A variety of interfaces including USB4! Capable of installing up to four DDR5-4800MT/s So-DIMMs.

The PCOM-B887 is a COM-HPC client module compatible with Intel Core Ultra200 socket type CPUs, with a size of C (160 x 120mm). It supports PCIe Gen5x16, PCIe Gen5x4, and PCIe Gen4. It features an integrated NPU for AI acceleration. Please feel free to contact us if you have any inquiries. 【Features】 ■ Compatible with Intel Core Ultra200 socket type CPUs ■ Supports PCIe Gen5x16, PCIe Gen5x4, and PCIe Gen4 ■ Can accommodate up to 4 DDR5-4800MT/s So-DIMMs ■ A variety of interfaces including USB4 ■ Integrated NPU for AI acceleration *For more details, please download the PDF or feel free to contact us.

  • Other semiconductors

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Ci3-6100H110.W7P32/BT/4G

Ci3-6100H110.W7P32/BT/4G

Expandable parallel port! Introducing a product with excellent cost performance that is necessary and sufficient.

The "Ci3-6100H110.W7P32/BT/4G" is an affordable and stable industrial system with a compact and quiet chassis. It is equipped with advanced features such as M.2 and USB 3.0. It has specifications that allow for the utilization of legacy assets such as COM ports, PS/2, and PCI slots. It can accommodate various inspection devices. 【Features】 - Uses parts that ensure stable supply - Equipped with advanced features such as M.2 and USB 3.0 - Specifications that allow for the utilization of legacy assets such as COM ports, PS/2, and PCI slots - Expandable parallel port - Compact and quiet chassis *For more details, please refer to the PDF document or feel free to contact us.

  • Other PCs and OA equipment

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i.MX6UL Embedded Module "ConnectCore 6UL"

i.MX6UL Embedded Module "ConnectCore 6UL"

An NXP i.MX6UL-based embedded network module with a compact form factor and Linux software support.

The ConnectCore for i.MX6UL module provides a secure and highly cost-effective network-enabled system-on-module platform that is slightly larger than a postage stamp. Built on the NXP i.MX6UL application processor, this module serves as an intelligent communication engine for today's secure network devices. It seamlessly integrates dual-band Wi-Fi (802.11a/b/g/n/ac) with dual Ethernet and Bluetooth 5, which has obtained radio law certification.

  • Communications
  • Other electronic parts

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VIA SOM-3000

VIA SOM-3000

The VIA SOM-3000 module can shorten the time to market for innovative new edge AI devices.

The VIA SOM-3000 module can shorten the time to market for innovative new edge AI devices. This flexible and high-performance module, equipped with the low-power MediaTek Genio 350 quad-core SoC, is ideal for mainstream edge AI and IoT applications that require visual and audio edge processing, such as facial recognition, object identification, motion tracking, OCR, and biometrics. With advanced multimedia features including dual cameras and an HD display, as well as a rich set of I/O interfaces, this module serves as an optimal platform for a wide range of use cases in consumer, commercial, medical, and educational sectors.

  • Microcomputer
  • Embedded Board Computers

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VIA SOM-9X50

VIA SOM-9X50

The VIA SOM-9X50 module streamlines the development of next-generation edge AI devices.

The VIA SOM-9X50 module streamlines the development of next-generation edge AI devices. This highly integrated module, centered around the powerful and energy-efficient MediaTek Genio 500 octa-core SoC, delivers exceptional performance for a wide range of AI displays, object recognition, and voice applications.

  • Microcomputer
  • Embedded Board Computers

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Embedded MXM Module [MXM-Axe]

Embedded MXM Module [MXM-Axe]

Intel Arc GPU equipped MXM 3.1 Type A

ADLINK's MXM-AXe offers up to 8 hardware ray tracing cores, 128 execution units, 4GB GDDR6, and a maximum TGP of 50W with 8x PCIe Gen4. It provides a 50W TGP and the industry's first full AV1 hardware encoding. This module, which significantly enhances graphics rendering, is key to adapting to next-generation graphics workloads. The MXM-AXe leverages Intel's established graphics ecosystem, which edge developers have enjoyed and trusted for years, including OpenVINO for AI and Intel OneAPI management tools. Rather than a new lineup of GPUs, it is designed to seamlessly transition from integrated graphics to discrete graphics as before. Supporting Intel Deep Link technology, the MXM AXe, when combined with 12th and 13th generation Intel Core processors, achieves even higher performance and power efficiency through automatic workload allocation between integrated GPU, discrete GPU, and CPU.

  • Embedded Board Computers

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USB2.0 Extension Embedded Module RG23xxA Core

USB2.0 Extension Embedded Module RG23xxA Core

We have a proven track record of many adoptions in fields such as healthcare, industry, commerce, education, and broadcasting.

The RG23xxA Core series is an embedded module for extending USB 2.0. It extends USB 2.0 over Cat5e cables, fiber optics, and LAN (2310A). Icron Technologies is a leading company in USB extenders, with many applications in fields such as medical, industrial, commercial, education, and broadcasting. For more details, please contact us or refer to the catalog.

  • Other Connectors
  • Other PCs and OA equipment
  • Embedded Board Computers

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[Development Case] Focus FX950

[Development Case] Focus FX950

Display and planning development from inquiries by game device manufacturers! Color and brightness inspection is possible.

We would like to introduce a development case of the "Focus FX950." (The product is sold through Kyoritsu Test System.) This is an embedded module for LED inspection, developed in response to inquiries from display and gaming device manufacturers. It can perform color and brightness inspections and is typically integrated into standard function checkers for functional testing. The Technology Development Department will provide proposals based on the experience and achievements cultivated in FA and PA. 【Areas of Expertise and Key Technologies】 ■ Analog and digital circuit design ■ Signal processing such as filtering and noise reduction ■ Wired communication and wireless transmission circuit design ■ Circuit design for standards (PCIe, USB, etc.) ■ Inspection systems and fixture design ■ Firmware design ■ PC application design *Please feel free to contact our sales department for inquiries. *For more details, please refer to the PDF materials or feel free to contact us.

  • 開発事例”Focus FX950”（製品は協立テストシステムにて販売）製品画像?.jpg
  • Other inspection equipment and devices

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