Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
61～75 item / All 196 items
Qseven compliant, CPU module equipped with NXP i.MX6
■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Possible to design carrier boards compatible with both ARM and x86 ■Many options available such as Intel, AMD, NXP ■Flexibility in functionality increase or decrease due to BOM component changes ■Short development period, quick market launch
μQseven compliant CPU module equipped with NXP i.MX 8M Mini or NXP i.MX 8M Nano.
■Reduces overall development costs ■Global common standard ■Compatible and no issues with successor products ■Long-term supply ■Possible to design carrier boards compatible with both ARM and x86 ■Many options available such as Intel, AMD, NXP ■Flexibility in functionality increase or decrease through BOM component changes ■Short development period, quick market launch
Qseven Rev. 2.1 compliant CPU module with NXP i.MX8M.
■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Possible to achieve carrier board design compatible with both ARM and x86 ■Many options available, including Intel, AMD, NXP, etc. ■Flexibility in functionality increase or decrease due to BOM component changes ■Short development period, quick market launch
Qseven Rev. 2.1 compliant CPU module with Intel Apollo Lake.
■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Feasible design of carrier boards compatible with both ARM and x86 ■Many options available, including Intel, AMD, NXP, etc. ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
COM-HPC compliant CPU module with Intel Tiger Lake UP3 (Client)
■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
COM-EXPRESS TYPE6 compliant CPU module with AMD Ryzen V1000 (compact)
■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
COM-EXPRESS TYPE7 compliant CPU module with Intel Xeon D1700 (Basic)
■Reduces overall development costs ■Global common standard ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
COM-EXPRESS TYPE6 compliant CPU module with AMD Ryzen R1000 (compact)
■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
COM-EXPRESS TYPE6 compliant, Intel Apollo Lake equipped CPU module (compact)
■Reduces overall development costs ■Global standard specifications ■Compatible and no issues with successors ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
COM-EXPRESS TYPE6 compliant CPU module with Intel Coffee Lake (Basic)
■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
COM-EXPRESS TYPE6 compliant, CPU module equipped with AMD Ryzen V2000 (compact)
■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
COM-HPC compliant CPU module with Intel Alder Lake H (Client)
■Reduces overall development costs ■Global standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
SMARC Rev. 2.1.1 compliant, Intel Elkhart Lake【HALLEY】
■Reduces overall development costs ■Global standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Feasible to design carrier boards compatible with both ARM and x86 ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
SMARC Rev. 2.1.1 compliant, Intel Apollo Lake【JAGER】
■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Feasible design of carrier boards compatible with both ARM and x86 ■Flexibility in function increase or decrease due to BOM component changes ■Short development period, quick market launch
SMARC Rev. 2.1.1 compliant CPU module with NXP i.MX8M Plus
■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Feasible design of carrier boards compatible with both ARM and x86 ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
