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Built-in Modules Product List and Ranking from 30 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Aug 12, 2026～Sep 08, 2026
This ranking is based on the number of page views on our site.

Built-in Modules Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Aug 12, 2026～Sep 08, 2026
This ranking is based on the number of page views on our site.

  1. ADLINKジャパン 東京本社 Tokyo//Industrial Electrical Equipment
  2. ミカサ商事　MIKASA SHOJI CO., LTD. Osaka//Trading company/Wholesale
  3. Kyoritsu Electric Corporation Shizuoka//Industrial Electrical Equipment
  4. 4 ポートウェルジャパン Tokyo//Industrial Electrical Equipment
  5. 5 富士ソフト インダストリービジネス事業部 Kanagawa//software
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Built-in Modules Product ranking

Last Updated： Aggregation Period:Aug 12, 2026～Sep 08, 2026
This ranking is based on the number of page views on our site.

  1. [Development Case] Focus FX950 Kyoritsu Electric Corporation
  2. BOXER AI Series BOXER-8652AI ミカサ商事　MIKASA SHOJI CO., LTD.
  3. Blackwell equipped with 【EGX-MXM-BW5000】 ADLINKジャパン 東京本社
  4. 4 NXP i.MX95 series equipped OSM【OSM-IMX95】 ADLINKジャパン 東京本社
  5. 5 VIA AMOS-9100 VIA Technologies Japan

Built-in Modules Product List

61～74 item / All 74 items

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SOM-SMARC-Genio700

SOM-SMARC-Genio700

MEDIATEK GENIO700 equipped SMARC module opens new possibilities for embedded systems.

The "SOM-SMARC-Genio700" is a high-performance product equipped with a multimedia Arm processor and AI accelerator capabilities. It features an 8-core CPU and has an APU performance of 4 TOPS, with a guaranteed supply for embedded applications for ten years. The module complies with the SMARC standard and offers various I/O options. It provides users of SMARC modules in fields such as retail, healthcare, smart homes, and digital signage with a new replacement option. 【Features】 ■ Processor - 2x Arm Cortex-A78 @2.2GHz - 6x Arm Cortex-A55 @2.0GHz - Mali G57 MC3 GPU - AI Accelerator: Mediatek APU3.0 equipped Cadence *For more details, please refer to the PDF document or feel free to contact us.

  • LED Module
  • Embedded Board Computers
  • Other embedded systems (software and hardware)
  • Built-in Modules

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Slim Embedded Module 'MDI-4150'

Slim Embedded Module 'MDI-4150'

Thinnest size, high-speed reading two-dimensional module engine.

The MDI-4150 is an industry-class compact two-dimensional scanner module engine. Weighing only 5.5g with a decoder included, it is ideal for integration into devices. As a two-dimensional scanner module, it supports the reading of not only barcodes but also two-dimensional codes such as QR codes. With a newly developed decoding algorithm, a maximum 100-frame CMOS sensor, and the latest high-performance CPU, it can read moving objects and 1D/2D codes at high speed, approximately 30ms. Furthermore, it achieves overwhelming reading speed that is independent of the reading angle. It maintains consistent reading response even in cases of hand shake, low light, or bright environments. Additionally, it realizes low power consumption during reading, standby, and low power modes, allowing for various power-saving settings based on configuration. The sharp green LED single-line aiming provides high visibility, safety, and long lifespan. Moreover, the adoption of warm white LED lighting reduces eye strain during reading. 【Features】 ■ High reading speed and low power consumption ■ Highly visible LED aiming and warm white LED lighting *QR Code is a registered trademark of DENSO WAVE INCORPORATED.

  • Other PCs and OA equipment
  • Built-in Modules

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AIE-KX13/23

AIE-KX13/23

DeviceEdge Jetson Series

● The NVIDIA Jetson AGX Orin module offers up to 275 TOPS, which is eight times that of the NVIDIA Jetson AGX Xavier 32 GB module. With up to 2048 NVIDIA CUDA cores and 64 Tensor cores built into the NVIDIA Jetson AGX Orin module, it enables server-class AI inference at low latency on the edge. ● It is a highly expandable system that includes one M.2 B-Key for LTE/5G support, one M.2 M-Key for storage support, and one M.2 E-Key for Wifi/Bluetooth/GPS support. An onboard 1 x 10 GbE port provides network connectivity, achieving data speeds of up to 100 billion bits per second, which is ten times the traditional GbE standard. ● To accommodate various embedded applications, particularly in harsh environments such as smart factories, smart cities, and smart transportation, it supports a wide operating temperature range from -25°C to 70°C and a broad input power range from 9 to 36 VDC.

  • Industrial PCs
  • Built-in Modules

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AIE-KO21/31 | AIE-KN31/41

AIE-KO21/31 | AIE-KN31/41

DeviceEdge Jetson Series

● The NVIDIA Jetson Orin NX module delivers up to 100 TOPS, which is more than three times that of the NVIDIA Jetson AGX Xavier module and about five times that of the NVIDIA Jetson Xavier NX module. The NVIDIA Jetson Orin Nano achieves a maximum of 40 TOPS, which is 80 times that of the NVIDIA Jetson NanoTM module. ● It includes one M.2 E-Key for Wi-Fi/BT and one M.2 M-Key for storage. To ensure sufficient data storage for edge computing, the AIE-KO21/31 and AIE-KN31/41 support external M.2 2242 NVMe with high-speed data transmission capabilities. ● To accommodate various embedded applications, especially in challenging environments such as smart factories, smart cities, and smart transportation, it is adapted to operate in a temperature range of -25°C to 70°C and a wide input power range of 12 to 24 VDC.

  • Industrial PCs
  • Built-in Modules

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VIA AMOS-9100

VIA AMOS-9100

Edge AI systems designed for cutting-edge applications in the industrial sector, such as autonomous mobile robots (AMR) and automated guided vehicles (AGV).

The VIA AMOS-9100 is an edge AI system designed for cutting-edge applications in the industry, such as autonomous mobile robots (AMRs) and automated guided vehicles (AGVs). Equipped with a 2.0 GHz NVIDIA Jetson Orin NX processor, it delivers up to 70 TOPS of AI performance. This performance enables efficient processing of data-intensive tasks by leveraging the NVIDIA Deep Learning Accelerator (NVDLA). Additionally, it features advanced video processing capabilities that support 8K video decoding and 4K encoding, making it ideal for real-time analytics and machine vision applications. Furthermore, long-range communication through LoRa wireless connectivity options and dual gigabit Ethernet ports (with optional PoE support) facilitate smooth integration into diverse industrial networks and infrastructures. With these features, the VIA AMOS-9100 provides a reliable and efficient solution for industrial environments that require advanced data processing.

  • controller
  • Built-in Modules

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NXP i.MX8M M equipped SMARC【LEC-IMX8MM】

NXP i.MX8M M equipped SMARC【LEC-IMX8MM】

SMARC short-size module equipped with NXP i.MX 8M Mini SoC

ADLINK's LEC-IMX8MM is the first SMARC revision 2.1 compliant module that offers excellent power efficiency, based on the low-power NXP i.MX 8M Mini processor (dual or quad-core Arm Cortex-A53) and integrates Vivante GC NanoUltra graphics to enhance processing capabilities. The LEC-IMX8MM is a cost-effective solution ideal for various general-purpose edge applications and IoT applications.

  • Embedded Board Computers
  • Built-in Modules

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For drone control: Qualcomm-equipped [LEC-RB5N]

For drone control: Qualcomm-equipped [LEC-RB5N]

Qualcomm QRB5165 Series Octa-Core SoC Equipped SMARC Short Size Module

In the drone industry, flight control systems require real-time capabilities, high processing power, and safety and reliability. In particular, to achieve functions such as stability during flight, accurate positioning, and obstacle avoidance, high-performance processors and robust systems that support them are essential. The ADLINK SMARC LEC-RB5N module is a Linux microprocessor-based COM. This solution is based on Qualcomm's QRB5165 octa-core CPU, equipped with an integrated NPU, providing up to 15 TOPS of performance to handle demanding AI tasks. It also features a powerful GPU compatible with OpenGL and Vulkan for processing visual data. Additionally, it comes with a wide range of video and display interfaces.

  • Embedded Board Computers
  • Built-in Modules

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Blackwell equipped with 【EGX-MXM-BW5000】

Blackwell equipped with 【EGX-MXM-BW5000】

NVIDIA RTX PRO 5000 Blackwell equipped embedded MXM GPU module

Ultimate Embedded GPU for High-Performance Edge AI The EGX-MXM-BW5000, achieving up to 1,824 AI TOPS, is the flagship model of this series. Equipped with up to 24GB of high-speed GDDR7 memory, it delivers exceptional AI inference and graphics performance for the most demanding embedded AI workloads. It is optimized for large language models (LLM), generative AI, multi-stream AI inference, and other compute-intensive edge AI applications.

  • Embedded Board Computers
  • Built-in Modules

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[July 15th Event] Invitation to the Web Seminar hosted by Rihyo Electro

[July 15th Event] Invitation to the Web Seminar hosted by Rihyo Electro

Everything you need to know about the FA machine platform! - From Intel CPUs to module products, hypervisors, and AI tools -

Rihyo Electro Co., Ltd. will hold a webinar titled "Everything You Need to Know About Platforms for FA Equipment! - From Intel CPUs to Module Products, Hypervisors, and AI Tools" on Wednesday, July 15, 2020. In this seminar, we will introduce the latest products from Congatec, which are optimal for FA equipment, as well as the latest information on Realtime Hypervisor, Windows 10 IoT Enterprise, Azure IoT Edge certification, and Intel embedded products and AI tools like OpenVINO, incorporating case studies related to FA and manufacturing industries. We invite you to register for this seminar. 【Event Overview】 ■ Date and Time: July 15, 2020 (Wednesday) 16:00 - 17:30 (Entry available 10 minutes before start) ■ Participation Fee: Free <Pre-registration required> ■ Venue: Webinar tool "Cocripo" (https://www.cocripo.co.jp/) ■ Registration Method: Registration can only be done through our company website. *For more details, please refer to the PDF document or feel free to contact us.

  • Software (middle, driver, security, etc.)
  • Built-in Modules

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BOXER AI Series BOXER-8652AI

BOXER AI Series BOXER-8652AI

Smart inference with Jetson Orin NX - AI anywhere with a compact design of 152mm.

The BOXER-8652AI is a compact, fanless embedded AI system deployed as part of AAEON's AI@Edge solutions. It is equipped with the NVIDIA Jetson Orin NX module, providing powerful AI inference capabilities in a small form factor.

  • BOXER-8641AI_3DBack_01.jpg
  • Industrial PCs
  • Other PCs and OA equipment
  • Desktop PC
  • Built-in Modules

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LEC-IMX95 SMARC module for drone flight control

LEC-IMX95 SMARC module for drone flight control

SMARC module equipped with NXP i.MX95, ideal for drone flight control.

In the drone industry, flight control systems require real-time capabilities, high processing power, and safety and reliability. In particular, to achieve functions such as stability during flight, accurate positioning, and obstacle avoidance, high-performance processors and robust systems that support them are essential. The LEC-IMX95 SMARC module, equipped with the NXP i.MX95 processor, meets these demands. 【Use Cases】 - Flight control systems for autonomous flying drones - Image processing and control for aerial photography drones - Route optimization and flight control for logistics drones - Real-time data processing for inspection and monitoring drones 【Benefits of Implementation】 - Smoother flight control due to high-performance processors - More advanced autonomous flight through real-time image processing - Extended flight time due to low power consumption - Stable operation due to high reliability and safety

  • Embedded Board Computers
  • Built-in Modules

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