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CPU Module Product List and Ranking from 23 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.

CPU Module Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.

  1. 因幡電機産業 Osaka//Trading company/Wholesale 産機カンパニー
  2. 富士ソフト Kanagawa//software インダストリービジネス事業部
  3. ADLINKジャパン Tokyo//Industrial Electrical Equipment 東京本社
  4. 4 アットマークテクノ Hokkaido//Electronic Components and Semiconductors
  5. 5 Suntex Co., Ltd. Shizuoka//Industrial Electrical Equipment
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CPU Module Product ranking

Last Updated： Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.

  1. Omron PLC Safety CPU Unit NX-SL3/SL5 因幡電機産業 産機カンパニー
  2. SoM/CPUboard『Arbor Technology EmQ-i2301』 富士ソフト インダストリービジネス事業部
  3. Armadillo-610 アットマークテクノ
  4. SOM/CPU board『manufactured by SECO μQ7-A76-J』 富士ソフト インダストリービジネス事業部
  5. 4 PC/104 CPU Module [PCM-3365] アドバンテック

CPU Module Product List

151～165 item / All 198 items

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CPU module "ATLAS"

CPU module "ATLAS"

Achieved high computing performance and graphics performance with the Qseven form factor!

"ATLAS" is a Time Coordinated Computing Qseven Rel. 2.1 compliant module equipped with Intel Atom X6000E series, Intel Pentium, Celeron N, and J series SoCs (Elkhart Lake). It achieves high computing and graphics performance in a Qseven form factor. It is applicable in various fields such as gaming, multimedia devices, and visual computing. 【Features】 ■CPU - Intel Atom x6000E series, Intel Pentium, Celeron N, and J series processors ■Connectivity - GbE x 1, high-precision time protocol IEEE 1588, USB 2.0 x 6, SuperSpeed USB 10Gbps x 2, up to PCI-e x 4 *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "ELECTRA"

CPU module "ELECTRA"

MPU built with advanced 14LPC FinFET process technology! Achieving increased speed and power efficiency.

"ELECTRA" is a μQseven standard module equipped with NXP i.MX 8M Mini & NXP i.MX 8M Nano processors. Built on advanced 14LPC FinFET process technology, this MPU achieves high speed and improved power efficiency. It is used in fields such as HMI, multimedia devices, thin clients, and vending machines. 【Features】 ■ CPU ・NXP i.MX 8M Mini family / i.MX 8M Nano family ■ Connectivity ・Gigabit Ethernet, optional Wi-Fi + BT 5.0, UART x 2, optional CAN, USB 2.0 x 5, PCI-e x1 x 1 *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "MAIA"

CPU module "MAIA"

NXP i.MX 8 application processor equipped! Qseven Rel. 2.1 compliant module

"MAIA" is a CPU module that leverages the wide scalability offered by the Qseven form factor and the i.MX 8 family. It is equipped with the NXP i.MX 8 application processor. The graphics feature an integrated GPU that supports two simultaneous video outputs. It can be applied in various fields such as industrial automation and control, smart vision, and vending machines. 【Features】 ■CPU - NXP i.MX 8 application processor ■Connectivity - USB 3.0 x 1, PCI-e x1 Gen3, CSI camera connector, boot selection signal ■Graphics - Integrated GPU, supports two simultaneous video outputs *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "NEMBUS"

CPU module "NEMBUS"

Achieve compact and highly flexible OTS modules at unique costs! Usable in industrial temperature ranges.

"NEMBUS" is a μQseven standard module equipped with the NXP i.MX 6 processor. It achieves a compact and highly flexible OTS module at a unique cost. It is used in various fields such as HMI, handheld terminals, and wireless technology. It can be used in an industrial temperature range, and the memory can be equipped with up to 1GB of onboard DDR3L. 【Features】 ■ CPU: Single-core/Dual-core Lite (Arm Cortex A9 core) ■ Connectivity: Fast Ethernet, GPI/O ■ Graphics: Dedicated 2D/3D graphics processor ■ Memory: Up to 1GB of onboard DDR3L ■ Usable in industrial temperature range *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "CALLISTO"

CPU module "CALLISTO"

For edge devices in challenging environments! Applicable to a wide range of fields such as games and HMIs.

The "CALLISTO" we handle is a COM Express 3.1 Type 6 Basic module equipped with a 13th generation Intel processor. It can be used in industrial temperature ranges. It enables intensive video processing and AI-based analysis for edge devices in challenging environments. It can be applied in various fields, including automation, biomedical/medical devices, surveillance equipment, and transportation. 【Features】 ■ CPU: 13th generation Intel processor aimed at IoT applications ■ Graphics: Embedded Intel Iris Xe graphics with up to 96 execution units ■ Connectivity: 1x NBase-T 2.5GbE; 2x USB4.0 Gen2; 4x USB3.2 Gen2; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x8 Gen4 and 2x PEG x4 Gen4 ■ Memory: Two DDR5 SO-DIMM slots supporting DDR5-4800 IBECC memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "CHANDRA"

CPU module "CHANDRA"

The operating temperature of the industrial version is -40°C to +85°C! Introducing products with versatility and robustness.

"CHANDRA" is a CPU module equipped with Intel Atom E3800 and Celeron families. It offers versatility and robustness, and can be used in industrial temperature ranges. It is applicable in a wide range of fields such as avionics, industrial automation and control, and transportation. Additionally, the video interface can be switched to manage additional DDI, embedded display port, or 18/24-bit single/dual-channel LVDS interfaces. 【Features】 ■ CPU: Intel Atom E3800 and Celeron family ■ Graphics: Integrated Intel HD Graphics 4000 series controller ■ Connectivity: 4x USB 3.0; 7x USB 2.0; 4x PCI-e x1 Gen2 ■ Memory: DDR3L SO-DIMM slots x2, up to 8GB *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "CHARON"

CPU module "CHARON"

Supports four independent displays! x86 "Zen" Core and elite GPU performance.

The product we handle, 'CHARON', is a COM Express Rel.3.0 Compact Type 6 module equipped with an AMD Ryzen embedded V1000 processor. The graphics feature an AMD Radeon Vega GPU with up to 11 computing units and supports DirectX 12. It can be used in industrial temperature ranges. This product is suitable for fields such as biomedical/medical devices and digital signage-infotainment. 【Features】 ■ CPU: AMD Ryzen embedded V1000 processor ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 4x PCI-e x1 Gen 3, PEG x8 Gen 3 ■ Memory: Supports up to two DDR4 SO-DIMM slots with DDR4-3200 ECC memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "ECHO"

CPU module "ECHO"

The operating temperature of the commercial version is 0°C to +60°C! It supports various designs with a scalable form factor.

"ECHO" is a COM Express Basic Type 6 module equipped with an Intel Haswell processor. It supports three simultaneous video outputs and is compatible with DirectX 11 and OpenGL 4.0. It can be applied in fields such as biomedical/medical devices and gaming. This high-performance product features a scalable form factor that accommodates various designs. Please feel free to contact us for inquiries. 【Features】 ■ CPU: Intel Haswell family CPU ■ Graphics: Integrated Intel HD Graphics 4600 ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 7x PCI-e x1 ■ Memory: Up to 16GB DDR3L-1600 with two SO-DIMM slots *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "JULIET"

CPU module "JULIET"

COM Express form factor and high-performance Intel SoC for secure IoT applications!

"JULIET" is a COM Express Rel. 3.0 Basic Type 7 module equipped with an Intel Xeon D-1700 processor. It can be used in industrial temperature ranges and is applicable in fields such as industrial automation and control, telecommunications, and server high-performance computing. Additionally, it supports up to four DDR4 SO-DIMM slots with ECC-enabled DDR4-2933 memory. 【Features】 ■ CPU: Intel Xeon D-1700 processor ■ Networking: 4x 10GBASE-KR interfaces + 1x 1GbE port (with NC-SI) ■ Connectivity: 4x Superspeed USB 5Gbps; 16x PCI-e Gen4 lanes + 16x PCI-e Gen3 lanes *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "LARISSA"

CPU module "LARISSA"

For mobile applications! Low power consumption multi-core Intel architecture

"LARISSA" is a COM Express 3.0 Compact Type 6 module equipped with 8th generation Intel Core and Celeron U series processors. The operating temperature for the commercial version is 0°C to +60°C, and the dimensions are 95x95mm. It features two DDR4 SODIMM slots that support DDR4-2400 memory. It can be applied in various fields, including biomedical/medical devices, edge computing, HMI, information kiosks, and measurement instruments. 【Features】 ■ CPU: 8th generation Intel Core and 15W TDP Celeron 4000 series processors (formerly Whiskey Lake) ■ Graphics: Intel UHD Graphics 620 / 610 ■ Connectivity: 4 x USB 3.1; 8 x USB 2.0, up to 8 x PCI-e x 1 ■ Memory: Two DDR4 SODIMM slots supporting DDR4-2400 memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "OBERON"

CPU module "OBERON"

Improved processing power due to outstanding platform performance! Applicable in fields such as HMI and gaming.

"OBERON" is a COM Express 3.0 Basic Type 6 module equipped with Intel Core/Xeon, Core/Xeon/Celeron processors. With outstanding platform performance, it enhances processing capabilities. The maximum number of cores is 6, and the maximum number of threads is 12. It also supports up to three digital display interfaces (DDI), DP 1.2, DVI, and HDMI 1.4. Please feel free to contact us for inquiries. 【Features】 ■Graphics: Intel UHD Graphics 630/P630 architecture, with up to 48 execution units ■Connectivity: 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3 ■Memory: Two DDR4 SO-DIMM slots supporting DDR4-2666 ECC memory, up to 64 GB *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "OPHELIA"

CPU module "OPHELIA"

For demanding edge applications with graphics and computing requirements!

"OPHELIA" is a COM Express 3.0 Type 6 Compact module equipped with the AMD Ryzen embedded V2000 SoC. The graphics feature an integrated AMD Radeon GPU with up to 7 computing units, supporting up to 4 independent displays. This product is applicable in various fields, including digital signage, infotainment, information kiosks, and monitoring equipment. 【Features】 ■ CPU: Embedded Ryzen V series V2000 FP6 platform with "Zen2" CPU and Radeon GPU core ■ Connectivity: 1x GbE; 1x SuperSpeed USB 10Gbps; 3x SuperSpeed USB 5Gbps; 8x USB 2.0; 8x PCI-e x1 Gen3; PEGx8 Gen3 ■ Memory: Two DDR4 SO-DIMM slots supporting DDR4-3200 ECC and non-ECC memory (up to 64 GB) *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "ORION"

CPU module "ORION"

Enhanced AI performance and efficiency! CPU module capable of operating in low power state SOC.

The "ORION" we handle is a COM-HPC client module equipped with a 12th generation Intel Core processor. Using a PCI-e x4 port, it allows for the connection of M.2 NVMe drives on the carrier board. It features immersive graphics and enhanced AI performance and efficiency in a standard form factor. The SOC can operate in a low power state and is applicable in various fields, including visual computing, transportation, surveillance equipment, and robotics. 【Features】 ■ CPU: 12th generation Intel Core processor ■ Graphics: Intel Iris Xe architecture, up to 96 EUs, up to 4 independent displays ■ Memory: Two DDR5 SO-DIMM slots supporting DDR5-4800 memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "TARVOS"

CPU module "TARVOS"

When high graphics and hyper-threading are important! Applicable in fields such as telecommunications.

We would like to introduce our CPU module 'TARVOS'. It is equipped with Intel's 6th and 7th generation Core/Xeon processors and supports up to three independent displays. The maximum number of cores is 4, making it suitable for various fields including biomedical/medical devices, HMI, gaming, and digital signage-infotainment. Please feel free to contact us if you have any inquiries. 【Features】 ■ CPU: Intel 6th and 7th generation Core/Xeon CPU ■ Graphics: Intel HD Graphics 530/P530/630/P630 ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3 ■ Memory: 2 x DDR4 So-DIMM slots *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "LEXELL"

CPU module "LEXELL"

Standard solution for multimedia applications! Supports two video outputs simultaneously.

"LEXELL" is a 2.1.1 module equipped with the NXP i.MX 8X application processor. It features an integrated graphics processing unit and supports two simultaneous video outputs. It can be used in an industrial temperature range. It is applicable in fields such as digital signage, infotainment, home automation, and multimedia devices. 【Specifications (excerpt)】 ■ CPU: NXP i.MX 8M application processor ■ Graphics: Integrated graphics processing unit, supports two simultaneous video outputs ■ Memory: Implemented LPDDR4-3200 memory, 32-bit interface, up to 4GB *For more details, please refer to the PDF document or feel free to contact us.

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