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CPU Module Product List and Ranking from 25 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

CPU Module Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. Suntex Co., Ltd. Shizuoka//Industrial Electrical Equipment
  2. SECO S.p.A Italy//Industrial Electrical Equipment
  3. ADLINKジャパン 東京本社 Tokyo//Industrial Electrical Equipment
  4. 4 ナセル Tokyo//Industrial Electrical Equipment
  5. 5 アットマークテクノ Hokkaido//Electronic Components and Semiconductors
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CPU Module Product ranking

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. NXP i.MX95 OSM CPU module OSM-IMX95 Suntex Co., Ltd.
  2. Ryzen COM Express CPU Module Type 7 Suntex Co., Ltd.
  3. NXP i.MX93 OSM CPU Module OSM-IMX93 Suntex Co., Ltd.
  4. Armadillo-610 アットマークテクノ
  5. 4 CPU module "SMARC" [LEC-ALN] ADLINKジャパン 東京本社

CPU Module Product List

91～120 item / All 194 items

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CPU module "MIRANDA"

CPU module "MIRANDA"

Robust solutions for industrial environments! Introducing products that can be used in industrial temperature ranges.

The "MIRANDA" is a CPU module equipped with Intel Atom X, Intel Celeron J/N, and Intel Pentium N series processors. It features a microSD card slot and can implement an optional eMMC 5.0 drive onboard. The main application fields are avionics, biomedical/medical devices, gaming, and transportation. Please feel free to contact us if you have any inquiries. 【Features】 ■ Graphics: Intel HD Graphics 500 series controller (with up to 18 execution units) ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 5x PCI-e x1 Gen2 ■ Memory: Two DDR3L SO-DIMM slots supporting DDR3L-1866 non-ECC memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "THEBE"

CPU module "THEBE"

Introducing a scalable product with excellent performance and enhanced connectivity!

"THEBE" is a COM Express Rel.3.0 Basic Type 7 module equipped with an AMD EPYC Embedded 3000 series SoC. It can be used in an industrial temperature range and supports up to four DDR4 SO-DIMM slots with DDR4-2666 memory, compatible with both ECC and non-ECC. This is a scalable product with excellent performance and increased connectivity. Please feel free to contact us for inquiries. 【Features】 ■ CPU: AMD EPYC Embedded 3000 Family SoC ■ Networking: 4x 10GBASE-KR interfaces + 1x 1GbE port (with NC-SI) ■ Connectivity: 4x USB 3.1; 24 lanes of PCI-e Gen3 lanes ■ Memory: 4 DDR4 SO-DIMM slots supporting ECC DDR4-2666 memory, up to 128 GB *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "FINLAY"

CPU module "FINLAY"

Deep learning inference and UHD media processing! Applicable in fields such as automation and HMI.

The "FINLAY" is a SMARC Rel.2.1 compliant module equipped with Xilinx Zynq Ultrascale+ Intel Atom processor x7000E series, Intel Core i3 processor, and Intel processor N series. It enables power-efficient deep learning inference and UHD media processing in a small footprint for video and imaging-intensive applications. The memory is implemented with quad-channel LPDDR5 with IBECC. 【Specifications (excerpt)】 ■ CPU: Intel Atom processor x7000E series, Intel Core i3 processor, Intel processor N series (codename: Alder Lake N) aimed at IoT and multimedia applications. ■ Graphics: Integrated Intel UHD graphics powered by Intel Xe architecture, supporting up to three video outputs simultaneously at 4K resolution. *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "HALLEY"

CPU module "HALLEY"

SMARC Rel 2.1.1 for FuSa applications! Graphics support simultaneous three video outputs.

"HALLEY" is a SMARC module specifically designed for functional safety (FuSa) in safety-related systems. It is equipped with Intel Atom x6000E series, Intel Pentium, Celeron N, and J series processors. The FuSa-certified Intel Atom x6000E CPU complies with the requirements of IEC 61508 and ISO 13849 regarding functional safety and safety integrity levels. 【Specifications (excerpt)】 ■CPU: Intel Atom x6000E series, Intel Pentium, Celeron N, and J series processors ■Graphics: Gen11 UHD integrated graphics controller, supporting three simultaneous video outputs ■Memory: Quad-channel LPDDR4x implementation with IBECC *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "JAGER"

CPU module "JAGER"

High performance, low power consumption, and rich features! SMARC Rel. 2.1.1 module processor.

"JAGER" is a CPU module equipped with Xilinx Zynq Ultrascale+, Intel Atom X series, Intel Celeron J/N series, and Intel Pentium N series. It features high performance, low power consumption, and a rich set of functions. The memory is a dual-channel implementation of LPDDR4-2400 memory. It is applicable in various fields, including automotive, biomedical/medical devices, and multimedia devices. 【Specifications (excerpt)】 ■ CPU: Intel Atom X series, Intel Celeron J/N series, and Intel Pentium N series (formerly Apollo Lake) processors ■ Graphics: Intel HD Graphics 500 series controller, equipped with up to 18 execution units ■ Memory: Dual-channel implementation of LPDDR4-2400 memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "LEVY"

CPU module "LEVY"

Low power design for embedded applications of machine learning at a higher level!

"LEVY" is a module compliant with SMARC Rel. 2.1, equipped with the NXP i.MX 8X application processor. It features a low-power design for embedded applications in machine learning at a higher level. It is applicable in various fields such as automation, edge computing, HMI, portable devices, and robotics. 【Specifications (excerpt)】 ■ CPU: NXP i.MX 8M Plus application processor ■ Graphics: Integrated GPU, supports three simultaneous video outputs ■ Memory: Up to 4GB of implemented LPDDR4-4000 memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "WILK"

CPU module "WILK"

Equipped with MediaTek Genio 700 application processor! For information kiosks and more.

"WILK" is a SMARC Rel.2.1.1 module equipped with Xilinx Zynq Ultrascale+, Intel Atom x7000E series processors, Intel Core i3 processors, and Intel N series processors. It can be used in an industrial temperature range. The memory consists of implemented LPDDR4X-3733 memory, with a total maximum of 8GB. It is applicable in various fields, including digital signage, infotainment, biomedical/medical devices, and information kiosks. 【Specifications (excerpt)】 ■ CPU: MediaTek Genio 700 ■ Graphics: Mali G57 MC3 GPU ■ Memory: Implemented LPDDR4X-3733 memory, total maximum of 8GB *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "SOM-SMARC-ADL-N"

CPU module "SOM-SMARC-ADL-N"

High power-efficient deep learning inference and UHD media processing!

We would like to introduce the "SOM-SMARC-ADL-N" that we handle. This product performs power-efficient deep learning inference and UHD media processing in a small footprint, designed for video and imaging-intensive applications. The graphics are powered by integrated Intel UHD graphics based on the Intel Xe architecture, supporting up to three video outputs simultaneously at 4K resolution. 【Processor (excerpt)】 ■ Intel Atom x7213E, 2 cores @ 1.7 GHz (3.2 GHz Turbo), 10W TDP, TSN and TCC ■ Intel Atom x7425E, 4 cores @ 1.5 GHz (3.4 GHz Turbo), 12W TDP, TSN and TCC ■ Intel Atom x7211E, 2 cores @ 1.0 GHz (3.2 GHz Turbo), 6W TDP, TSN and TCC ■ Intel Core i3-N305, 8 cores @ 1.8 GHz (3.8 GHz Turbo), 15W TDP, TSN and TCC *For more details, please refer to the PDF document or feel free to contact us.

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Intel 8th/9th Generation COM Express CPU Module

Intel 8th/9th Generation COM Express CPU Module

COM Express Basic Size Type 6 CPU module equipped with Intel Coffee Lake-H processor

【Product Features】 - Onboard 8th/9th generation Intel i7/i5/i3 processors - Intel WGI219LM PCIe GbE PHY (with iAMT) - Dual-channel 24-bit LVDS or analog RGB - Wide voltage input range of 8.5V to 20V - Supports Intel Solid State Drive (SSD) embedded "E SKU" - Wide operating temperature range: -40 to 85°C

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AMD Ryzen COM Express CPU module

AMD Ryzen COM Express CPU module

AMD Ryzen COM Express CPU module that supports three independent displays【EmETXe-a10M0】.

【Product Features】 - Onboard AMD V1605B/V1756B/V1807B APU processor - Integrated Gigabit Ethernet - Dual-channel 24-bit LVDS or 1 x DP port, 3 x DDI ports - Supports three independent displays

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Elkhart Lake Atom COMe CPU module

Elkhart Lake Atom COMe CPU module

COM Express Type 10 CPU module [EmNANO-i2800] suitable for entry-level processing with ultra-low power consumption.

Optimal I/O count for graphics applications and mobile applications. 【Product Features】 - Onboard Intel Elkhart Lake SoC processor - Onboard LPDDR4 SDRAM - Intel Gigabit Ethernet controller - Single-channel 24-bit LVDS and 1 x DDI port - Supports Intel TCC for TSN and Atom RE/FE series processors (optional)

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COM Express Type 10 [EmNANO-iX701]

COM Express Type 10 [EmNANO-iX701]

Intel Amston Lake Atom CPU equipped Mini COM Express Type 10 CPU module

Main Features - Onboard Intel Amston Lake SoC processor - Onboard LPDDR5 SDRAM - Intel 2.5 Gigabit Ethernet controller - Single-channel 24-bit LVDS + DDI port x1 - Supports Intel TCC (Time Coordinated Computing)

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CPU Module FA-M3V Series

CPU Module FA-M3V Series

Yokogawa Electric's new CPU module enhances PLC motion and reduces costs.

This is Yokogawa Electric's new CPU module. It offers a reasonable price and allows for the use of general-purpose PLCs and precise motion control.

  • controller
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CPU board "XPedite7750"

CPU board "XPedite7750"

Suitable for high bandwidth and processing-intensive requirements in commercial, industrial, and military applications! Comprehensive catalog and case materials are available.

The "XPedite7750" is a COM Express Type 7 CPU module equipped with the Intel Xeon D-1700 (formerly Ice Lake-D) processor. Its small footprint and standard form factor make it suitable for portable and harsh environments while providing a future upgrade path. The onboard memory supports 32GB of DDR4 ECC SDRAM in a dual-channel configuration, supporting memory-intensive applications. 【Features】 ■ COM Express expansion Type 7 pinout ■ Conductive cooling standard compliant ■ Equipped with 32GB of SLC NAND flash ■ PCI Express x16 lane Gen3 interface ■ 4x USB 3.0 ports ■ 2x LVTTL serial ports *For more details, please download the PDF (English version) or feel free to contact us.

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Ultra-compact CPU module "MultiFlex-A9"

Ultra-compact CPU module "MultiFlex-A9"

Equipped with Cortex-A9! A CPU module that achieves low power consumption and high performance.

The ultra-compact CPU module "MultiFlex-A9" is compatible with various products. Hino Engineering Co., Ltd. also provides carrier boards that can accommodate CPU boards. The carrier boards are equipped with connectors for interfaces and sockets for CPU boards, making them ideal for communication evaluation, debugging, and practical testing. 【Features】 ○ Compatible with Android ○ Equipped with video and 3D acceleration functions ○ Long-term stable supply available For more details, please contact us or download the catalog.

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Argon Corporation Rugged CPU Unit ACB200

Argon Corporation Rugged CPU Unit ACB200

Compact, lightweight, low power consumption rugged CPU unit. Ideal for installation in aircraft, drones, and defense vehicles! Compliant with MIL-STD-810 and 461.

Argon is an American company that designs and manufactures displays and PCs ranging from 5 to 43 inches for military use. They specialize in customization of MIL connectors, switch placements, and button positions. Their products comply with military standards MIL-STD-810, MIL-STD-461, and MIL-STD-901, boasting environmental performance with an operating temperature range of -10 to +55°C. An operating temperature option down to -40°C is also available. ■ Japanese technical documentation on MIL-STD-810, MIL-STD-461, and IP standards is available. If you would like to see it, please contact sales@nacelle.co.jp ■

  • Industrial PCs
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Argon Corporation Rugged CPU Unit ACB300

Argon Corporation Rugged CPU Unit ACB300

Compact, lightweight, energy-efficient rugged CPU unit. Ideal for installation in aircraft, drones, and defense vehicles! Compliant with MIL-STD-810 and 461.

Argon Corporation: An American company that designs and manufactures displays and PCs ranging from 5 to 43 inches for military applications. They specialize in customization of MIL connectors, switch placements, and button locations. They comply with military standards MIL-STD-810, MIL-STD-461, and MIL-STD-901, boasting environmental performance with an operating temperature range of -10 to +55°C. The operating temperature can also be supported down to -40°C as an option.

  • Industrial PCs
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Portwell CPU Module PCOM-B638VG

Portwell CPU Module PCOM-B638VG

6th generation Core i7-6600U/i5-6300U/i3-6100U/3955U Skylake-U equipped CPU module

Features ■ Type 6 COM Express module ■ Equipped with 6th generation Core i7-6600U/i5-6300U/i3-6100U/3955U Skylake-U ■ DDR4-1866 Non-ECC SODIMM x 1 (up to 16GB) ■ Supports VGA, LVDS/eDP, 2x DDI (DP/HDMI/DVI) displays (carrier board) ■ PCI Express Gen3 compatible (carrier board)

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Portwell CPU Module PCOM-B634VG

Portwell CPU Module PCOM-B634VG

6th Generation Intel Xeon D (Broadwell-DE) processor equipped CPU module

Features ■ Type 6 COM Express module ■ Equipped with 6th generation Xeon D-1548/Xeon D-1539/Xeon D-1527 ■ DDR4-2133 ECC/Non-ECC SODIMM (up to 48GB) x3 ■ Supports VGA, HDMI, 10GbE LAN ■ PCI Express Gen3 compatible (1x PCIEx16, 8x PCIEx8)

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ADLINK Qseven CPU Module Q7-AL

ADLINK Qseven CPU Module Q7-AL

Equipped with Atom E3900/Pentium N4200/Celeron N3350 CPU

Features ■ Equipped with Atom E3900/Pentium N4200/Celeron N3350 CPU. ■ Onboard memory 2400MHz LPDDR4 (up to 8GB) ■ Intel 9th generation low power graphics, 4K resolution/H.265 codec ■ Dual channel LVDS (18/28-bit) or 2x eDP, HDMI/DP ■ 2x MIPI CSI camera (2/4 lanes) ■ GbE, USB3.0, 2 SATA3 (6.0GBit/s) ■ Featuring Sema for easy integration of hardware monitoring and controlling ■ Compliant with Qseven 2.1 ■ Extended operating temperature: -40℃ to +85℃ (optional)

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SECO COM Express CPU Module JULIET

SECO COM Express CPU Module JULIET

type7 Xeon D-1700 (Ice Lake-D), 4xDDR4-2400/2666/2933 ECC maximum 128GB

Features ■ Intel Xeon D-1700 processors ■ 4x Superspeed USB 5Gbps; 16x PCI-e Gen4 lanes + 16x PCI-e Gen3 lanes ■ 4x 10GBASE-KR interfaces + 1x 1GbE port with NC-SI ■ Up to four DDR4 SO-DIMM Slots supporting DDR4-2933 memory with ECC, up to 128GB

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SECO COM Express CPU Module TARVOS

SECO COM Express CPU Module TARVOS

COMe-B09-BT6, Type6 7th/6th Gen Core i7/i5/i3/Xeon

Features ■ COM Express Basic Size Type 6 ■ Intel 6th and 7th Generation Core/Xeon CPU ■ 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3 ■ Intel HD Graphics 530/P530/630/P630 ■ 2x DDR4 So-DIMM slots

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SECO COM Express CPU Module MIRANDA

SECO COM Express CPU Module MIRANDA

COMe-C24-CT6, Pentium N4200/Celeron J/N3x00/Atom X7/x5-E3900

Features ■ COM Express 3.0 Basic Size Type 6 ■ Intel Atom X, Intel Celeron J/N, Intel Pentium N series processors ■ 4x USB 3.0; 8x USB 2.0; 5x PCI-e x1 Gen2 ■ Intel HD Graphics 500 series controller with up to 18 execution units ■ 2x DDR3L SO-DIMM slots (supports DDR3L-1866 non-ECC memory)

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SECO COM Express CPU Module CHANDRA

SECO COM Express CPU Module CHANDRA

COMe-A41-CT6, Type 6 Celeron J/N/Atom E3800 series, 2xDDR3L-1333 maximum 8G

Features ■ Compatible with COM Express Compact Type 6 ■ Intel Atom E3800 and Celeron family (formerly Bay Trail) ■ 4x USB 3.0; 7x USB 2.0; 4x PCI-e x1 Gen2 ■ Intel Integrated HD Graphics 4000 series controller ■ 2x DDR3L SO-DIMM slots (up to 8G)

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SECO COM Express CPU Module THEBE

SECO COM Express CPU Module THEBE

COMe-C42-BT7, Type 7 AMD EPYC Embedded 3000, 4xDDR4-2666 ECC maximum 128GB

Features ■ COM Express R3.0 Type 7 Basic equipped with AMD EPYC Embedded 3000 ■ 4x USB 3.1; 24x PCI-e Gen3 lanes ■ 4x 10GBASE-KR interfaces + 1x 1GbE port (with NC-SI) ■ Supports up to 128GB of ECC DDR4-2666 memory with 4 DDR4 SO-DIMM slots

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SECO COM Express CPU Module OPHELIA

SECO COM Express CPU Module OPHELIA

Type6 Compact AMD Ryzen Embedded V2000, 2xDDR4-3200 ECC up to 64GB

Features ■ Embedded Ryzen V Series V2000FP6 platform equipped with "Zen2" CPU and Radeon GPU core ■ 1x GbE; 1x SuperSpeed USB 10Gbps; 3x SuperSpeed USB 5Gbps; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x8 Gen3 ■ Integrated AMD Radeon GPU with up to 7 computing units ■ Two DDR4 SO-DIMM slots supporting up to 64GB of DDR4-3200 ECC and non-ECC memory ■ Adopts COM Express Compact Type 6 module

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SECO COM Express CPU Module AMOS

SECO COM Express CPU Module AMOS

COMe-A98-CT6, Type 6 AMD Embedded Third Generation R/G Series, 2xDDR4-2133 ECC Maximum 64GB

Features ■ AMD built-in 3rd generation R series SOC or G series SOC-I ■ 4x USB 3.0; 8x USB 2.0; 3x PCI-e x1 Gen3 ■ AMD Radeon 3rd -Generation Graphics Core Next (GCN) ■ Two SO-DIMM slots supporting DDR4 ECC and non-ECC modules

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SECO NXP Qseven CPU Module MAIA

SECO NXP Qseven CPU Module MAIA

NXP i.MX 8X family, ARM Cortex-A72, equipped with up to 8GB of onboard LPDDR4-3200.

Features ■ Equipped with NXP i.MX 8 application processor ■ 1x USB 3.0; PCI-e x1 Gen3; CSI camera connector; supports boot select signal ■ Integrated GPU, supports two independent displays ■ Equipped with LPDDR4-3200 memory ■ Operating temperature 0–60℃ (optional: -40℃–85℃) ■ Dimensions: 70 x 70 mm (2.76” x 2.76”) ■ OS Linux/Yocto/Android

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
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SECO NXP Qseven CPU Module Q7-C25

SECO NXP Qseven CPU Module Q7-C25

NXP i.MX 8M family, equipped with ARM Cortex-A53 and onboard LPDDR4-2400.

Features ■ Equipped with NXP i.MX 8M application processor ■ Supports 1x USB 3.0; 4x USB 2.0; up to 2x PCI-e x1 Gen2; 1x CAN Bus; 2x UART; 8x GPI/Os ■ Integrated GPU, supports two independent displays ■ Equipped with LPDDR4-2400 memory ■ Operating temperature 0 to 60℃ (optional: -40℃ to 85℃) ■ Dimensions: 70 x 70 mm (2.76” x 2.76”) ■ OS Linux/Yocto/Android

  • Embedded Board Computers
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SECO μQseven CPU Module LIBERTAS

SECO μQseven CPU Module LIBERTAS

μQ7-962, μQseven NXP i.MX 6 family, ARM Cortex-A9, equipped with onboard DDR3L.

Features ■ Equipped with single-core, dual-core, and quad-core (ARM Cortex-A9 core) ■ 4x USB 2.0; 2x Serial ports; Supports CAN Bus ■ Equipped with dedicated 2D/3D graphics processor ■ Onboard DDR3L with a maximum of 2GB memory ■ Operating temperature 0–60℃ (Optional: -40℃–85℃) ■ Dimensions: 40 x 70 mm (1.57” x 2.76”) ■ OS Linux/Yocto

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