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CPU Module Product List and Ranking from 26 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Dec 24, 2025～Jan 20, 2026
This ranking is based on the number of page views on our site.

CPU Module Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Dec 24, 2025～Jan 20, 2026
This ranking is based on the number of page views on our site.

  1. Suntex Co., Ltd. Shizuoka//Industrial Electrical Equipment
  2. ADLINKジャパン 東京本社 Tokyo//Industrial Electrical Equipment
  3. SECO S.p.A Italy//Industrial Electrical Equipment
  4. 4 日野エンジニアリング Tokyo//Electronic Components and Semiconductors
  5. 5 アドバンテック Tokyo//Industrial Electrical Equipment
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CPU Module Product ranking

Last Updated： Aggregation Period:Dec 24, 2025～Jan 20, 2026
This ranking is based on the number of page views on our site.

  1. NXP i.MX95 OSM CPU module OSM-IMX95 Suntex Co., Ltd.
  2. CPU module "SMARC" [LEC-IMX95] ADLINKジャパン 東京本社
  3. Multi-Flex Series Embedded Compact CPU Module 日野エンジニアリング
  4. COM Express CPU Module cExpress-MTL Suntex Co., Ltd.
  5. 4 MilDef Corporation Rugged CPU Unit Mobilite7 ナセル

CPU Module Product List

106～120 item / All 203 items

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CPU board "XPedite7750"

CPU board "XPedite7750"

Suitable for high bandwidth and processing-intensive requirements in commercial, industrial, and military applications! Comprehensive catalog and case materials are available.

The "XPedite7750" is a COM Express Type 7 CPU module equipped with the Intel Xeon D-1700 (formerly Ice Lake-D) processor. Its small footprint and standard form factor make it suitable for portable and harsh environments while providing a future upgrade path. The onboard memory supports 32GB of DDR4 ECC SDRAM in a dual-channel configuration, supporting memory-intensive applications. 【Features】 ■ COM Express expansion Type 7 pinout ■ Conductive cooling standard compliant ■ Equipped with 32GB of SLC NAND flash ■ PCI Express x16 lane Gen3 interface ■ 4x USB 3.0 ports ■ 2x LVTTL serial ports *For more details, please download the PDF (English version) or feel free to contact us.

  • Embedded Board Computers

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Ultra-compact CPU module "MultiFlex-A9"

Ultra-compact CPU module "MultiFlex-A9"

Equipped with Cortex-A9! A CPU module that achieves low power consumption and high performance.

The ultra-compact CPU module "MultiFlex-A9" is compatible with various products. Hino Engineering Co., Ltd. also provides carrier boards that can accommodate CPU boards. The carrier boards are equipped with connectors for interfaces and sockets for CPU boards, making them ideal for communication evaluation, debugging, and practical testing. 【Features】 ○ Compatible with Android ○ Equipped with video and 3D acceleration functions ○ Long-term stable supply available For more details, please contact us or download the catalog.

  • Other electronic parts

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Argon Corporation Rugged CPU Unit ACB200

Argon Corporation Rugged CPU Unit ACB200

Compact, lightweight, low power consumption rugged CPU unit. Ideal for installation in aircraft, drones, and defense vehicles! Compliant with MIL-STD-810 and 461.

Argon is an American company that designs and manufactures displays and PCs ranging from 5 to 43 inches for military use. They specialize in customization of MIL connectors, switch placements, and button positions. Their products comply with military standards MIL-STD-810, MIL-STD-461, and MIL-STD-901, boasting environmental performance with an operating temperature range of -10 to +55°C. An operating temperature option down to -40°C is also available. ■ Japanese technical documentation on MIL-STD-810, MIL-STD-461, and IP standards is available. If you would like to see it, please contact sales@nacelle.co.jp ■

  • Industrial PCs

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Argon Corporation Rugged CPU Unit ACB300

Argon Corporation Rugged CPU Unit ACB300

Compact, lightweight, energy-efficient rugged CPU unit. Ideal for installation in aircraft, drones, and defense vehicles! Compliant with MIL-STD-810 and 461.

Argon Corporation: An American company that designs and manufactures displays and PCs ranging from 5 to 43 inches for military applications. They specialize in customization of MIL connectors, switch placements, and button locations. They comply with military standards MIL-STD-810, MIL-STD-461, and MIL-STD-901, boasting environmental performance with an operating temperature range of -10 to +55°C. The operating temperature can also be supported down to -40°C as an option.

  • Industrial PCs

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Portwell CPU Module PCOM-B638VG

Portwell CPU Module PCOM-B638VG

6th generation Core i7-6600U/i5-6300U/i3-6100U/3955U Skylake-U equipped CPU module

Features ■ Type 6 COM Express module ■ Equipped with 6th generation Core i7-6600U/i5-6300U/i3-6100U/3955U Skylake-U ■ DDR4-1866 Non-ECC SODIMM x 1 (up to 16GB) ■ Supports VGA, LVDS/eDP, 2x DDI (DP/HDMI/DVI) displays (carrier board) ■ PCI Express Gen3 compatible (carrier board)

  • Embedded Board Computers
  • Evaluation Board

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Portwell CPU Module PCOM-B634VG

Portwell CPU Module PCOM-B634VG

6th Generation Intel Xeon D (Broadwell-DE) processor equipped CPU module

Features ■ Type 6 COM Express module ■ Equipped with 6th generation Xeon D-1548/Xeon D-1539/Xeon D-1527 ■ DDR4-2133 ECC/Non-ECC SODIMM (up to 48GB) x3 ■ Supports VGA, HDMI, 10GbE LAN ■ PCI Express Gen3 compatible (1x PCIEx16, 8x PCIEx8)

  • Embedded Board Computers
  • Evaluation Board

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ADLINK Qseven CPU Module Q7-AL

ADLINK Qseven CPU Module Q7-AL

Equipped with Atom E3900/Pentium N4200/Celeron N3350 CPU

Features ■ Equipped with Atom E3900/Pentium N4200/Celeron N3350 CPU. ■ Onboard memory 2400MHz LPDDR4 (up to 8GB) ■ Intel 9th generation low power graphics, 4K resolution/H.265 codec ■ Dual channel LVDS (18/28-bit) or 2x eDP, HDMI/DP ■ 2x MIPI CSI camera (2/4 lanes) ■ GbE, USB3.0, 2 SATA3 (6.0GBit/s) ■ Featuring Sema for easy integration of hardware monitoring and controlling ■ Compliant with Qseven 2.1 ■ Extended operating temperature: -40℃ to +85℃ (optional)

  • Embedded Board Computers
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  • Image Processing Board

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SECO COM Express CPU Module JULIET

SECO COM Express CPU Module JULIET

type7 Xeon D-1700 (Ice Lake-D), 4xDDR4-2400/2666/2933 ECC maximum 128GB

Features ■ Intel Xeon D-1700 processors ■ 4x Superspeed USB 5Gbps; 16x PCI-e Gen4 lanes + 16x PCI-e Gen3 lanes ■ 4x 10GBASE-KR interfaces + 1x 1GbE port with NC-SI ■ Up to four DDR4 SO-DIMM Slots supporting DDR4-2933 memory with ECC, up to 128GB

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board

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SECO COM Express CPU Module TARVOS

SECO COM Express CPU Module TARVOS

COMe-B09-BT6, Type6 7th/6th Gen Core i7/i5/i3/Xeon

Features ■ COM Express Basic Size Type 6 ■ Intel 6th and 7th Generation Core/Xeon CPU ■ 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3 ■ Intel HD Graphics 530/P530/630/P630 ■ 2x DDR4 So-DIMM slots

  • Embedded Board Computers
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  • Image Processing Board

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SECO COM Express CPU Module MIRANDA

SECO COM Express CPU Module MIRANDA

COMe-C24-CT6, Pentium N4200/Celeron J/N3x00/Atom X7/x5-E3900

Features ■ COM Express 3.0 Basic Size Type 6 ■ Intel Atom X, Intel Celeron J/N, Intel Pentium N series processors ■ 4x USB 3.0; 8x USB 2.0; 5x PCI-e x1 Gen2 ■ Intel HD Graphics 500 series controller with up to 18 execution units ■ 2x DDR3L SO-DIMM slots (supports DDR3L-1866 non-ECC memory)

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board

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SECO COM Express CPU Module CHANDRA

SECO COM Express CPU Module CHANDRA

COMe-A41-CT6, Type 6 Celeron J/N/Atom E3800 series, 2xDDR3L-1333 maximum 8G

Features ■ Compatible with COM Express Compact Type 6 ■ Intel Atom E3800 and Celeron family (formerly Bay Trail) ■ 4x USB 3.0; 7x USB 2.0; 4x PCI-e x1 Gen2 ■ Intel Integrated HD Graphics 4000 series controller ■ 2x DDR3L SO-DIMM slots (up to 8G)

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board

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SECO COM Express CPU Module THEBE

SECO COM Express CPU Module THEBE

COMe-C42-BT7, Type 7 AMD EPYC Embedded 3000, 4xDDR4-2666 ECC maximum 128GB

Features ■ COM Express R3.0 Type 7 Basic equipped with AMD EPYC Embedded 3000 ■ 4x USB 3.1; 24x PCI-e Gen3 lanes ■ 4x 10GBASE-KR interfaces + 1x 1GbE port (with NC-SI) ■ Supports up to 128GB of ECC DDR4-2666 memory with 4 DDR4 SO-DIMM slots

  • Embedded Board Computers
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  • Image Processing Board

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SECO COM Express CPU Module OPHELIA

SECO COM Express CPU Module OPHELIA

Type6 Compact AMD Ryzen Embedded V2000, 2xDDR4-3200 ECC up to 64GB

Features ■ Embedded Ryzen V Series V2000FP6 platform equipped with "Zen2" CPU and Radeon GPU core ■ 1x GbE; 1x SuperSpeed USB 10Gbps; 3x SuperSpeed USB 5Gbps; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x8 Gen3 ■ Integrated AMD Radeon GPU with up to 7 computing units ■ Two DDR4 SO-DIMM slots supporting up to 64GB of DDR4-3200 ECC and non-ECC memory ■ Adopts COM Express Compact Type 6 module

  • Embedded Board Computers
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SECO COM Express CPU Module AMOS

SECO COM Express CPU Module AMOS

COMe-A98-CT6, Type 6 AMD Embedded Third Generation R/G Series, 2xDDR4-2133 ECC Maximum 64GB

Features ■ AMD built-in 3rd generation R series SOC or G series SOC-I ■ 4x USB 3.0; 8x USB 2.0; 3x PCI-e x1 Gen3 ■ AMD Radeon 3rd -Generation Graphics Core Next (GCN) ■ Two SO-DIMM slots supporting DDR4 ECC and non-ECC modules

  • Embedded Board Computers
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  • Image Processing Board

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SECO NXP Qseven CPU Module MAIA

SECO NXP Qseven CPU Module MAIA

NXP i.MX 8X family, ARM Cortex-A72, equipped with up to 8GB of onboard LPDDR4-3200.

Features ■ Equipped with NXP i.MX 8 application processor ■ 1x USB 3.0; PCI-e x1 Gen3; CSI camera connector; supports boot select signal ■ Integrated GPU, supports two independent displays ■ Equipped with LPDDR4-3200 memory ■ Operating temperature 0–60℃ (optional: -40℃–85℃) ■ Dimensions: 70 x 70 mm (2.76” x 2.76”) ■ OS Linux/Yocto/Android

  • Embedded Board Computers
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  • Image Processing Board

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