Last Updated： Aggregation Period:Sep 23, 2026～Oct 20, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 23, 2026～Oct 20, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 23, 2026～Oct 20, 2026
This ranking is based on the number of page views on our site.
121～150 item / All 200 items
μQ7-962, μQseven NXP i.MX 6 family, ARM Cortex-A9, equipped with onboard DDR3L.
Features ■ Equipped with single-core, dual-core, and quad-core (ARM Cortex-A9 core) ■ 4x USB 2.0; 2x Serial ports; Supports CAN Bus ■ Equipped with dedicated 2D/3D graphics processor ■ Onboard DDR3L with a maximum of 2GB memory ■ Operating temperature 0–60℃ (Optional: -40℃–85℃) ■ Dimensions: 40 x 70 mm (1.57” x 2.76”) ■ OS Linux/Yocto
μQ7-A75-J, μQseven NXP i.MX 6 Family, ARM Cortex-A9, equipped with onboard DDR3L
Features ■ Equipped with single and dual-core Lite (ARM Cortex A9 core) ■ Supports Fast Ethernet; GPI/O ■ 4x USB 2.0; 2x Serial ports; Supports CAN Bus ■ Equipped with dedicated 2D/3D graphics processor ■ Onboard with up to 1GB DDR3L memory ■ Operating temperature 0–60℃ (Optional: -40℃–85℃) ■ Dimensions: 40 x 70 mm (1.57” x 2.76”) ■ OS Linux/Yocto
Trizeps SODIMM-200 CPU module (size 67.6x36.7mm), NXP i.MX 8M Plus
Features ■ Equipped with NXPi.MX8MPlus application processor ■ Supports 2x Gigabit Ethernet, 2x USB 3.0, 2x CAN-FD, PCIe, LVDS, 2x MIPI-CSI, WiFi/Bluetooth ■ Integrated GPU with multi-display support GC520L2D accelerator + GC7000UL3D accelerator ■ Onboard LPDDR4-4000 memory up to 8GB ■ Operating temperature 0 to 70°C (optional: -40°C to 85°C) ■ Dimensions: 67.6 x 36.7 x 6.4 mm ■ OS Win10 IoT/Debian/Yocto/Android
Trizeps SODIMM-200 CPU module (size 67.6x36.7mm), NXP i.MX 8M family
Features ■ Equipped with NXPi.MX8M application processor ■ Supports 1x Gigabit Ethernet, WiFi/Bluetooth, 2x USB 3.0 ■ Integrated GPU that supports multi-display ■ Onboard LPDDR4-3200 memory up to 8GB ■ Operating temperature 0 to 70℃ (optional: -40℃ to 85℃) ■ Dimensions: 67.6 x 36.7 x 6.4 mm ■ OS Win10 IoT/Debian/Yocto/Android
SM-C12, NXP i.MX 8M Family, ARM Cortex-A53, Size 50x82mm
Features ■ Equipped with NXP i.MX 8M Plus application processor ■ Supports WiFi + BT LE; CSI camera; QuadSPI interface; 14x GPI/Os ■ Integrated GPU that supports two independent displays ■ Onboard LPDDR4-4000 with a maximum of 6GB memory ■ Operating temperature 0 to 60℃ (optional: -40℃ to 85℃) ■ Size: 50 x 82 mm (1.97” x 3.23”) ■ Compatible with OS Linux/Yocto/Android
NXP i.MX 8X Family, ARM Cortex-A35, size 50x82mm
Features ■ Equipped with NXP i.MX 8X Plus application processor ■ 2x Gigabit Ethernet; optional Wi-Fi + BT 5.0; CSI camera; 2x USB 3.0; 3x USB 2.0; 1x PCI-e x1; 2x CAN Bus; 4x UART; 14x GPIOs; supports QuadSPI interface ■ Integrated GPU supporting two independent displays ■ Onboard LPDDR4-2400 with up to 4GB memory ■ Operating temperature 0 to 60℃ (optional: -40℃ to 85℃) ■ Size: 50 x 82 mm (1.97” x 3.23”) ■ Compatible with OS Linux/Android
Qualcomm Snapdragon 410E ARM Cortex-A53, size 48x32mm
Features ■ Equipped with Qualcomm Snapdragon 410E low-power processor ■ Onboard WLAN 802.11 b/g/n 2.4 GHz, Bluetooth 4.1, USB 2.0, supports LVDS, MIPI Display, and Camera ■ Supports OpenGL ES 3.0, OpenCL/DirectX 12 graphic acceleration for Windows 10 IoT Core ■ Onboard LPDDR4-2400 memory up to 4GB ■ Operating temperature -25 to 85℃ ■ Size: 48 x 32 x 4.2mm (without antenna) ■ Compatible with OS Win10 IoT/Linux/Android
NXP i.MX 8M Mini Family, ARM Cortex-A53, size 48x32mm
Features ■ Equipped with NXPi.MX 8M Mini and i.MX8MNano application processors ■ Supports 1x Gigabit Ethernet, USB 2.0, and LVDS ■ GC320 2D accelerator + GCNanoUltra 3D accelerator ■ Onboard LPDDR4-3200 with up to 8GB of memory ■ Operating temperature: 0 to 70°C (Optional: -40 to 85°C) ■ Size: 48.0 x 32.0 x 4.2 mm ■ OS support: Win10 IoT/Debian/Yocto/Android
Equipped with Pentium N4200/Celeron J/N3x00/Atom X7/x5-E3900, DDR3L-1866 memory.
Features ■ Compatible with Intel Atom X series, Intel Celeron J/N series, and Intel Pentium N series ■ Supports 2x USB 3.0; 4x PCI-e; 6x USB 2.0 ■ Integrated Gen9-LP Graphics controller ■ Onboard DDR3L-1866 with a maximum of 8GB memory ■ Operating temperature 0–60℃ (optional: -40℃–85℃) ■ Dimensions: 70 x 70 mm (2.76” x 2.76”) ■ OS: Win10 IoT/Linux/Yocto
Intel Atom E3800 and Celeron family, equipped with onboard DDR3L-1333 memory up to 4GB.
Features ■ Compatible with Intel Atom E3800 and Celeron families ■ 4x USB 2.0; 1x USB 3.0; 3x PCI-e x1; supports LPC Bus ■ Integrated Intel HD Graphics 4000 Series controller ■ Onboard DDR3L-1333 memory, up to 4GB ■ Operating temperature 0 to 60°C ■ Dimensions: 40 x 70 mm (1.57 x 2.76) ■ OS Win10/8.1/7/Linux/Yocto
11th Core i series (Tiger Lake-UP3), equipped with 2xDDR4-3200 ECC memory, maximum 64GB.
Features ■ Supports 11th generation Intel Core processors and Intel Celeron processors ■ 4x USB 4.0 / USB 3.2; 4x USB 2.0; 8x PCI-e x1 Gen3; 1x PCI-e x4 Gen4; supports up to 2x 2.5GbE ■ Intel Iris Xe Graphics Core Gen12 GPU with up to 96 EU, supports up to 4 independent displays ■ Equipped with 2x DDR5-4800 memory, maximum 64GB ■ Operating temperature 0 to 60℃ (optional: -40 to 85℃) ■ Dimensions: 120x95mm ■ OS: Win10 IoT/Linux/Yocto/VxWorks7.0/Android
Jetway, supports Intel Bay Trail N2930 SoC CPU, 1xDDR3L-1333 up to 8GB.
Features ■ NUC Form Factor (101mm×101mm) ■ Compatible with Intel Baytrail N2930 SoC Processor ■ Equipped with 1xDDR3L-1333 (up to 8GB) memory ■ 1xUSB3.0, 3xUSB2.0, 1xCOM Port, 2xRealtek RTL8119I GbE ■ Supports wide power supply DC9–24V ■ Supports a wide operating temperature range of -20–60℃
Jetway, supports Intel Apollo Lake Celeron J3455 CPU, size 101x101mm
Features ■ NUC Form Factor (101mm×101mm) ■ Compatible with Intel Apollo Lake Celeron J3455 Processor ■ Equipped with 1xDDR3L-1866 (up to 8GB) memory ■ Supports 4xUSB3.0, 2xUSB2.0, 1xCOM Port, 2xRJ45, 1xSATAIII (6 Gb/s) ■ Supports 1x full size mSATA, 1x half size Mini PCIe Slot, 1x SIM card holder ■ Compatible with AT/ATX power supply
Jetway, supports Intel Apollo Lake J3455 SoC CPU, 1xDDR3L-1866 up to 8GB.
Features ■ NUC Form Factor (101mm×101mm) ■ Compatible with Intel Apollo Lake J3455 SoC Processor ■ Equipped with 1xDDR3L-1866 (up to 8GB) memory ■ Supports 3xUSB3.0, 2xUSB2.0, 1xRS232/422/485, 2xRJ45, 1xSATAIII ■ Supports 1xM.2 E-key (2230) for PCIe x1/USB2.0 interface expansion ■ Operating temperature range of 0 to 60℃
Type7 Module Up to 8 cores Ryzen V3000, 4xDDR5-4800 ECC maximum 64GB
【ADLINK Express-VR7 Features】 ■AMD Embedded Ryzen V3000 Processor ■Up to 8 cores, 16 threads ■Supports AT/ATX power supply ■Up to 64GB DDR5 (up to 4800 MT/s) ■14x PCIe Gen4 lanes ■2x 10G Ethernet, 1x 2.5G Ethernet support ■4x USB 3.x/2.0 or 4x USB 2.0/1.1 ■2x SATA 6Gb/s (SATA 0,1) ■Wide operating temperature range: Supports 0°C to 60°C
Type6 Module 13th Gen Raptor Lake-P i7/i5/i3, 1xDDR5-4800 up to 64GB
【ADLINK Express-RLP Features】 ■ 13th Generation Intel Core Processor ■ Up to 14 cores (6 P-cores, 8 E-cores), 20 threads ■ Intel AVX-512 VNNI, Intel Turbo Boost ■ Intel Iris Xe Graphics ■ Up to 64GB DDR5 (up to 4800 MT/s) ■ 1 PCIe x8 Gen4, 2 PCIe x4 Gen4 lanes ■ 2.5GbE, TSN compliant ■ 4x USB 3.2/2.0/1.1 (USB 0-3) and 4x USB 2.0/1.1 (USB 4-7) ■ 2x SATA 6Gb/s ■ NVMe SSD compatible
ADLINK, dimensions 160X120 mm, 13th generation Core i9/i7/i5/i3, 2xDDR5-3200 up to 128GB
【ADLINK COM-HPC-cRLS Features】 ■ Supports 13th generation Intel Core i9/i7/i5/i3 processors ■ Up to 24 cores, 32 threads (8 P-cores, 16 E-cores) ■ Up to 128GB DDR5 (up to 4800 MT/s) ■ Intel AVX-512 VNNI, Intel DL Boost ■ Intel UHD 770 Xe graphics ■ 16x PCIe Gen5, 8x PCIe Gen4 lanes, 14x PCIe Gen3 lanes ■ 2x 2.5GbE, Intel TCC, TSN capable ■ 4x USB 3.0/2.0/1.1, 8x USB 2.0 ■ 2x SATA, 2x UART, 12x GPIO
Equipped with Ultra7-MS3/Ultra7-T4/Ultra5-MS1/Ultra5-T3, 2xDDR5-5600, maximum 64GB.
【ADLINK cExpress-MTL Features】 ■PICMG COM.0: Rev 3.1 Type 6 ■COM Express CPU module (compact size 95x95mm) ■Compatible with Type 6 Module Ultra7-MS3/Ultra7-T4/Ultra5-MS1/Ultra5-T3 ■2xDDR5-5600 up to 96GB ■Supports 2x USB 3.2/2.0/1.1, 2x USB 3.2 (BOM option), 6x USB 2.0/1.1, 2x SATA 6Gb/s, 2x UART ■PCIe x8 Gen4, lanes 16-23, PCIe x4 Gen4, lanes 24-27, PCIe x4 Gen4, lanes 28-31, supports up to 8 PCIe x1 Gen4 lanes (optional) ■Supports 1x 2.5GbE Ethernet (TSN option) ■Supports ATX/AT power supply ■Upgrades all PCIe signals to Gen4 ■Supports 2x USB4 (optional) ■Operating temperature range of 0 to 60°C
ADLINK, NXP i.MX 93 with 2-core Arm Cortex-A55 & M33, LPDDR4L up to 2GB
【ADLINK OSM-IMX93 Features】 ■Dimensions: 45mm x 45mm ■NXP i.MX93 series (2-core Arm Cortex-A55 + M33) ■Equipped with TrustZone technology supporting Armv8 cryptographic functions ■Supports Arm Ethos U-65 micro NPU ■Supports independent display via 1x MIPI DSI ■LPDDR4L up to 2GB ■3x USB 2.0, 1x USB 2.0, 4x UART, 2x CAN2.0, 2x SPI, 1x I²S interface, 2x I2C interfaces, 16x GPIO ■Dual GbE (one port supports TSN) ■Certified to IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
NXP i.MX 95 with 6x Arm Cortex-A55, LPDDR4L up to 8GB, eMMC up to 128GB
**ADLINK OSM-IMX95 Features** - Dimensions: 45mm x 45mm - i.MX95 series (equipped with 4-core or 6-core Cortex-A55, Cortex-M7, and M33 MCU) - DSI and LVDS graphic output interfaces - LPDDR4L up to 8GB - eMMC up to 128GB - 1x USB 3.0, 1x USB 2.0, 4x UART, 3x SPI, 2x I²S interfaces, 4x I2C interfaces, 12x GPIO, 1x GEN3 single lane - Dual GbE (TSN compatible) - Certified to IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
Alder Lake-N N97 / Amston Lake Atom x7433RE,LPDDR5-5500 16GB/8GB
【IEI iSMC-ASL Features】 ■SMARC CPU module (size 82x50mm) ■Intel Alder Lake-N/Amston Lake on-board SoC, Alder Lake-N N97 SoC, Atom x7433RE SoC processor ■LPDDR5-5500 16GB/8GB ■Storage: 1 x eMMC: onboard eMMC option (up to 256G), 1 x SATA: signal to baseboard, 6Gb/s ■Display port: 1 x DisplayPort (1.1a), 1 x HDMI, 1 x LVDS ■2x 2.5 GbE RJ45 LAN, 6 x USB 2.0, 2 x USB 3.2, SATA 6Gb/s, 1x USB 2.0, 4 x RS-232 ■Expansion slots: 4 x PCIe x1: signal to baseboard supported ■Supports 5V DC power supply ■Operating temperature range: 0°C to 60°C
Type10 Module Atom x7835RE/x7433RE/x7211RE onboard LPDDR5 up to 32GB
【ADLINK nanoX-ASL Features】 ■ COM Express R3.1 compliant Mini size (84mm × 55mm) ■ Equipped with Intel Atom x7000RE processor (up to 8 cores, TDP 6–12W) ■ Includes Intel UHD Graphics ■ Supports up to 32GB LPDDR5 onboard memory (up to 4800MHz) ■ Video output support: DisplayPort (DP), HDMI, DVI, LVDS ■ Capable of displaying 3 screens simultaneously at 4K60 HDR ■ 2.5GbE Ethernet (TSN support is optional) ■ 2 x USB 3.2, 8 x USB 2.0, 2 x SATAIII (600 MB/s) ■ Wide operating temperature range from -40℃ to +85℃
ADLINK, N250, LPDDR5-4800 up to 16GB, eMMC up to 256GB
【ADLINK LEC-TWL Features】 ■ SMARC CPU module (size 82x50mm) ■ Supports Intel Atom series 2-core, 4-core, and 8-core processors ■ Equipped with up to 16GB LPDDR5 memory ■ Storage: 1 x eMMC: onboard eMMC option (up to 256G), 1 x SATA Gen3 ■ 4K resolution compatible display port: 1 x DisplayPort (1.1a), 1 x HDMI ■ Supports dual-channel LVDS (18-bit/24-bit, optional) ■ 2x 2.5 GbE RJ45 LAN, 2x USB 3.2, 4x USB 2.0, 4x UART, 2x CAN2.0A, 4x PCIe x1 Gen3 ■ Supports 5V DC power supply ■ Operating temperature range: 0℃ to 60℃
Alder Lake Core i3-N305/N97/N50, LPDDR5-4800 up to 16GB, eMMC up to 256GB
【ADLINK LEC-TWL Features】 ■ SMARC CPU module (size 82x50mm) ■ Intel i3-N305 / Intel N97 / Intel N50 processors (Alder Lake) ■ Up to 16GB LPDDR5 memory ■ Storage: 1 x eMMC: onboard eMMC option (up to 256G), 1 x SATA Gen3 ■ 4K resolution compatible display port: 1 x DisplayPort (1.1a), 1 x HDMI ■ Dual-channel LVDS (18-bit/24-bit, optional) support ■ 2x 2.5 GbE RJ45 LAN, 2x USB 3.2, 4x USB 2.0, 4x UART, 2x CAN2.0A, 4x PCIe x1 Gen3 ■ Supports 5V DC power supply ■ Operating temperature range: 0℃ to 60℃
Providing new upgrade paths for various applications such as automation and in-vehicle systems!
The PCOM-B706GT is a COM-Express Type 7 module equipped with an AMD Embedded Ryzen V3000 series CPU. It supports up to 8 cores/16 threads and features two 10G KR ports, along with PCI-Express Gen4 signals, making it suitable for various applications that require high throughput. Although optional, it also supports the installation of an onboard SSD on the CPU module and temperature expansion from -40°C to 85°C. 【Features】 ■ Equipped with AMD Embedded Ryzen V3000 CPU ("Zen3" core) ■ Supports DDR5 memory ■ Operates within a temperature range of -40°C to 85°C (only for certain compatible CPUs) ■ Optional onboard NVMe storage can also be installed *For more details, please download the PDF or feel free to contact us.
7th Generation Intel Atom x7000RE & x7000C Processor Equipped SMARC Short Size Module
The ADLINK LEC-ASL is a SMARC module compatible with 2/4/8 core Intel Atom x7000RE (x7211RE, x7213RE, x7433RE, x7835RE) and x7000C (x7203C, x7405C, x7809C) processors (formerly Amston Lake), integrating Intel UHD graphics and high-speed interfaces. The LEC-ASL module supports up to 16GB LPDDR5 memory and up to 256GB eMMC storage (build option), making it ideal for mission-critical fanless edge computing applications that operate 24/7, thanks to its robust operating temperature range and low power envelope.
The heart of the CPU board is realized on a small board! Designed and developed to specifications that suit the customer's needs.
N.M.R. Corporation handles "CPU Modules." This product realizes the heart of the CPU board on a small board. Various peripheral interfaces can be designed and developed according to the customer's specifications. Notably, it significantly differs from the ETX standard by adding PCI Express interfaces and many I/Os. 【Product Lineup】 ■ICE-BT-T10 ■ICE-BT-T10W2 ■ICE-ULT3 ■ICE-BT-T6 ■iQ7-BT-E38001 ■iQ7-BT-E38001W2 *For more details, please refer to the PDF materials or feel free to contact us.
![Q-Seven CPU Module [EQM-APL]](https://image.mono.ipros.com/public/product/image/f9b/2001068349/IPROS26794018305600557490.png?w=280&h=280)
Q-Seven module equipped with Intel processor
Avalue's rugged environmental system is specially designed for long-term operation in harsh environments. Additionally, it is designed to maintain reliability in computer processing even under severe usage conditions. For more details, please contact us or download the catalog.
Ultra-small, low power consumption
It features mainstream value tablets and small-screen 2-in-1 devices designed for Intel Atom processors. End users benefit from powerful graphics performance, built-in security, and OS flexibility. This system-on-chip (SoC) is based on Intel's Silvermont microarchitecture using 22 nm process technology. The 64-bit quad-core SoC with Intel HD Graphics provides a low-power solution that excels in computing and graphics performance compared to the previous generation platform, and it includes Intel Burst Technology and Intel Wireless Display. For more details, please refer to the PDF document or feel free to contact Fuji Soft. https://www.fsi-embedded.jp/product_detail/10422/
Compact, low power consumption
It features mainstream value tablets and small-screen 2-in-1 devices designed for Intel Atom processors. End users benefit from powerful graphics performance, built-in security, and OS flexibility. This system-on-chip (SoC) is based on Intel's Silvermont microarchitecture using 22 nm process technology. The 64-bit quad-core SoC with Intel HD graphics provides a low-power solution that excels in computing and graphics performance compared to the previous generation platform, and it includes Intel Burst Technology and Intel Wireless Display. For more details, please refer to the PDF document or feel free to contact Fuji Soft. https://www.fsi-embedded.jp/product_detail/8946/
