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CPU Module Product List and Ranking from 24 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

CPU Module Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Suntex Co., Ltd. Shizuoka//Industrial Electrical Equipment
  2. ADLINKジャパン 東京本社 Tokyo//Industrial Electrical Equipment
  3. SECO S.p.A Italy//Industrial Electrical Equipment
  4. 4 ナセル Tokyo//Industrial Electrical Equipment
  5. 5 因幡電機産業 産機カンパニー Osaka//Trading company/Wholesale

CPU Module Product ranking

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. SECO COM Express CPU Module THEBE Suntex Co., Ltd.
  2. SMARC Xilinx Zynq FPGA module SECO S.p.A
  3. Omron PLC Safety CPU Unit NX-SL3/SL5 因幡電機産業 産機カンパニー
  4. 4 CPU module "SMARC" [LEC-ALN] ADLINKジャパン 東京本社
  5. 4 Argon Corporation Rugged CPU Unit ACB300 ナセル

CPU Module Product List

31~45 item / All 196 items

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Armadillo-610

50mm x 50mm compact modular embedded platform

The Armadillo-610 is a compact CPU module-based embedded platform equipped with the Arm Cortex-A7 (528MHz) SoC "i.MX 6ULL" (manufactured by NXP Semiconductors). It is designed for users to develop new expansion boards and integrate them into their devices. By using the Armadillo-610 as is for the often complex CPU-related design and referring to the circuit diagrams of the development set expansion board (provided free of charge to purchasers), users can simplify the design process by only expanding the relatively straightforward interface parts, thereby saving design time while achieving various shapes of printed circuit boards. The Armadillo-610 main unit and the expansion board are connected via a board-to-board connector, allowing for a simpler assembly process during manufacturing compared to using a single board.

  • Embedded Board Computers
  • Communications

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Omron PLC Safety CPU Unit NX-SL3/SL5

Integrating safety into ultra-fast machine automation! Achieving a safe and secure production environment.

■High Safety Certification Compliant with IEC 61508 (SIL3) and EN ISO 13849-1 (PLe/Category 4), designed to meet international safety standards, ensuring a safe and secure production environment. ■Flexible Network Compatibility With support for Safety over EtherCAT (FSoE), standard control devices and safety control devices can coexist on a single EtherCAT network. Additionally, the NX-SL5 supports CIP Safety, allowing standard control devices and safety control devices to coexist on a single EtherNet/IP network. ■Improved Design Efficiency and Reliability By supporting PLCopen-compliant safety function blocks, the learning period and costs for safety design are reduced. In addition to automatic generation of safety programs, wiring diagrams, and user-defined function blocks, offline simulation and online testing help prevent design errors while supporting efficient development. ■High Expandability and Performance The NX-SL3 supports up to 1024 safety I/O points, while the NX-SL5 supports up to 2032 points. It achieves both high-speed, high-precision control and safety control, flexibly accommodating a wide range of devices.

  • Safety Controller
  • PLC

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COM-Express Type 6『PCOM-B645VGL』

Can be used for various applications such as medical device control HMI, robot controllers, broadcasting equipment, and more!

The 『PCOM-B645VGL』 is a COM Express Type 6 compliant CPU module that can be equipped with Intel ATOM x6000 series and Intel Pentium J6000 series processors. It features a variety of graphic output interfaces including VGA, LVDS, HDMI, DP, and eDP, allowing for a maximum of three screen outputs. With PCI Express Gen3 implemented since the Elkhart Lake generation, it is equipped with 6 lanes for high-speed communication with devices, making it suitable for various applications such as medical device control HMIs, robot controllers, and broadcasting equipment. 【Features】 ■ Intel Atom Processor x6000 Series (Elkhart Lake) ■ DDR4 3200MT/s SODIMM 2 slots (up to 32GB) ■ Low power consumption CPU (4.5 to 12W) ■ -40℃ to 85℃ temperature range support ■ 2.5GbE 1 port connection available *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board

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COM-Express Type 10『PCOM-BA02GL』

Can be used in harsh environments such as signage terminals installed at outdoor bus terminals and sensor gateways inside freezers!

The 『PCOM-BA02GL』 is a COM Express Type 10 compliant CPU module that can be equipped with Intel ATOM x6000 series and Intel Pentium J6000 series processors. Not only does it offer a rich selection of display outputs including LVDS, eDP, DP, and HDMI, but it also supports PCI Express Gen3. It is very compact (84mm x 55mm) and has an operating temperature range of -40 to 85°C, making it suitable for various installation locations. 【Features】 ■ Intel Atom Processor x6000 series (Elkhartlake) ■ DDR4 3200MT/s 8GB onboard ■ Low power consumption (4.5 to 12W) ■ -40°C to 85°C temperature range support ■ 1 port 2.5GbE connectivity *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board

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COM Express CPU module "Adbc8134"

COM Express Basic Size Type 6

<Features> ■ COM Express Basic Size Type 6 Module ■ Equipped with 11th Generation Intel Xeon / Core / Celeron 6600HE processor ■ Supports up to 96GB, DDR4 3200MHz SO-DIMM x3 ■ 1 x VGA, 1 x LVDS/eDP, 3 x DDI (HDMI/DP++) ■ 1 x PCIe x16 (Gen 4), 8 x PCIe x1 (Gen 3) ■ Temperature extended support: -40℃ ~ 70℃

  • Embedded Board Computers

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COM Express CPU module "Adbc8136"

COM Express Compact Size Type 6

<Features> ■ COM Express Compact Size Type 6 Module ■ Equipped with 12th generation Intel Core / Celeron 7305E processor ■ Supports up to 64GB, 2 x DDR4 3200MHz SODIMM ■ 1 x VGA, 1 x LVDS/eDP, 3 x DDI ■ 2 x PCIe x4 (Gen4 PCH), 5 x PCIe x1 (Gen3) ■ Extended temperature support: -40℃ to 85℃

  • Embedded Board Computers

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COM Express CPU module "Adbc8135"

COM Express Basic Type 7

<Features> ■ COM Express Basic Size Type 7 Module ■ Equipped with 3rd Generation Intel Xeon Processor D-1700 Family Processor ■ Supports up to 96GB, 260-pin SODIMM x3 ■ 1x PCIe x16 (Gen4), 2x PCIe x8 (Gen3), 1x SMBus, 1x I2C, 1x LPC, 2x UART (TX/RX) ■ Extended temperature support: -40℃ to 85℃

  • Blockdiagram_Adbc8135.png
  • Mechanical Drawing.png
  • Embedded Board Computers

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MX93/91SOM module

How about developing with the high-performance and reasonably priced i.MX9 series as a successor to the i.MX8?

The i.mx series, along with ARM-SOC, is soaring in price due to the weak yen. Therefore, Mitsui Electronics has developed a CPU module for the i.MX93/91. If we continue to use the current products, the cost of materials will only continue to rise. How about developing a successor model with NXP's new i.mx9 series? The i.MX93 is a cost-performance model that shrinks unnecessary functions, allowing for performance improvements on existing products while enabling cost reductions. Additionally, it has been developed as a CPU module that also supports the more affordable i.MX91. Leave the design of the carrier board and the CPU board to us!

  • Embedded Board Computers

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CPU module "SMARC"

Low power consumption significantly reduces the board space required for power conversion devices and power lines! A credit card-sized computer module!

The SMARC is a versatile small form factor computer module targeting applications that require low power, cost-effectiveness, and high performance. It caters to systems that require a more compact solution than PC-oriented form factors. ARM SoCs eliminate the need for chips designed for PC platforms, significantly reducing power consumption and the amount of board space required for power conversion devices and power lines. This enables the use of smaller form factors and promotes the adoption of SMARC-compatible modules in low-power mobile devices. Using this standard, up to 9W of continuous power can be utilized for more demanding applications. 【Features】 ■ Power consumption ranges from 2W to 6W, allowing for passive cooling ■ Reduced wiring requirements 【Usage Scenarios】 Applications in mobile devices, industrial automation, medical technology, inspection and measurement, digital signage, transportation, and more. *For more details, please contact us or download from the link below.

  • LEC-BT_simg_en_1.jpg
  • LEC-BTS_simg_en_1.jpg
  • LEC-BW_simg_en_1.jpg
  • LEC-iMX6_simg_en_1.jpg
  • Embedded Board Computers

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CPU module "SMARC" [LEC-AL]

SMARC short-size module equipped with Intel Atom, Pentium, and Celeron processors.

SMARC is a definition for a diverse and compact-sized computer module targeting applications that require low power, low cost, and high performance. This module typically uses an ARM architecture SOC similar to those found in tablet computers and smartphones. Low-power SOCs and CPUs, such as X86 devices for tablets and other RISC CPUs, can also be utilized. The maximum power of the module is usually below 6W. The module is used as part of portable or stationary embedded systems. Additionally, core CPUs and associated boards, such as DRAM, boot flash, power sequencing, CPU power, GBE, and single-channel LVDS display transmitters, are connected to the module. The module is used with application-specific carrier boards, which include components like audio codecs, touch controllers, and wireless devices. By using a modular approach, it offers excellent expansion and upgrade capabilities, reduces time to market, and achieves low cost, low power, and small size.

  • Embedded Board Computers

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CPU module "SMARC" [LEC-iMX8M]

NXP i.MX 8M equipped SMARC short-size module

SMARC (Smart Mobility ARChitecture) is a multi-purpose small form factor computer module definition aimed at applications requiring low power, low cost, and high performance. The module typically uses the same or similar ARM SoCs found in many well-known devices such as tablet computers and smartphones. Alternative low-power SoCs and CPUs, such as tablet-oriented x86 devices and other RISC CPUs, can also be used. The power envelope of the module is usually less than 6W. The module serves as a building block for portable and stationary embedded systems. Core CPU and support circuitry, including DRAM, boot flash, power sequencing, CPU power, GBE, and single-channel LVDS display transmitters, are concentrated within the module. The module is used with application-specific carrier boards that implement other functions such as audio CODECs, touch controllers, and wireless devices.

  • Embedded Board Computers

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CPU module "SMARC" [LEC-EL]

SMARC short-sized module equipped with Intel 6th generation Atom x6000 processor (formerly code-named: Elkhart Lake)

The ADLINK LEC-EL is a SMARC module that supports the Intel Atom x6000 (x6425E, x6413E, x6211E, x6200FE, x6425RE) processor (formerly Elkhart Lake) with integrated Intel UHD graphics and high-speed interfaces. The LEC-EL module supports up to 8GB of LPDDR4 memory and is designed to meet strict operating temperature ranges and low power consumption envelopes, making it an ideal product for mission-critical fanless edge computing applications where safety and reliability are always required.

  • Embedded Board Computers

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CPU module "SMARC" [LEC-RB5]

Qualcomm QRB5165 series octa-core SoC equipped SMARC short-size module

The ADLINK LEC-RB5 is a SMARC module that features the Qualcomm QRB5165 SoC, equipped with eight Arm Cortex-A77 cores and a Qualcomm Hexagon Tensor Accelerator with up to 15 TOPS. This module is designed for applications in robotics and drones, integrating multiple IoT technologies into a single solution. The LEC-RB5 SMARC module provides artificial intelligence (AI) capabilities on-device, supports up to six cameras, and offers low power consumption. It can power robots and drones in consumer, enterprise, defense, industrial, and logistics sectors.

  • Embedded Board Computers

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Power-saving / Low price / Space-saving Android-equipped CPU module

Power-saving / Low price / Space-saving Android-equipped CPU module!

◆Versatile Baseboards Various sizes and functions of boards are available for the compact CPU module, allowing you to choose a baseboard that fits the required interfaces. ◆Diverse Product Series You can select from a wide range of CPU modules to meet your needs. ◆Supported OS and API Compatible with major OS and APIs. *For more details, please request documentation or view the PDF data available for download.

  • Other electronic parts
  • Embedded Board Computers

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CPU module "PICO-IMX series"

36×40mm, 8g! Ultra compact and lightweight! For drones, robots, medical devices, and industrial equipment.

The "PICO-IMX Series" is a CPU module equipped with the latest CPU "i.MX6" from Freescale. It features an ultra-compact size of 36×40mm and weighs only 8g, making it extremely lightweight. Additionally, it offers high performance and low power consumption at a low price, making it suitable for a wide range of applications such as drones and industrial equipment. Furthermore, during the evaluation and early development phase, it can be combined with a dedicated carrier board to start development immediately. The OS source code and drivers for the included IC are provided free of charge, allowing for quick application development. 【Specifications】 ■ CPU: i.MX6 Solo (Single Core) / Dual Lite (Dual Core) ■ CPU Technology: ARM Cortex-A9 1GHz ■ Memory: 512MB to 2GB (maximum) ■ Storage: Standard 4GB eMMC or microSD card slot ■ Supported OS: Android, Linux *For more details, please download the catalog or contact us.

  • Embedded Board Computers
  • Industrial PCs

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