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CPU Module Product List and Ranking from 25 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.

CPU Module Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.

  1. Suntex Co., Ltd. Shizuoka//Industrial Electrical Equipment
  2. SECO S.p.A Italy//Industrial Electrical Equipment
  3. 富士ソフト インダストリービジネス事業部 Kanagawa//software
  4. 4 ARBOR Technology Corp. Taiwan//IT/Telecommunications
  5. 5 ナセル Tokyo//Industrial Electrical Equipment
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CPU Module Product ranking

Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.

  1. NXP i.MX95 OSM CPU module OSM-IMX95 Suntex Co., Ltd.
  2. Omron PLC Safety CPU Unit NX-SL3/SL5 因幡電機産業 産機カンパニー
  3. NXP i.MX93 OSM CPU Module OSM-IMX93 Suntex Co., Ltd.
  4. CPU module "MAIA" SECO S.p.A
  5. Argon Corporation Rugged CPU Unit for Installation ACB100 ナセル

CPU Module Product List

121～150 item / All 182 items

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SECO Qseven CPU Module NAOS

SECO Qseven CPU Module NAOS

Equipped with Pentium N4200/Celeron J/N3x00/Atom X7/x5-E3900, DDR3L-1866 memory.

Features ■ Compatible with Intel Atom X series, Intel Celeron J/N series, and Intel Pentium N series ■ Supports 2x USB 3.0; 4x PCI-e; 6x USB 2.0 ■ Integrated Gen9-LP Graphics controller ■ Onboard DDR3L-1866 with a maximum of 8GB memory ■ Operating temperature 0–60℃ (optional: -40℃–85℃) ■ Dimensions: 70 x 70 mm (2.76” x 2.76”) ■ OS: Win10 IoT/Linux/Yocto

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • CPU Module

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SECO Qseven CPU Module KUMA

SECO Qseven CPU Module KUMA

Intel Atom E3800 and Celeron family, equipped with onboard DDR3L-1333 memory up to 4GB.

Features ■ Compatible with Intel Atom E3800 and Celeron families ■ 4x USB 2.0; 1x USB 3.0; 3x PCI-e x1; supports LPC Bus ■ Integrated Intel HD Graphics 4000 Series controller ■ Onboard DDR3L-1333 memory, up to 4GB ■ Operating temperature 0 to 60°C ■ Dimensions: 40 x 70 mm (1.57 x 2.76) ■ OS Win10/8.1/7/Linux/Yocto

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • CPU Module

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SECO COM-HPC CPU Module CARINA

SECO COM-HPC CPU Module CARINA

11th Core i series (Tiger Lake-UP3), equipped with 2xDDR4-3200 ECC memory, maximum 64GB.

Features ■ Supports 11th generation Intel Core processors and Intel Celeron processors ■ 4x USB 4.0 / USB 3.2; 4x USB 2.0; 8x PCI-e x1 Gen3; 1x PCI-e x4 Gen4; supports up to 2x 2.5GbE ■ Intel Iris Xe Graphics Core Gen12 GPU with up to 96 EU, supports up to 4 independent displays ■ Equipped with 2x DDR5-4800 memory, maximum 64GB ■ Operating temperature 0 to 60℃ (optional: -40 to 85℃) ■ Dimensions: 120x95mm ■ OS: Win10 IoT/Linux/Yocto/VxWorks7.0/Android

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • CPU Module

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Industrial NUC CPU Module JNU93R-2930

Industrial NUC CPU Module JNU93R-2930

Jetway, supports Intel Bay Trail N2930 SoC CPU, 1xDDR3L-1333 up to 8GB.

Features ■ NUC Form Factor (101mm×101mm) ■ Compatible with Intel Baytrail N2930 SoC Processor ■ Equipped with 1xDDR3L-1333 (up to 8GB) memory ■ 1xUSB3.0, 3xUSB2.0, 1xCOM Port, 2xRealtek RTL8119I GbE ■ Supports wide power supply DC9–24V ■ Supports a wide operating temperature range of -20–60℃

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • CPU Module

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Industrial NUC CPU Module JNU691-3455

Industrial NUC CPU Module JNU691-3455

Jetway, supports Intel Apollo Lake Celeron J3455 CPU, size 101x101mm

Features ■ NUC Form Factor (101mm×101mm) ■ Compatible with Intel Apollo Lake Celeron J3455 Processor ■ Equipped with 1xDDR3L-1866 (up to 8GB) memory ■ Supports 4xUSB3.0, 2xUSB2.0, 1xCOM Port, 2xRJ45, 1xSATAIII (6 Gb/s) ■ Supports 1x full size mSATA, 1x half size Mini PCIe Slot, 1x SIM card holder ■ Compatible with AT/ATX power supply

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • CPU Module

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Industrial NUC CPU Module MU02-03

Industrial NUC CPU Module MU02-03

Jetway, supports Intel Apollo Lake J3455 SoC CPU, 1xDDR3L-1866 up to 8GB.

Features ■ NUC Form Factor (101mm×101mm) ■ Compatible with Intel Apollo Lake J3455 SoC Processor ■ Equipped with 1xDDR3L-1866 (up to 8GB) memory ■ Supports 3xUSB3.0, 2xUSB2.0, 1xRS232/422/485, 2xRJ45, 1xSATAIII ■ Supports 1xM.2 E-key (2230) for PCIe x1/USB2.0 interface expansion ■ Operating temperature range of 0 to 60℃

  • MU02(2).png
  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • CPU Module

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Ryzen COM Express CPU Module Type 7

Ryzen COM Express CPU Module Type 7

Type7 Module Up to 8 cores Ryzen V3000, 4xDDR5-4800 ECC maximum 64GB

【ADLINK Express-VR7 Features】 ■AMD Embedded Ryzen V3000 Processor ■Up to 8 cores, 16 threads ■Supports AT/ATX power supply ■Up to 64GB DDR5 (up to 4800 MT/s) ■14x PCIe Gen4 lanes ■2x 10G Ethernet, 1x 2.5G Ethernet support ■4x USB 3.x/2.0 or 4x USB 2.0/1.1 ■2x SATA 6Gb/s (SATA 0,1) ■Wide operating temperature range: Supports 0°C to 60°C

  • Embedded Board Computers
  • CPU Module

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13th COM Express CPU Module Type 6

13th COM Express CPU Module Type 6

Type6 Module 13th Gen Raptor Lake-P i7/i5/i3, 1xDDR5-4800 up to 64GB

【ADLINK Express-RLP Features】 ■ 13th Generation Intel Core Processor ■ Up to 14 cores (6 P-cores, 8 E-cores), 20 threads ■ Intel AVX-512 VNNI, Intel Turbo Boost ■ Intel Iris Xe Graphics ■ Up to 64GB DDR5 (up to 4800 MT/s) ■ 1 PCIe x8 Gen4, 2 PCIe x4 Gen4 lanes ■ 2.5GbE, TSN compliant ■ 4x USB 3.2/2.0/1.1 (USB 0-3) and 4x USB 2.0/1.1 (USB 4-7) ■ 2x SATA 6Gb/s ■ NVMe SSD compatible

  • Embedded Board Computers
  • CPU Module

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COM-HPC CPU Module COM-HPC-cRLS

COM-HPC CPU Module COM-HPC-cRLS

ADLINK, dimensions 160X120 mm, 13th generation Core i9/i7/i5/i3, 2xDDR5-3200 up to 128GB

【ADLINK COM-HPC-cRLS Features】 ■ Supports 13th generation Intel Core i9/i7/i5/i3 processors ■ Up to 24 cores, 32 threads (8 P-cores, 16 E-cores) ■ Up to 128GB DDR5 (up to 4800 MT/s) ■ Intel AVX-512 VNNI, Intel DL Boost ■ Intel UHD 770 Xe graphics ■ 16x PCIe Gen5, 8x PCIe Gen4 lanes, 14x PCIe Gen3 lanes ■ 2x 2.5GbE, Intel TCC, TSN capable ■ 4x USB 3.0/2.0/1.1, 8x USB 2.0 ■ 2x SATA, 2x UART, 12x GPIO

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • CPU Module

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COM Express CPU Module cExpress-MTL

COM Express CPU Module cExpress-MTL

Equipped with Ultra7-MS3/Ultra7-T4/Ultra5-MS1/Ultra5-T3, 2xDDR5-5600, maximum 64GB.

【ADLINK cExpress-MTL Features】 ■PICMG COM.0: Rev 3.1 Type 6 ■COM Express CPU module (compact size 95x95mm) ■Compatible with Type 6 Module Ultra7-MS3/Ultra7-T4/Ultra5-MS1/Ultra5-T3 ■2xDDR5-5600 up to 96GB ■Supports 2x USB 3.2/2.0/1.1, 2x USB 3.2 (BOM option), 6x USB 2.0/1.1, 2x SATA 6Gb/s, 2x UART ■PCIe x8 Gen4, lanes 16-23, PCIe x4 Gen4, lanes 24-27, PCIe x4 Gen4, lanes 28-31, supports up to 8 PCIe x1 Gen4 lanes (optional) ■Supports 1x 2.5GbE Ethernet (TSN option) ■Supports ATX/AT power supply ■Upgrades all PCIe signals to Gen4 ■Supports 2x USB4 (optional) ■Operating temperature range of 0 to 60°C

  • Embedded Board Computers
  • CPU Module

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NXP i.MX93 OSM CPU Module OSM-IMX93

NXP i.MX93 OSM CPU Module OSM-IMX93

ADLINK, NXP i.MX 93 with 2-core Arm Cortex-A55 & M33, LPDDR4L up to 2GB

【ADLINK OSM-IMX93 Features】 ■Dimensions: 45mm x 45mm ■NXP i.MX93 series (2-core Arm Cortex-A55 + M33) ■Equipped with TrustZone technology supporting Armv8 cryptographic functions ■Supports Arm Ethos U-65 micro NPU ■Supports independent display via 1x MIPI DSI ■LPDDR4L up to 2GB ■3x USB 2.0, 1x USB 2.0, 4x UART, 2x CAN2.0, 2x SPI, 1x I²S interface, 2x I2C interfaces, 16x GPIO ■Dual GbE (one port supports TSN) ■Certified to IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D

  • スクリーンショット 2025-10-24 142126.png
  • Embedded Board Computers
  • CPU Module

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NXP i.MX95 OSM CPU module OSM-IMX95

NXP i.MX95 OSM CPU module OSM-IMX95

NXP i.MX 95 with 6x Arm Cortex-A55, LPDDR4L up to 8GB, eMMC up to 128GB

**ADLINK OSM-IMX95 Features** - Dimensions: 45mm x 45mm - i.MX95 series (equipped with 4-core or 6-core Cortex-A55, Cortex-M7, and M33 MCU) - DSI and LVDS graphic output interfaces - LPDDR4L up to 8GB - eMMC up to 128GB - 1x USB 3.0, 1x USB 2.0, 4x UART, 3x SPI, 2x I²S interfaces, 4x I2C interfaces, 12x GPIO, 1x GEN3 single lane - Dual GbE (TSN compatible) - Certified to IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D

  • スクリーンショット 2025-10-24 142126.png
  • Embedded Board Computers
  • CPU Module

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SMARC CPU Module IEI iSMC-ASL

SMARC CPU Module IEI iSMC-ASL

Alder Lake-N N97 / Amston Lake Atom x7433RE,LPDDR5-5500 16GB/8GB

【IEI iSMC-ASL Features】 ■SMARC CPU module (size 82x50mm) ■Intel Alder Lake-N/Amston Lake on-board SoC, Alder Lake-N N97 SoC, Atom x7433RE SoC processor ■LPDDR5-5500 16GB/8GB ■Storage: 1 x eMMC: onboard eMMC option (up to 256G), 1 x SATA: signal to baseboard, 6Gb/s ■Display port: 1 x DisplayPort (1.1a), 1 x HDMI, 1 x LVDS ■2x 2.5 GbE RJ45 LAN, 6 x USB 2.0, 2 x USB 3.2, SATA 6Gb/s, 1x USB 2.0, 4 x RS-232 ■Expansion slots: 4 x PCIe x1: signal to baseboard supported ■Supports 5V DC power supply ■Operating temperature range: 0°C to 60°C

  • Embedded Board Computers
  • CPU Module

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COM Express CPU Module TYPE10

COM Express CPU Module TYPE10

Type10 Module Atom x7835RE/x7433RE/x7211RE onboard LPDDR5 up to 32GB

【ADLINK nanoX-ASL Features】 ■ COM Express R3.1 compliant Mini size (84mm × 55mm) ■ Equipped with Intel Atom x7000RE processor (up to 8 cores, TDP 6–12W) ■ Includes Intel UHD Graphics ■ Supports up to 32GB LPDDR5 onboard memory (up to 4800MHz) ■ Video output support: DisplayPort (DP), HDMI, DVI, LVDS ■ Capable of displaying 3 screens simultaneously at 4K60 HDR ■ 2.5GbE Ethernet (TSN support is optional) ■ 2 x USB 3.2, 8 x USB 2.0, 2 x SATAIII (600 MB/s) ■ Wide operating temperature range from -40℃ to +85℃

  • スクリーンショット 2026-06-03 155430.png
  • Embedded Board Computers
  • CPU Module

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N250 Processor SMARC CPU Module LEC-TWL

N250 Processor SMARC CPU Module LEC-TWL

ADLINK, N250, LPDDR5-4800 up to 16GB, eMMC up to 256GB

【ADLINK LEC-TWL Features】 ■ SMARC CPU module (size 82x50mm) ■ Supports Intel Atom series 2-core, 4-core, and 8-core processors ■ Equipped with up to 16GB LPDDR5 memory ■ Storage: 1 x eMMC: onboard eMMC option (up to 256G), 1 x SATA Gen3 ■ 4K resolution compatible display port: 1 x DisplayPort (1.1a), 1 x HDMI ■ Supports dual-channel LVDS (18-bit/24-bit, optional) ■ 2x 2.5 GbE RJ45 LAN, 2x USB 3.2, 4x USB 2.0, 4x UART, 2x CAN2.0A, 4x PCIe x1 Gen3 ■ Supports 5V DC power supply ■ Operating temperature range: 0℃ to 60℃

  • LEC-TWL-B-WEB.png
  • Embedded Board Computers
  • CPU Module

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SMARC CPU Module ADLINK LEC-ALN

SMARC CPU Module ADLINK LEC-ALN

Alder Lake Core i3-N305/N97/N50, LPDDR5-4800 up to 16GB, eMMC up to 256GB

【ADLINK LEC-TWL Features】 ■ SMARC CPU module (size 82x50mm) ■ Intel i3-N305 / Intel N97 / Intel N50 processors (Alder Lake) ■ Up to 16GB LPDDR5 memory ■ Storage: 1 x eMMC: onboard eMMC option (up to 256G), 1 x SATA Gen3 ■ 4K resolution compatible display port: 1 x DisplayPort (1.1a), 1 x HDMI ■ Dual-channel LVDS (18-bit/24-bit, optional) support ■ 2x 2.5 GbE RJ45 LAN, 2x USB 3.2, 4x USB 2.0, 4x UART, 2x CAN2.0A, 4x PCIe x1 Gen3 ■ Supports 5V DC power supply ■ Operating temperature range: 0℃ to 60℃

  • Embedded Board Computers
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COM-Express Type 7『PCOM-B706GT』

COM-Express Type 7『PCOM-B706GT』

Providing new upgrade paths for various applications such as automation and in-vehicle systems!

The PCOM-B706GT is a COM-Express Type 7 module equipped with an AMD Embedded Ryzen V3000 series CPU. It supports up to 8 cores/16 threads and features two 10G KR ports, along with PCI-Express Gen4 signals, making it suitable for various applications that require high throughput. Although optional, it also supports the installation of an onboard SSD on the CPU module and temperature expansion from -40°C to 85°C. 【Features】 ■ Equipped with AMD Embedded Ryzen V3000 CPU ("Zen3" core) ■ Supports DDR5 memory ■ Operates within a temperature range of -40°C to 85°C (only for certain compatible CPUs) ■ Optional onboard NVMe storage can also be installed *For more details, please download the PDF or feel free to contact us.

  • Other semiconductors
  • CPU Module

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COM Express CPU module "Adbc8097"

COM Express CPU module "Adbc8097"

8th/9th Gen Intel Core Processor COM Express Basic

<Features> ■ DDR4 SO-DIMM 2666MHz x2, up to 64GB ■ Supports 4 types of display I/F, with a maximum of 3 simultaneous displays: VGA*/DDI x1, LVDS*/eDP x1, DDI x2 *standard configuration ■ eDP resolution: up to 4096x2304 @60Hz ■ PCI Express(x16) x1, PCI Express(x8) x1 ■ Intel GbE x1, USB3.1 x4, USB2.0 x8, SATA x4, COM x2

  • Other FA equipment
  • CPU Module

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COM Express CPU module "Adbc8137"

COM Express CPU module "Adbc8137"

COM Express Compact Size Type 6

<Features> ■ COM Express Compact Size Type 6 Module ■ Equipped with 11th Generation Intel Core / Celeron 6305E processor ■ Supports up to 64GB, 2 x 260-Pin SO-DIMM ■ 1 x VGA, 1 x LVDS/eDP, 3 x DDI ■ 1 x PCIe x4 (Gen 4), 5 x PCIe x1 (Gen 3) ■ Extended temperature support: -40℃ to 85℃

  • Embedded Board Computers
  • CPU Module

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COM Express CPU module "Adbc8138"

COM Express CPU module "Adbc8138"

COM Express Mini Size Type 10

<Features> ■ COM Express Mini Size Type 10 Module ■ Compatible with Intel Atom x6000 series / Celeron / Pentium N & J series processors ■ Supports up to 16GB dual-channel LPDDR4X ■ 4 x PCIe x1 (Gen 3) ■ 1 x DDI, 1 x LVDS/eDP ■ 2 x USB 3.1, 8 x USB 2.0, 2 x SATA 3.0, 1 x eMMC 5.1, 1 x 8-bit DIO ■ Extended temperature support: -40℃ to 85℃

  • Embedded Board Computers
  • CPU Module

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CPU module "SMARC"【LEC-ASL】

CPU module "SMARC"【LEC-ASL】

7th Generation Intel Atom x7000RE & x7000C Processor Equipped SMARC Short Size Module

The ADLINK LEC-ASL is a SMARC module compatible with 2/4/8 core Intel Atom x7000RE (x7211RE, x7213RE, x7433RE, x7835RE) and x7000C (x7203C, x7405C, x7809C) processors (formerly Amston Lake), integrating Intel UHD graphics and high-speed interfaces. The LEC-ASL module supports up to 16GB LPDDR5 memory and up to 256GB eMMC storage (build option), making it ideal for mission-critical fanless edge computing applications that operate 24/7, thanks to its robust operating temperature range and low power envelope.

  • Embedded Board Computers
  • CPU Module

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CPU module

CPU module

The heart of the CPU board is realized on a small board! Designed and developed to specifications that suit the customer's needs.

N.M.R. Corporation handles "CPU Modules." This product realizes the heart of the CPU board on a small board. Various peripheral interfaces can be designed and developed according to the customer's specifications. Notably, it significantly differs from the ETX standard by adding PCI Express interfaces and many I/Os. 【Product Lineup】 ■ICE-BT-T10 ■ICE-BT-T10W2 ■ICE-ULT3 ■ICE-BT-T6 ■iQ7-BT-E38001 ■iQ7-BT-E38001W2 *For more details, please refer to the PDF materials or feel free to contact us.

  • Other electronic parts
  • CPU Module

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Q-Seven CPU Module [EQM-APL]

Q-Seven CPU Module [EQM-APL]

Q-Seven module equipped with Intel processor

Avalue's rugged environmental system is specially designed for long-term operation in harsh environments. Additionally, it is designed to maintain reliability in computer processing even under severe usage conditions. For more details, please contact us or download the catalog.

  • Embedded Board Computers
  • CPU Module

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SoM/CPUboard『iW-RainboW-G40M-OSM』

SoM/CPUboard『iW-RainboW-G40M-OSM』

Equipped with Bluetooth 5.0! Over 10 years of product lifespan program.

We would like to introduce the "iW-RainboW-G40M-OSM" that we handle. This product is an i.MX 8M Plus OSM LGA module, equipped with a 64-bit ARMv8 architecture, featuring the i.MX 8M Plus Q/QL/D CPU. Additionally, it includes an NPU with a neural network performance of 2.3 TOPS and 8GB of LPDDR4 memory. 【Features】 ■ i.MX 8M Plus Q/QL/D CPU ■ NPU with 2.3 TOPS neural network performance ■ 8GB LPDDR4 memory ■ IEEE 802.11a/b/g/n/ac/ax Wi-Fi ■ Bluetooth 5.0 *For more details, please refer to the PDF document or feel free to contact us.

  • Industrial PCs
  • Embedded Board Computers
  • Embedded OS
  • CPU Module

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iW-RainboW-G34M/G37M

iW-RainboW-G34M/G37M

Introducing the "i.MX 8M Mini or i.MX 8M Nano SODIMM SOM" that we handle!

Fujisoft is a domestic distributor of the 'iW-RainboW-G34M/G37M'. It adopts IEEE 802.11a/b/g/n/ac Wi-Fi & Bluetooth 5.0. It is a product that can be equipped with either the i.MX 8M Mini Q/QL/D/DL/S/SL CPU or the i.MX 8M Nano Q/QL/D/DL/S/SL CPU. With Fujisoft's extensive experience in embedded development, we provide a support system that ensures peace of mind both before and after purchase. 【Overview and Features】 ■ i.MX 8M Mini Q/QL/D/DL/S/SL CPU ■ i.MX 8M Nano Q/QL/D/DL/S/SL CPU ■ 10+ years of Product Longevity Program ■ IEEE 802.11a/b/g/n/ac Wi-Fi & Bluetooth 5.0 ■ Power and Cost Optimized *For more details, please refer to the related links or feel free to contact us.

  • Industrial PCs
  • Embedded Board Computers
  • Embedded OS
  • CPU Module

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iW-RainboW-G15M-SODIMM

iW-RainboW-G15M-SODIMM

Introducing the "i.MX 6 SODIMM SOM" handled by our company, which has extensive experience in embedded development!

Fujisoft is a domestic retailer of the "iW-RainboW-G15M-SODIMM." It is equipped with an i.MX 6 Q/D/DL/S Core CPU and features 1000/100/10 Mbps Ethernet. With extensive experience in embedded development, Fujisoft provides a reliable support system that ensures peace of mind both before and after purchase. 【Overview and Features】 ■ i.MX 6 Q/D/DL/S Core CPU ■ Multi-format HD 1080p encode & decode ■ 2D/3D Hardware Graphics Acceleration ■ 10+ years of Product Longevity Program ■ 1000/100/10 Mbps Ethernet ■ Modular & Compact SODIMM form factor 67.6mm X 37mm *For more details, please refer to the related links or feel free to contact us.

  • Industrial PCs
  • Embedded Board Computers
  • Embedded OS
  • CPU Module

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iW-RainboW-G18M-SODIMM

iW-RainboW-G18M-SODIMM

Introducing the "i.MX 6 UL/ULL/ULZ SODIMM SOM" that we handle!

Fujisoft is a domestic retailer of the 'iW-RainboW-G18M-SODIMM'. It is equipped with an i.MX 6 UL, ULL, ULZ CPU. The product is certified by CE and FCC. With extensive experience in embedded development, Fujisoft provides a reliable support system that ensures peace of mind both before and after purchase. Please feel free to contact us when you need assistance. 【Overview and Features】 ■ i.MX 6 UL, ULL, ULZ CPU ■ Advanced hardware enabled security ■ 10+ years of Product Longevity Program ■ Technical and quick customization support ■ Modular & Compact SODIMM form factor 67.6mm X 29mm ■ CE, FCC Certified *For more details, please refer to the related links or feel free to contact us.

  • Industrial PCs
  • Embedded Board Computers
  • Embedded OS
  • CPU Module

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i.MX93OSM-LF LGA iW-RainboW-G50M

i.MX93OSM-LF LGA iW-RainboW-G50M

Achieve high-performance ML applications that excel in cost efficiency and energy efficiency!

We would like to introduce the 'i.MX 93 OSM-LF LGA Module iW-RainboW-G50M' that we handle. It provides efficient machine learning (ML) acceleration and advanced security through the built-in EdgeLock secure enclave, supporting energy-efficient edge computing. By incorporating scalable Arm Cortex-A55 cores within the i.MX portfolio, it enhances the performance and energy efficiency of Linux-based edge applications. 【Features (partial)】 ■ i.MX 93 CPU with 64-bit ARM v8.2-A Architecture ■ NPU with up to 0.5 TOP/s Neural Network performance ■ Wi-Fi 6, Bluetooth 5.3 & IEEE802.15.4 connectivity ■ Supports Cortex-A55 cores *For more details, please download the PDF or feel free to contact us.

  • Embedded Board Computers
  • CPU Module

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Ultra-compact CPU module 'Linkey-100'

Ultra-compact CPU module 'Linkey-100'

Achieving ultra-miniaturization of 30mm × 50mm!

The "Linkey-100" is an ultra-compact CPU module that features an ARM Cortex-M4 (STM32 F4) in a size of 30mm x 50mm, and also includes a LAN connector. It provides cost-effective cloud computing for remote device management. Additionally, a development kit for creating this product is available. Please feel free to contact us if you have any requests. 【Features】 ■ Excellent peripherals of the CPU (STM32F4 series) are efficiently assigned to the expansion connector, enabling top-level performance. ■ Suitable as a device platform for small-batch production of various types. ■ Simplifies enclosure design. ■ LAN connector (RJ45) can be implemented on the expansion board. ■ Standard equipment includes an LED and a dip switch for debugging. *For more details, please download the PDF or feel free to contact us.

  • Other electronic parts
  • CPU Module

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6U VME CPU Module『SVA701』

6U VME CPU Module『SVA701』

Long-term supply with embedded specified components! Function expansion/customization is possible with option boards.

The "SVA701" is a 6U VME CPU Module equipped with the necessary I/F and functional expandability for control VME boards. By adopting the 11th generation TigerLake UP3 and our own PCIe-VME bridge (FPGA), long-term product supply is possible. It features endian-specific byte swap functionality, making VME access easy. Please feel free to contact us if you have any requests. 【Features】 ■ 11th generation Intel Processor series ■ Implementation of embedded system requirements ■ In-house development/domestic production *For more details, please refer to the PDF document or feel free to contact us.

  • Expansion Boards
  • CPU Module

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