Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.
31～45 item / All 49 items
Built-in (onboard) antenna type, with a communication distance of up to 30m under standard specifications.
A Class 1 embedded Bluetooth module that wirelessly connects your serial devices via Bluetooth. 【Direct Inquiry Contact】support@intersolutionmarketing.jp Our company proposes solutions to problems with the keyword "connect."
Supports 4 lanes of PCI-Express Gen4 and 5 lanes of PCI-Express Gen3!
The PCOM-B656VGL is a COM-Express Type 6 module equipped with Intel's 11th generation Core processor (Tiger Lake-UP3). It now supports DDR4 memory, USB 3.1 Gen 2, and PCI-Express Gen 4. Additionally, it is possible to utilize extra PCI-Express Gen 3 ports to incorporate high-speed interfaces. 【Features】 ■ Equipped with Intel 11th generation Core processor (Tiger Lake-UP3) ■ Supports up to 2 DDR4-3200 So-DIMMs ■ Supports 4 lanes of PCI-Express Gen 4 and 5 lanes of PCI-Express Gen 3 ■ Equipped with Intel Xe graphics (up to 96 EU) *For more details, please download the PDF or feel free to contact us.
A variety of interfaces including USB4! Capable of installing up to four DDR5-4800MT/s So-DIMMs.
The PCOM-B887 is a COM-HPC client module compatible with Intel Core Ultra200 socket type CPUs, with a size of C (160 x 120mm). It supports PCIe Gen5x16, PCIe Gen5x4, and PCIe Gen4. It features an integrated NPU for AI acceleration. Please feel free to contact us if you have any inquiries. 【Features】 ■ Compatible with Intel Core Ultra200 socket type CPUs ■ Supports PCIe Gen5x16, PCIe Gen5x4, and PCIe Gen4 ■ Can accommodate up to 4 DDR5-4800MT/s So-DIMMs ■ A variety of interfaces including USB4 ■ Integrated NPU for AI acceleration *For more details, please download the PDF or feel free to contact us.
Expandable parallel port! Introducing a product with excellent cost performance that is necessary and sufficient.
The "Ci3-6100H110.W7P32/BT/4G" is an affordable and stable industrial system with a compact and quiet chassis. It is equipped with advanced features such as M.2 and USB 3.0. It has specifications that allow for the utilization of legacy assets such as COM ports, PS/2, and PCI slots. It can accommodate various inspection devices. 【Features】 - Uses parts that ensure stable supply - Equipped with advanced features such as M.2 and USB 3.0 - Specifications that allow for the utilization of legacy assets such as COM ports, PS/2, and PCI slots - Expandable parallel port - Compact and quiet chassis *For more details, please refer to the PDF document or feel free to contact us.
An NXP i.MX6UL-based embedded network module with a compact form factor and Linux software support.
The ConnectCore for i.MX6UL module provides a secure and highly cost-effective network-enabled system-on-module platform that is slightly larger than a postage stamp. Built on the NXP i.MX6UL application processor, this module serves as an intelligent communication engine for today's secure network devices. It seamlessly integrates dual-band Wi-Fi (802.11a/b/g/n/ac) with dual Ethernet and Bluetooth 5, which has obtained radio law certification.
The VIA SOM-3000 module can shorten the time to market for innovative new edge AI devices.
The VIA SOM-3000 module can shorten the time to market for innovative new edge AI devices. This flexible and high-performance module, equipped with the low-power MediaTek Genio 350 quad-core SoC, is ideal for mainstream edge AI and IoT applications that require visual and audio edge processing, such as facial recognition, object identification, motion tracking, OCR, and biometrics. With advanced multimedia features including dual cameras and an HD display, as well as a rich set of I/O interfaces, this module serves as an optimal platform for a wide range of use cases in consumer, commercial, medical, and educational sectors.
The VIA SOM-9X50 module streamlines the development of next-generation edge AI devices.
The VIA SOM-9X50 module streamlines the development of next-generation edge AI devices. This highly integrated module, centered around the powerful and energy-efficient MediaTek Genio 500 octa-core SoC, delivers exceptional performance for a wide range of AI displays, object recognition, and voice applications.
![Embedded MXM Module [MXM-Axe]](https://image.mono.ipros.com/public/product/image/380/2000813670/IPROS19681542167471635987.png?w=280&h=280)
Intel Arc GPU equipped MXM 3.1 Type A
ADLINK's MXM-AXe offers up to 8 hardware ray tracing cores, 128 execution units, 4GB GDDR6, and a maximum TGP of 50W with 8x PCIe Gen4. It provides a 50W TGP and the industry's first full AV1 hardware encoding. This module, which significantly enhances graphics rendering, is key to adapting to next-generation graphics workloads. The MXM-AXe leverages Intel's established graphics ecosystem, which edge developers have enjoyed and trusted for years, including OpenVINO for AI and Intel OneAPI management tools. Rather than a new lineup of GPUs, it is designed to seamlessly transition from integrated graphics to discrete graphics as before. Supporting Intel Deep Link technology, the MXM AXe, when combined with 12th and 13th generation Intel Core processors, achieves even higher performance and power efficiency through automatic workload allocation between integrated GPU, discrete GPU, and CPU.
We have a proven track record of many adoptions in fields such as healthcare, industry, commerce, education, and broadcasting.
The RG23xxA Core series is an embedded module for extending USB 2.0. It extends USB 2.0 over Cat5e cables, fiber optics, and LAN (2310A). Icron Technologies is a leading company in USB extenders, with many applications in fields such as medical, industrial, commercial, education, and broadcasting. For more details, please contact us or refer to the catalog.
![[Development Case] Focus FX950](https://image.mono.ipros.com/public/product/image/cc5/2000720394/IPROS54958986512451567539.jpeg?w=280&h=280)
Display and planning development from inquiries by game device manufacturers! Color and brightness inspection is possible.
We would like to introduce a development case of the "Focus FX950." (The product is sold through Kyoritsu Test System.) This is an embedded module for LED inspection, developed in response to inquiries from display and gaming device manufacturers. It can perform color and brightness inspections and is typically integrated into standard function checkers for functional testing. The Technology Development Department will provide proposals based on the experience and achievements cultivated in FA and PA. 【Areas of Expertise and Key Technologies】 ■ Analog and digital circuit design ■ Signal processing such as filtering and noise reduction ■ Wired communication and wireless transmission circuit design ■ Circuit design for standards (PCIe, USB, etc.) ■ Inspection systems and fixture design ■ Firmware design ■ PC application design *Please feel free to contact our sales department for inquiries. *For more details, please refer to the PDF materials or feel free to contact us.
Desktop system equipped with Intel's Atom Rangeley C2358 processor.
- Adopts Intel Atom C2000 series - Built-in Intel QAT - Equipped with 4 Gigabit Ethernet ports - Uses DDR3L memory - miniPCIexpress socket x 1 - Proposal possible using Intel WiFi/Bluetooth module/antenna with TELEC certification - Supports security using McAfee Embedded Control
![Industrial SMARC Module [uCOM-IMX93]](https://image.mono.ipros.com/public/product/image/9bf/2001531645/IPROS17541180337525854535.jpg?w=280&h=280)
AAEON Industrial SMARC Module equipped with NXP i.MX 93 Arm Cortex-A55+M33 Processor
● Equipped with NXP i.MX93 Dual-Core Arm Cortex-A55 + Arm Cortex-M33 Processor ● Onboard LPDDR4 2GB ● Supports HDMI x1 or MIPI-DSI 4 lane x1, LVDS x1 ● USB 2.0 OTG x1, USB 2.0 HOST x4 ● Heat sink available for separate purchase ● Carrier board available for separate purchase
It offers 8GB eMMC flash expandable up to 128GB and various interfaces!
The "Zynq UltraScale+ MPSoC (ZU7/ZU5/ZU4) 3U-VPX Plug-in Module iW-RainboW-G30V" is equipped with AMD Xilinx's ZU7/5/4 Zynq UltraScale+ MPSoC. Additionally, it provides up to 504K logic cells and 230K LUTs, along with 64-bit 4GB PS DDR4 RAM with ECC (expandable up to 8GB) and 16-bit 1GB PL DDR4 RAM (expandable up to 2GB). It also offers 8GB eMMC flash (expandable up to 128GB) and various interfaces (Gigabit Ethernet, USB 3.0, USB 2.0, PCIe Gen3, etc.). 【Features (partial)】 ■ 16bit, 1GB PL DDR4 RAM (Upgradable) ■ 8GB eMMC Flash (Upgradable) *For more details, please download the PDF or feel free to contact us.
A fanless embedded system that combines an impressive and smart design with excellent computing capabilities!
The "EC70B-SU" is a fanless embedded system equipped with high-end 6th generation Intel(R) Core(TM) i7/i5/i3 processors, providing excellent processing power in a compact, fanless chassis. It is ideal for smart factories, digital healthcare, and surveillance, where space is limited and computationally intensive solutions are required. 【Features】 - Fanless embedded system with 6th/7th generation Intel(R) Core(TM) - Equipped with 4GB/8GB DDR4 memory - 1xmSATA-mini and 1xM.2/CFast for storage - Supports two mini PCIe for wireless applications - Abundant I/O ports: 2 PoE, 2 Intel GbE, 6 COM, 6 USB 3.0 - 15 years of CPU lifecycle support until Q3 2030 (Based on Intel IOTG Roadmap) *For more details, please download the PDF (English version) or feel free to contact us.
MEDIATEK GENIO700 equipped SMARC module opens new possibilities for embedded systems.
The "SOM-SMARC-Genio700" is a high-performance product equipped with a multimedia Arm processor and AI accelerator capabilities. It features an 8-core CPU and has an APU performance of 4 TOPS, with a guaranteed supply for embedded applications for ten years. The module complies with the SMARC standard and offers various I/O options. It provides users of SMARC modules in fields such as retail, healthcare, smart homes, and digital signage with a new replacement option. 【Features】 ■ Processor - 2x Arm Cortex-A78 @2.2GHz - 6x Arm Cortex-A55 @2.0GHz - Mali G57 MC3 GPU - AI Accelerator: Mediatek APU3.0 equipped Cadence *For more details, please refer to the PDF document or feel free to contact us.
