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CPU Module Product List and Ranking from 24 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

CPU Module Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

  1. Suntex Co., Ltd. Shizuoka//Industrial Electrical Equipment
  2. ナセル Tokyo//Industrial Electrical Equipment
  3. ADLINKジャパン 東京本社 Tokyo//Industrial Electrical Equipment
  4. 4 SECO S.p.A Italy//Industrial Electrical Equipment
  5. 5 アドバンテック Tokyo//Industrial Electrical Equipment
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CPU Module Product ranking

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

  1. NXP i.MX95 OSM CPU module OSM-IMX95 Suntex Co., Ltd.
  2. Argon Corporation Rugged CPU Unit ACB200 ナセル
  3. SECO ETX CPU Module ETX-A61 Suntex Co., Ltd.
  4. 4 NXP i.MX93 OSM CPU Module OSM-IMX93 Suntex Co., Ltd.
  5. 5 MilDef Corporation Rugged CPU Unit Mobilite7 ナセル

CPU Module Product List

181～195 item / All 199 items

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CPU module "OPHELIA"

CPU module "OPHELIA"

For demanding edge applications with graphics and computing requirements!

"OPHELIA" is a COM Express 3.0 Type 6 Compact module equipped with the AMD Ryzen embedded V2000 SoC. The graphics feature an integrated AMD Radeon GPU with up to 7 computing units, supporting up to 4 independent displays. This product is applicable in various fields, including digital signage, infotainment, information kiosks, and monitoring equipment. 【Features】 ■ CPU: Embedded Ryzen V series V2000 FP6 platform with "Zen2" CPU and Radeon GPU core ■ Connectivity: 1x GbE; 1x SuperSpeed USB 10Gbps; 3x SuperSpeed USB 5Gbps; 8x USB 2.0; 8x PCI-e x1 Gen3; PEGx8 Gen3 ■ Memory: Two DDR4 SO-DIMM slots supporting DDR4-3200 ECC and non-ECC memory (up to 64 GB) *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "ORION"

CPU module "ORION"

Enhanced AI performance and efficiency! CPU module capable of operating in low power state SOC.

The "ORION" we handle is a COM-HPC client module equipped with a 12th generation Intel Core processor. Using a PCI-e x4 port, it allows for the connection of M.2 NVMe drives on the carrier board. It features immersive graphics and enhanced AI performance and efficiency in a standard form factor. The SOC can operate in a low power state and is applicable in various fields, including visual computing, transportation, surveillance equipment, and robotics. 【Features】 ■ CPU: 12th generation Intel Core processor ■ Graphics: Intel Iris Xe architecture, up to 96 EUs, up to 4 independent displays ■ Memory: Two DDR5 SO-DIMM slots supporting DDR5-4800 memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "TARVOS"

CPU module "TARVOS"

When high graphics and hyper-threading are important! Applicable in fields such as telecommunications.

We would like to introduce our CPU module 'TARVOS'. It is equipped with Intel's 6th and 7th generation Core/Xeon processors and supports up to three independent displays. The maximum number of cores is 4, making it suitable for various fields including biomedical/medical devices, HMI, gaming, and digital signage-infotainment. Please feel free to contact us if you have any inquiries. 【Features】 ■ CPU: Intel 6th and 7th generation Core/Xeon CPU ■ Graphics: Intel HD Graphics 530/P530/630/P630 ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3 ■ Memory: 2 x DDR4 So-DIMM slots *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "LEXELL"

CPU module "LEXELL"

Standard solution for multimedia applications! Supports two video outputs simultaneously.

"LEXELL" is a 2.1.1 module equipped with the NXP i.MX 8X application processor. It features an integrated graphics processing unit and supports two simultaneous video outputs. It can be used in an industrial temperature range. It is applicable in fields such as digital signage, infotainment, home automation, and multimedia devices. 【Specifications (excerpt)】 ■ CPU: NXP i.MX 8M application processor ■ Graphics: Integrated graphics processing unit, supports two simultaneous video outputs ■ Memory: Implemented LPDDR4-3200 memory, 32-bit interface, up to 4GB *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "MAURY"

CPU module "MAURY"

Graphics for low power consumption applications! Maximum FHD video output.

"MAURY" is a SMARC Rel.2.1.1 module equipped with Xilinx Zynq Ultrascale+ Intel Atom processor x7000E series, Intel Core i3 processor, and Intel processor N series. NXP i.MX 93 in SMARC module, designed for low power applications. It is applicable in various fields including automation, automotive, biomedical/medical devices, and industrial automation and control. 【Specifications (excerpt)】 ■CPU: NXP i.MX 933/935 processor ■Graphics: Up to FHD video output ■Memory: Implemented LPDDR4X / LPDDR4-3200 memory, total maximum of 2GB, 16-bit interface *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "RUSSELL"

CPU module "RUSSELL"

Flexible ARM + FPGA heterogeneous processing in a standard form factor! For avionics and more.

"RUSSELL" is a SMARC Rel.2.0 compliant module equipped with Xilinx Zynq Ultrascale+ MPSoC. It offers flexible ARM + FPGA heterogeneous processing in a standard form factor. The graphics are powered by an integrated ARM Mali-400 MP2 GPU. It is applicable in various fields, including automotive, avionics, biomedical/medical devices, and robotics. 【Specifications (excerpt)】 ■ CPU: Xilinx Zynq Ultrascale+ CG/EG/EV MPSoCs (C784 package) ■ Graphics: Integrated ARM Mali-400 MP2 GPU ■ Memory: Up to 8GB + 2GB DDR4 implemented *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "SWAN"

CPU module "SWAN"

Efficient performance capable of safety certification in SMARC standard modules! For automation and more.

"SWAN" is a SMARC Rel. 2.1.1 module equipped with the NXP i.MX 8X application processor. It offers efficient performance that is safety-certifiable according to the SMARC standard. The graphics feature an integrated GPU and support for two simultaneous video outputs. It is applicable in various fields, including automation, biomedical/medical devices, and edge computing. 【Specifications (excerpt)】 ■CPU: NXP i.MX 8X application processor ■Graphics: Integrated GPU, supports two simultaneous video outputs ■Memory: Up to 4GB of implemented LPDDR4-2400 memory *For more details, please refer to the PDF document or feel free to contact us.

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AMD Ryzen COM Express CPU module

AMD Ryzen COM Express CPU module

AMD Ryzen Embedded V1000 V1605B/V1756B/V1807B COM Express Type 6 CPU Module

It is suitable for devices that heavily utilize graphics in industrial automation, medical imaging, transportation, gaming, payment systems, and more. 【Product Features】 - Onboard AMD V1605B/V1756B/B1807B APU processor - Integrated Gigabit Ethernet - Dual-channel 24-bit LVDS or 1 x DP port, up to 3×DDI ports - Supports three independent displays - Wide voltage input range of 8.5V to 28V

  • Embedded Board Computers

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11th Generation COM Express CPU Module

11th Generation COM Express CPU Module

COM Express embedded computer module that supports four independent displays【EmETXe-i92U0】.

High-resolution 4K display output, capable of operating in harsh environments from -40°C to 85°C. 【Product Features】 - Onboard 11th generation Intel Core i7-1185G7E / i5-1145G7E / i3-1115G4E / Celeron 6305E processors - Intel I219LM PCIe GbE PHY (with iAMT) - Dual-channel 24-bit LVDS, analog RGB, and 3 x DDI ports - Supports four independent displays - Wide voltage input range of 8.5V to 20V - Wide operating temperature range: -40 to 85°C

  • Embedded Board Computers

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Apollo Lake COM Express CPU module

Apollo Lake COM Express CPU module

COM Express Type 10 module with Intel Apollo Lake processor [EmNANO-i2402]

【Product Features】 - Onboard Intel Apollo Lake SoC processor - Intel Ethernet Controller i21x series - Single-channel 24-bit LVDS and 1 x DDI port

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Qseven CPU module [EmQ-i2401]

Qseven CPU module [EmQ-i2401]

Qseven CPU module with Intel Apollo Lake SoC processor [EmQ-i2401]

Intel Pentium N4200/Celeron N3350/Atom x7-E3950/x5-E3940/E3930 Processor Qseven R2.0 CPU Module 【Product Features】 - Onboard Intel Apollo Lake SoC Processor - Integrated Gigabit Ethernet - Dual-channel 24-bit LVDS and 1 x DP port

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Qseven CPU module [EmQ-i240A]

Qseven CPU module [EmQ-i240A]

Qseven CPU module with Apollo Lake SoC processor [EmQ-i240A]

Intel Pentium N4200/Celeron N3350/Atom x7-E3950/x5-E3940/E3930 Processor Qseven R2.1 CPU Module 【Product Features】 - Onboard Intel Apollo Lake SoC Processor - Integrated Gigabit Ethernet - Dual-channel 24-bit LVDS and 1 x DP port

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Amston Lake Qseven 【EmQ-iX702】

Amston Lake Qseven 【EmQ-iX702】

Intel Amston Lake Qseven R2.1 CPU Module【EmQ-iX702】

【Product Features】 ■ Intel Amston Lake SoC processor onboard ■ LPDDR5 4GB/8GB/16GB SDRAM onboard ■ Integrated 1 Gigabit Ethernet controller ■ Dual-channel 24-bit LVDS and 1 x DDI port ■ Compliant with Qseven specification version 2.1

  • Embedded Board Computers

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CPU module "SMARC" [LEC-ALN]

CPU module "SMARC" [LEC-ALN]

Intel Core i3 processor / Processor N series, equipped with 7th generation Atom x7000E processor SMARC.

The ADLINK LEC-ALN is a SMARC module compatible with Intel Core i3 processors (i3-N305, i3-N300) with up to 8 cores, Intel Processor N series (N97, N50), and Intel Atom x7000E processors (x7425E, x7213E, x7211E, formerly Alder Lake-N), integrating Intel UHD graphics and high-speed interfaces. The LEC-ALN module supports up to 16GB LPDDR5 memory and up to 256GB eMMC storage (build option), and it is also available with a robust operating temperature range and low power envelope, making it ideal for mission-critical fanless edge computing applications that require safety and reliability.

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[Research Material] Global Market for Machine Automation Controllers

[Research Material] Global Market for Machine Automation Controllers

Global Market for Machine Automation Controllers: CPU Units, Digital Input/Output Units, Analog Input/Output Units, Load Cell Input Units ...

This research report (Global Machine Automation Controllers Market) investigates and analyzes the current state of the global machine automation controllers market and its outlook for the next five years. It includes information on the overview of the global machine automation controllers market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the machine automation controllers market include CPU units, digital input/output units, analog input/output units, load cell input units, position interface units, and system units. The segments by application focus on PCB assembly process management, hard disk manufacturing management, and secondary battery manufacturing processes. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of machine automation controllers. The report also includes the market share of major companies in the machine automation controllers sector, product and business overviews, and sales performance.

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