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CPU Module Product List and Ranking from 26 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

CPU Module Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

  1. Suntex Co., Ltd. Shizuoka//Industrial Electrical Equipment
  2. ADLINKジャパン 東京本社 Tokyo//Industrial Electrical Equipment
  3. SECO S.p.A Italy//Industrial Electrical Equipment
  4. 4 アドバンテック Tokyo//Industrial Electrical Equipment
  5. 5 ナセル Tokyo//Industrial Electrical Equipment
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CPU Module Product ranking

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

  1. NXP i.MX95 OSM CPU module OSM-IMX95 Suntex Co., Ltd.
  2. CPU module "SMARC" [LEC-IMX95] ADLINKジャパン 東京本社
  3. PC/104 CPU Module [PCM-3365] アドバンテック
  4. CPU module "SMARC" [LEC-MTK-I1200] ADLINKジャパン 東京本社
  5. 4 MilDef Corporation Rugged CPU Unit Mobilite7 ナセル

CPU Module Product List

181～195 item / All 203 items

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CPU module "ECHO"

CPU module "ECHO"

The operating temperature of the commercial version is 0°C to +60°C! It supports various designs with a scalable form factor.

"ECHO" is a COM Express Basic Type 6 module equipped with an Intel Haswell processor. It supports three simultaneous video outputs and is compatible with DirectX 11 and OpenGL 4.0. It can be applied in fields such as biomedical/medical devices and gaming. This high-performance product features a scalable form factor that accommodates various designs. Please feel free to contact us for inquiries. 【Features】 ■ CPU: Intel Haswell family CPU ■ Graphics: Integrated Intel HD Graphics 4600 ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 7x PCI-e x1 ■ Memory: Up to 16GB DDR3L-1600 with two SO-DIMM slots *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "JULIET"

CPU module "JULIET"

COM Express form factor and high-performance Intel SoC for secure IoT applications!

"JULIET" is a COM Express Rel. 3.0 Basic Type 7 module equipped with an Intel Xeon D-1700 processor. It can be used in industrial temperature ranges and is applicable in fields such as industrial automation and control, telecommunications, and server high-performance computing. Additionally, it supports up to four DDR4 SO-DIMM slots with ECC-enabled DDR4-2933 memory. 【Features】 ■ CPU: Intel Xeon D-1700 processor ■ Networking: 4x 10GBASE-KR interfaces + 1x 1GbE port (with NC-SI) ■ Connectivity: 4x Superspeed USB 5Gbps; 16x PCI-e Gen4 lanes + 16x PCI-e Gen3 lanes *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "LARISSA"

CPU module "LARISSA"

For mobile applications! Low power consumption multi-core Intel architecture

"LARISSA" is a COM Express 3.0 Compact Type 6 module equipped with 8th generation Intel Core and Celeron U series processors. The operating temperature for the commercial version is 0°C to +60°C, and the dimensions are 95x95mm. It features two DDR4 SODIMM slots that support DDR4-2400 memory. It can be applied in various fields, including biomedical/medical devices, edge computing, HMI, information kiosks, and measurement instruments. 【Features】 ■ CPU: 8th generation Intel Core and 15W TDP Celeron 4000 series processors (formerly Whiskey Lake) ■ Graphics: Intel UHD Graphics 620 / 610 ■ Connectivity: 4 x USB 3.1; 8 x USB 2.0, up to 8 x PCI-e x 1 ■ Memory: Two DDR4 SODIMM slots supporting DDR4-2400 memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "OBERON"

CPU module "OBERON"

Improved processing power due to outstanding platform performance! Applicable in fields such as HMI and gaming.

"OBERON" is a COM Express 3.0 Basic Type 6 module equipped with Intel Core/Xeon, Core/Xeon/Celeron processors. With outstanding platform performance, it enhances processing capabilities. The maximum number of cores is 6, and the maximum number of threads is 12. It also supports up to three digital display interfaces (DDI), DP 1.2, DVI, and HDMI 1.4. Please feel free to contact us for inquiries. 【Features】 ■Graphics: Intel UHD Graphics 630/P630 architecture, with up to 48 execution units ■Connectivity: 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3 ■Memory: Two DDR4 SO-DIMM slots supporting DDR4-2666 ECC memory, up to 64 GB *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "OPHELIA"

CPU module "OPHELIA"

For demanding edge applications with graphics and computing requirements!

"OPHELIA" is a COM Express 3.0 Type 6 Compact module equipped with the AMD Ryzen embedded V2000 SoC. The graphics feature an integrated AMD Radeon GPU with up to 7 computing units, supporting up to 4 independent displays. This product is applicable in various fields, including digital signage, infotainment, information kiosks, and monitoring equipment. 【Features】 ■ CPU: Embedded Ryzen V series V2000 FP6 platform with "Zen2" CPU and Radeon GPU core ■ Connectivity: 1x GbE; 1x SuperSpeed USB 10Gbps; 3x SuperSpeed USB 5Gbps; 8x USB 2.0; 8x PCI-e x1 Gen3; PEGx8 Gen3 ■ Memory: Two DDR4 SO-DIMM slots supporting DDR4-3200 ECC and non-ECC memory (up to 64 GB) *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "ORION"

CPU module "ORION"

Enhanced AI performance and efficiency! CPU module capable of operating in low power state SOC.

The "ORION" we handle is a COM-HPC client module equipped with a 12th generation Intel Core processor. Using a PCI-e x4 port, it allows for the connection of M.2 NVMe drives on the carrier board. It features immersive graphics and enhanced AI performance and efficiency in a standard form factor. The SOC can operate in a low power state and is applicable in various fields, including visual computing, transportation, surveillance equipment, and robotics. 【Features】 ■ CPU: 12th generation Intel Core processor ■ Graphics: Intel Iris Xe architecture, up to 96 EUs, up to 4 independent displays ■ Memory: Two DDR5 SO-DIMM slots supporting DDR5-4800 memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "TARVOS"

CPU module "TARVOS"

When high graphics and hyper-threading are important! Applicable in fields such as telecommunications.

We would like to introduce our CPU module 'TARVOS'. It is equipped with Intel's 6th and 7th generation Core/Xeon processors and supports up to three independent displays. The maximum number of cores is 4, making it suitable for various fields including biomedical/medical devices, HMI, gaming, and digital signage-infotainment. Please feel free to contact us if you have any inquiries. 【Features】 ■ CPU: Intel 6th and 7th generation Core/Xeon CPU ■ Graphics: Intel HD Graphics 530/P530/630/P630 ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3 ■ Memory: 2 x DDR4 So-DIMM slots *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "LEXELL"

CPU module "LEXELL"

Standard solution for multimedia applications! Supports two video outputs simultaneously.

"LEXELL" is a 2.1.1 module equipped with the NXP i.MX 8X application processor. It features an integrated graphics processing unit and supports two simultaneous video outputs. It can be used in an industrial temperature range. It is applicable in fields such as digital signage, infotainment, home automation, and multimedia devices. 【Specifications (excerpt)】 ■ CPU: NXP i.MX 8M application processor ■ Graphics: Integrated graphics processing unit, supports two simultaneous video outputs ■ Memory: Implemented LPDDR4-3200 memory, 32-bit interface, up to 4GB *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "MAURY"

CPU module "MAURY"

Graphics for low power consumption applications! Maximum FHD video output.

"MAURY" is a SMARC Rel.2.1.1 module equipped with Xilinx Zynq Ultrascale+ Intel Atom processor x7000E series, Intel Core i3 processor, and Intel processor N series. NXP i.MX 93 in SMARC module, designed for low power applications. It is applicable in various fields including automation, automotive, biomedical/medical devices, and industrial automation and control. 【Specifications (excerpt)】 ■CPU: NXP i.MX 933/935 processor ■Graphics: Up to FHD video output ■Memory: Implemented LPDDR4X / LPDDR4-3200 memory, total maximum of 2GB, 16-bit interface *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "RUSSELL"

CPU module "RUSSELL"

Flexible ARM + FPGA heterogeneous processing in a standard form factor! For avionics and more.

"RUSSELL" is a SMARC Rel.2.0 compliant module equipped with Xilinx Zynq Ultrascale+ MPSoC. It offers flexible ARM + FPGA heterogeneous processing in a standard form factor. The graphics are powered by an integrated ARM Mali-400 MP2 GPU. It is applicable in various fields, including automotive, avionics, biomedical/medical devices, and robotics. 【Specifications (excerpt)】 ■ CPU: Xilinx Zynq Ultrascale+ CG/EG/EV MPSoCs (C784 package) ■ Graphics: Integrated ARM Mali-400 MP2 GPU ■ Memory: Up to 8GB + 2GB DDR4 implemented *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "SWAN"

CPU module "SWAN"

Efficient performance capable of safety certification in SMARC standard modules! For automation and more.

"SWAN" is a SMARC Rel. 2.1.1 module equipped with the NXP i.MX 8X application processor. It offers efficient performance that is safety-certifiable according to the SMARC standard. The graphics feature an integrated GPU and support for two simultaneous video outputs. It is applicable in various fields, including automation, biomedical/medical devices, and edge computing. 【Specifications (excerpt)】 ■CPU: NXP i.MX 8X application processor ■Graphics: Integrated GPU, supports two simultaneous video outputs ■Memory: Up to 4GB of implemented LPDDR4-2400 memory *For more details, please refer to the PDF document or feel free to contact us.

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AMD Ryzen COM Express CPU module

AMD Ryzen COM Express CPU module

AMD Ryzen Embedded V1000 V1605B/V1756B/V1807B COM Express Type 6 CPU Module

It is suitable for devices that heavily utilize graphics in industrial automation, medical imaging, transportation, gaming, payment systems, and more. 【Product Features】 - Onboard AMD V1605B/V1756B/B1807B APU processor - Integrated Gigabit Ethernet - Dual-channel 24-bit LVDS or 1 x DP port, up to 3×DDI ports - Supports three independent displays - Wide voltage input range of 8.5V to 28V

  • Embedded Board Computers

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11th Generation COM Express CPU Module

11th Generation COM Express CPU Module

COM Express embedded computer module that supports four independent displays【EmETXe-i92U0】.

High-resolution 4K display output, capable of operating in harsh environments from -40°C to 85°C. 【Product Features】 - Onboard 11th generation Intel Core i7-1185G7E / i5-1145G7E / i3-1115G4E / Celeron 6305E processors - Intel I219LM PCIe GbE PHY (with iAMT) - Dual-channel 24-bit LVDS, analog RGB, and 3 x DDI ports - Supports four independent displays - Wide voltage input range of 8.5V to 20V - Wide operating temperature range: -40 to 85°C

  • Embedded Board Computers

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Apollo Lake COM Express CPU module

Apollo Lake COM Express CPU module

COM Express Type 10 module with Intel Apollo Lake processor [EmNANO-i2402]

【Product Features】 - Onboard Intel Apollo Lake SoC processor - Intel Ethernet Controller i21x series - Single-channel 24-bit LVDS and 1 x DDI port

  • Embedded Board Computers

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Qseven CPU module [EmQ-i2401]

Qseven CPU module [EmQ-i2401]

Qseven CPU module with Intel Apollo Lake SoC processor [EmQ-i2401]

Intel Pentium N4200/Celeron N3350/Atom x7-E3950/x5-E3940/E3930 Processor Qseven R2.0 CPU Module 【Product Features】 - Onboard Intel Apollo Lake SoC Processor - Integrated Gigabit Ethernet - Dual-channel 24-bit LVDS and 1 x DP port

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