Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.
136～150 item / All 203 items
Type7 Module Up to 8 cores Ryzen V3000, 4xDDR5-4800 ECC maximum 64GB
【ADLINK Express-VR7 Features】 ■AMD Embedded Ryzen V3000 Processor ■Up to 8 cores, 16 threads ■Supports AT/ATX power supply ■Up to 64GB DDR5 (up to 4800 MT/s) ■14x PCIe Gen4 lanes ■2x 10G Ethernet, 1x 2.5G Ethernet support ■4x USB 3.x/2.0 or 4x USB 2.0/1.1 ■2x SATA 6Gb/s (SATA 0,1) ■Wide operating temperature range: Supports 0°C to 60°C
Type6 Module 13th Gen Raptor Lake-P i7/i5/i3, 1xDDR5-4800 up to 64GB
【ADLINK Express-RLP Features】 ■ 13th Generation Intel Core Processor ■ Up to 14 cores (6 P-cores, 8 E-cores), 20 threads ■ Intel AVX-512 VNNI, Intel Turbo Boost ■ Intel Iris Xe Graphics ■ Up to 64GB DDR5 (up to 4800 MT/s) ■ 1 PCIe x8 Gen4, 2 PCIe x4 Gen4 lanes ■ 2.5GbE, TSN compliant ■ 4x USB 3.2/2.0/1.1 (USB 0-3) and 4x USB 2.0/1.1 (USB 4-7) ■ 2x SATA 6Gb/s ■ NVMe SSD compatible
ADLINK, dimensions 160X120 mm, 13th generation Core i9/i7/i5/i3, 2xDDR5-3200 up to 128GB
【ADLINK COM-HPC-cRLS Features】 ■ Supports 13th generation Intel Core i9/i7/i5/i3 processors ■ Up to 24 cores, 32 threads (8 P-cores, 16 E-cores) ■ Up to 128GB DDR5 (up to 4800 MT/s) ■ Intel AVX-512 VNNI, Intel DL Boost ■ Intel UHD 770 Xe graphics ■ 16x PCIe Gen5, 8x PCIe Gen4 lanes, 14x PCIe Gen3 lanes ■ 2x 2.5GbE, Intel TCC, TSN capable ■ 4x USB 3.0/2.0/1.1, 8x USB 2.0 ■ 2x SATA, 2x UART, 12x GPIO
Equipped with Ultra7-MS3/Ultra7-T4/Ultra5-MS1/Ultra5-T3, 2xDDR5-5600, maximum 64GB.
【ADLINK cExpress-MTL Features】 ■PICMG COM.0: Rev 3.1 Type 6 ■COM Express CPU module (compact size 95x95mm) ■Compatible with Type 6 Module Ultra7-MS3/Ultra7-T4/Ultra5-MS1/Ultra5-T3 ■2xDDR5-5600 up to 96GB ■Supports 2x USB 3.2/2.0/1.1, 2x USB 3.2 (BOM option), 6x USB 2.0/1.1, 2x SATA 6Gb/s, 2x UART ■PCIe x8 Gen4, lanes 16-23, PCIe x4 Gen4, lanes 24-27, PCIe x4 Gen4, lanes 28-31, supports up to 8 PCIe x1 Gen4 lanes (optional) ■Supports 1x 2.5GbE Ethernet (TSN option) ■Supports ATX/AT power supply ■Upgrades all PCIe signals to Gen4 ■Supports 2x USB4 (optional) ■Operating temperature range of 0 to 60°C
ADLINK, NXP i.MX 93 with 2-core Arm Cortex-A55 & M33, LPDDR4L up to 2GB
【ADLINK OSM-IMX93 Features】 ■Dimensions: 45mm x 45mm ■NXP i.MX93 series (2-core Arm Cortex-A55 + M33) ■Equipped with TrustZone technology supporting Armv8 cryptographic functions ■Supports Arm Ethos U-65 micro NPU ■Supports independent display via 1x MIPI DSI ■LPDDR4L up to 2GB ■3x USB 2.0, 1x USB 2.0, 4x UART, 2x CAN2.0, 2x SPI, 1x I²S interface, 2x I2C interfaces, 16x GPIO ■Dual GbE (one port supports TSN) ■Certified to IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
NXP i.MX 95 with 6x Arm Cortex-A55, LPDDR4L up to 8GB, eMMC up to 128GB
**ADLINK OSM-IMX95 Features** - Dimensions: 45mm x 45mm - i.MX95 series (equipped with 4-core or 6-core Cortex-A55, Cortex-M7, and M33 MCU) - DSI and LVDS graphic output interfaces - LPDDR4L up to 8GB - eMMC up to 128GB - 1x USB 3.0, 1x USB 2.0, 4x UART, 3x SPI, 2x I²S interfaces, 4x I2C interfaces, 12x GPIO, 1x GEN3 single lane - Dual GbE (TSN compatible) - Certified to IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
Providing new upgrade paths for various applications such as automation and in-vehicle systems!
The PCOM-B706GT is a COM-Express Type 7 module equipped with an AMD Embedded Ryzen V3000 series CPU. It supports up to 8 cores/16 threads and features two 10G KR ports, along with PCI-Express Gen4 signals, making it suitable for various applications that require high throughput. Although optional, it also supports the installation of an onboard SSD on the CPU module and temperature expansion from -40°C to 85°C. 【Features】 ■ Equipped with AMD Embedded Ryzen V3000 CPU ("Zen3" core) ■ Supports DDR5 memory ■ Operates within a temperature range of -40°C to 85°C (only for certain compatible CPUs) ■ Optional onboard NVMe storage can also be installed *For more details, please download the PDF or feel free to contact us.
8th/9th Gen Intel Core Processor COM Express Basic
<Features> ■ DDR4 SO-DIMM 2666MHz x2, up to 64GB ■ Supports 4 types of display I/F, with a maximum of 3 simultaneous displays: VGA*/DDI x1, LVDS*/eDP x1, DDI x2 *standard configuration ■ eDP resolution: up to 4096x2304 @60Hz ■ PCI Express(x16) x1, PCI Express(x8) x1 ■ Intel GbE x1, USB3.1 x4, USB2.0 x8, SATA x4, COM x2
COM Express Compact Size Type 6
<Features> ■ COM Express Compact Size Type 6 Module ■ Equipped with 11th Generation Intel Core / Celeron 6305E processor ■ Supports up to 64GB, 2 x 260-Pin SO-DIMM ■ 1 x VGA, 1 x LVDS/eDP, 3 x DDI ■ 1 x PCIe x4 (Gen 4), 5 x PCIe x1 (Gen 3) ■ Extended temperature support: -40℃ to 85℃
COM Express Mini Size Type 10
<Features> ■ COM Express Mini Size Type 10 Module ■ Compatible with Intel Atom x6000 series / Celeron / Pentium N & J series processors ■ Supports up to 16GB dual-channel LPDDR4X ■ 4 x PCIe x1 (Gen 3) ■ 1 x DDI, 1 x LVDS/eDP ■ 2 x USB 3.1, 8 x USB 2.0, 2 x SATA 3.0, 1 x eMMC 5.1, 1 x 8-bit DIO ■ Extended temperature support: -40℃ to 85℃
![CPU module "SMARC" [LEC-iMX6]](https://image.mono.ipros.com/public/product/image/75c/2000219877/IPROS5079826362096052175.jpg?w=280&h=280)
NXP/i.MX6 equipped SMARC short-size module
The SMARC ("Smart Mobility ARChitecture") is a definition for a versatile small form factor computer-on-module targeting applications that require low power, cost-effectiveness, and high performance. It also caters to systems that need more compact solutions than PC-oriented form factors. ARM SoCs eliminate the need for chips designed for PC platforms and consume less power, significantly reducing the amount of board space required for power conversion devices and power lines. This enables the use of smaller form factors and promotes the adoption of SMARC-compliant modules in low-power mobile devices. The actual power consumption of SMARC CPU modules typically ranges from 2W to 6W, allowing for passive cooling and reducing the effort and overall costs for subsequent development. By using this standard, up to 9W of continuous power can be utilized for more demanding applications.
![CPU module "SMARC" [LEC-iMX6R2]](https://image.mono.ipros.com/public/product/image/98d/2000510685/IPROS63124557240714370705.jpeg?w=280&h=280)
NXP i.MX 6 Multicore Arm Cortex-A9 equipped SMARC short-size module
SMARC (Smart Mobility ARChitecture) is a multi-purpose small form factor computer module definition aimed at applications requiring low power, low cost, and high performance. The module typically uses the same or similar ARM SoCs found in many well-known devices such as tablet computers and smartphones. Alternative low-power SoCs and CPUs, such as tablet-oriented x86 devices and other RISC CPUs, can also be used. The power envelope of the module is usually less than 6W. The module serves as a building block for portable and stationary embedded systems. Core CPU and support circuitry, including DRAM, boot flash, power sequencing, CPU power, GBE, and single-channel LVDS display transmitters, are concentrated within the module. The module is used with application-specific carrier boards that implement other functionalities such as audio CODECs, touch controllers, and wireless devices.
![CPU module "SMARC" [LEC-IMX8MP]](https://image.mono.ipros.com/public/product/image/79b/2000598940/IPROS31315477312969060387.jpeg?w=280&h=280)
NXP i.MX 8MPlus equipped SMARC short-size module
The ADLINK LEC-IMX8MP is the first module compliant with SMARC revision 2.1, based on the powerful NXP i.MX8M Plus (quad-core Arm Cortex-A53) processor equipped with an optional neural processing unit (NPU) that operates at up to 2.3 TOPS, focusing on industrial IoT with machine learning and vision, advanced multimedia, and high reliability. Additionally, it supports dual image signal processors and two camera inputs, enabling an effective vision system. The LEC-IMX8MP is suitable for applications such as smart homes, buildings, cities, and Industry 4.0.
![CPU module "SMARC" [LEC-MTK-I1200]](https://image.mono.ipros.com/public/product/image/e53/2000717097/IPROS58706350873575624420.jpeg?w=280&h=280)
SMARC short-size module equipped with MediaTek Genio 1200 platform.
The ADLINK LEC-MKT-I1200 is a SMARC module equipped with the MediaTek MT8395 SoC, which features four Arm Cortex-A78 cores, four Cortex-A55 cores, and up to 5 TOPS APU. This module incorporates a series of IoT technologies, including on-device artificial intelligence (AI) capabilities and support for up to three cameras, while achieving a low power envelope, making it an ideal solution for robotic and drone applications across various fields such as consumer, enterprise, defense, industrial, and logistics.
7th Generation Intel Atom x7000RE & x7000C Processor Equipped SMARC Short Size Module
The ADLINK LEC-ASL is a SMARC module compatible with 2/4/8 core Intel Atom x7000RE (x7211RE, x7213RE, x7433RE, x7835RE) and x7000C (x7203C, x7405C, x7809C) processors (formerly Amston Lake), integrating Intel UHD graphics and high-speed interfaces. The LEC-ASL module supports up to 16GB LPDDR5 memory and up to 256GB eMMC storage (build option), making it ideal for mission-critical fanless edge computing applications that operate 24/7, thanks to its robust operating temperature range and low power envelope.
