We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for CPU Module.
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CPU Module Product List and Ranking from 24 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

CPU Module Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

  1. Suntex Co., Ltd. Shizuoka//Industrial Electrical Equipment
  2. ナセル Tokyo//Industrial Electrical Equipment
  3. ADLINKジャパン 東京本社 Tokyo//Industrial Electrical Equipment
  4. 4 SECO S.p.A Italy//Industrial Electrical Equipment
  5. 5 アドバンテック Tokyo//Industrial Electrical Equipment
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CPU Module Product ranking

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

  1. NXP i.MX95 OSM CPU module OSM-IMX95 Suntex Co., Ltd.
  2. Argon Corporation Rugged CPU Unit ACB200 ナセル
  3. SECO ETX CPU Module ETX-A61 Suntex Co., Ltd.
  4. 4 NXP i.MX93 OSM CPU Module OSM-IMX93 Suntex Co., Ltd.
  5. 5 MilDef Corporation Rugged CPU Unit Mobilite7 ナセル

CPU Module Product List

91～105 item / All 199 items

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CPU module "LAGOON"

CPU module "LAGOON"

Top-class connectivity! Applicable to a wide range of fields such as robotics and transportation.

"LAGOON" is a CPU module that can be used in industrial temperature ranges. It achieves processing power, high-performance graphics, and top-class connectivity with the COM-HPC modular solution. It supports up to three simultaneous video outputs and can connect M.2 NVMe drives on the carrier board using a PCI-e x4 port. 【Features】 ■ CPU: 11th generation Intel Xeon, Core, and Celeron processors ■ Graphics: Intel Iris Xe Graphics Core Gen12 GPU with up to 32 EU and up to four independent displays ■ Connectivity: 2x USB 4; 2x USB 3.2 Gen 2x2; 8x USB 2.0; 20x PCI-e Gen3 lanes; 20x PCI-e Gen4 lanes; up to 2x 2.5GbE *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "METIS"

CPU module "METIS"

Operating temperature 0℃ to +60℃! Low-end AMD Ryzen on COM Express Type 6 Compact.

"METIS" is a COM Express Rel.3.0 Compact Type 6 module equipped with the AMD Ryzen Embedded R1000 family SoC. It supports up to three Digital Display Interfaces (DDI), including DP1.3, DVI, and HDMI 1.4/2.0, allowing for three independent displays. It is applicable in a wide range of fields such as digital signage, infotainment, and biomedical applications. Please feel free to contact us for inquiries. 【Features】 ■ CPU: AMD Ryzen Embedded R1000 Processor ■ Graphics: AMD Radeon Vega GPU (with 3 compute units) ■ Connectivity: 4x USB 3.0; 8x USB 2.0; up to 5 PCI-e x1; PEG x4 Gen3 ■ Memory: Two DDR4 SO-DIMM slots supporting DDR4-2400 ECC memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "MIRANDA"

CPU module "MIRANDA"

Robust solutions for industrial environments! Introducing products that can be used in industrial temperature ranges.

The "MIRANDA" is a CPU module equipped with Intel Atom X, Intel Celeron J/N, and Intel Pentium N series processors. It features a microSD card slot and can implement an optional eMMC 5.0 drive onboard. The main application fields are avionics, biomedical/medical devices, gaming, and transportation. Please feel free to contact us if you have any inquiries. 【Features】 ■ Graphics: Intel HD Graphics 500 series controller (with up to 18 execution units) ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 5x PCI-e x1 Gen2 ■ Memory: Two DDR3L SO-DIMM slots supporting DDR3L-1866 non-ECC memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "THEBE"

CPU module "THEBE"

Introducing a scalable product with excellent performance and enhanced connectivity!

"THEBE" is a COM Express Rel.3.0 Basic Type 7 module equipped with an AMD EPYC Embedded 3000 series SoC. It can be used in an industrial temperature range and supports up to four DDR4 SO-DIMM slots with DDR4-2666 memory, compatible with both ECC and non-ECC. This is a scalable product with excellent performance and increased connectivity. Please feel free to contact us for inquiries. 【Features】 ■ CPU: AMD EPYC Embedded 3000 Family SoC ■ Networking: 4x 10GBASE-KR interfaces + 1x 1GbE port (with NC-SI) ■ Connectivity: 4x USB 3.1; 24 lanes of PCI-e Gen3 lanes ■ Memory: 4 DDR4 SO-DIMM slots supporting ECC DDR4-2666 memory, up to 128 GB *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "FINLAY"

CPU module "FINLAY"

Deep learning inference and UHD media processing! Applicable in fields such as automation and HMI.

The "FINLAY" is a SMARC Rel.2.1 compliant module equipped with Xilinx Zynq Ultrascale+ Intel Atom processor x7000E series, Intel Core i3 processor, and Intel processor N series. It enables power-efficient deep learning inference and UHD media processing in a small footprint for video and imaging-intensive applications. The memory is implemented with quad-channel LPDDR5 with IBECC. 【Specifications (excerpt)】 ■ CPU: Intel Atom processor x7000E series, Intel Core i3 processor, Intel processor N series (codename: Alder Lake N) aimed at IoT and multimedia applications. ■ Graphics: Integrated Intel UHD graphics powered by Intel Xe architecture, supporting up to three video outputs simultaneously at 4K resolution. *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "HALLEY"

CPU module "HALLEY"

SMARC Rel 2.1.1 for FuSa applications! Graphics support simultaneous three video outputs.

"HALLEY" is a SMARC module specifically designed for functional safety (FuSa) in safety-related systems. It is equipped with Intel Atom x6000E series, Intel Pentium, Celeron N, and J series processors. The FuSa-certified Intel Atom x6000E CPU complies with the requirements of IEC 61508 and ISO 13849 regarding functional safety and safety integrity levels. 【Specifications (excerpt)】 ■CPU: Intel Atom x6000E series, Intel Pentium, Celeron N, and J series processors ■Graphics: Gen11 UHD integrated graphics controller, supporting three simultaneous video outputs ■Memory: Quad-channel LPDDR4x implementation with IBECC *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "JAGER"

CPU module "JAGER"

High performance, low power consumption, and rich features! SMARC Rel. 2.1.1 module processor.

"JAGER" is a CPU module equipped with Xilinx Zynq Ultrascale+, Intel Atom X series, Intel Celeron J/N series, and Intel Pentium N series. It features high performance, low power consumption, and a rich set of functions. The memory is a dual-channel implementation of LPDDR4-2400 memory. It is applicable in various fields, including automotive, biomedical/medical devices, and multimedia devices. 【Specifications (excerpt)】 ■ CPU: Intel Atom X series, Intel Celeron J/N series, and Intel Pentium N series (formerly Apollo Lake) processors ■ Graphics: Intel HD Graphics 500 series controller, equipped with up to 18 execution units ■ Memory: Dual-channel implementation of LPDDR4-2400 memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "LEVY"

CPU module "LEVY"

Low power design for embedded applications of machine learning at a higher level!

"LEVY" is a module compliant with SMARC Rel. 2.1, equipped with the NXP i.MX 8X application processor. It features a low-power design for embedded applications in machine learning at a higher level. It is applicable in various fields such as automation, edge computing, HMI, portable devices, and robotics. 【Specifications (excerpt)】 ■ CPU: NXP i.MX 8M Plus application processor ■ Graphics: Integrated GPU, supports three simultaneous video outputs ■ Memory: Up to 4GB of implemented LPDDR4-4000 memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "WILK"

CPU module "WILK"

Equipped with MediaTek Genio 700 application processor! For information kiosks and more.

"WILK" is a SMARC Rel.2.1.1 module equipped with Xilinx Zynq Ultrascale+, Intel Atom x7000E series processors, Intel Core i3 processors, and Intel N series processors. It can be used in an industrial temperature range. The memory consists of implemented LPDDR4X-3733 memory, with a total maximum of 8GB. It is applicable in various fields, including digital signage, infotainment, biomedical/medical devices, and information kiosks. 【Specifications (excerpt)】 ■ CPU: MediaTek Genio 700 ■ Graphics: Mali G57 MC3 GPU ■ Memory: Implemented LPDDR4X-3733 memory, total maximum of 8GB *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "SOM-SMARC-ADL-N"

CPU module "SOM-SMARC-ADL-N"

High power-efficient deep learning inference and UHD media processing!

We would like to introduce the "SOM-SMARC-ADL-N" that we handle. This product performs power-efficient deep learning inference and UHD media processing in a small footprint, designed for video and imaging-intensive applications. The graphics are powered by integrated Intel UHD graphics based on the Intel Xe architecture, supporting up to three video outputs simultaneously at 4K resolution. 【Processor (excerpt)】 ■ Intel Atom x7213E, 2 cores @ 1.7 GHz (3.2 GHz Turbo), 10W TDP, TSN and TCC ■ Intel Atom x7425E, 4 cores @ 1.5 GHz (3.4 GHz Turbo), 12W TDP, TSN and TCC ■ Intel Atom x7211E, 2 cores @ 1.0 GHz (3.2 GHz Turbo), 6W TDP, TSN and TCC ■ Intel Core i3-N305, 8 cores @ 1.8 GHz (3.8 GHz Turbo), 15W TDP, TSN and TCC *For more details, please refer to the PDF document or feel free to contact us.

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Intel 8th/9th Generation COM Express CPU Module

Intel 8th/9th Generation COM Express CPU Module

COM Express Basic Size Type 6 CPU module equipped with Intel Coffee Lake-H processor

【Product Features】 - Onboard 8th/9th generation Intel i7/i5/i3 processors - Intel WGI219LM PCIe GbE PHY (with iAMT) - Dual-channel 24-bit LVDS or analog RGB - Wide voltage input range of 8.5V to 20V - Supports Intel Solid State Drive (SSD) embedded "E SKU" - Wide operating temperature range: -40 to 85°C

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AMD Ryzen COM Express CPU module

AMD Ryzen COM Express CPU module

AMD Ryzen COM Express CPU module that supports three independent displays【EmETXe-a10M0】.

【Product Features】 - Onboard AMD V1605B/V1756B/V1807B APU processor - Integrated Gigabit Ethernet - Dual-channel 24-bit LVDS or 1 x DP port, 3 x DDI ports - Supports three independent displays

  • Embedded Board Computers

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Elkhart Lake Atom COMe CPU module

Elkhart Lake Atom COMe CPU module

COM Express Type 10 CPU module [EmNANO-i2800] suitable for entry-level processing with ultra-low power consumption.

Optimal I/O count for graphics applications and mobile applications. 【Product Features】 - Onboard Intel Elkhart Lake SoC processor - Onboard LPDDR4 SDRAM - Intel Gigabit Ethernet controller - Single-channel 24-bit LVDS and 1 x DDI port - Supports Intel TCC for TSN and Atom RE/FE series processors (optional)

  • Embedded Board Computers

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CPU Module FA-M3V Series

CPU Module FA-M3V Series

Yokogawa Electric's new CPU module enhances PLC motion and reduces costs.

This is Yokogawa Electric's new CPU module. It offers a reasonable price and allows for the use of general-purpose PLCs and precise motion control.

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Ultra-compact CPU module "MultiFlex-A9"

Ultra-compact CPU module "MultiFlex-A9"

Equipped with Cortex-A9! A CPU module that achieves low power consumption and high performance.

The ultra-compact CPU module "MultiFlex-A9" is compatible with various products. Hino Engineering Co., Ltd. also provides carrier boards that can accommodate CPU boards. The carrier boards are equipped with connectors for interfaces and sockets for CPU boards, making them ideal for communication evaluation, debugging, and practical testing. 【Features】 ○ Compatible with Android ○ Equipped with video and 3D acceleration functions ○ Long-term stable supply available For more details, please contact us or download the catalog.

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