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CPU Module Product List and Ranking from 25 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.

CPU Module Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.

  1. Suntex Co., Ltd. Shizuoka//Industrial Electrical Equipment
  2. SECO S.p.A Italy//Industrial Electrical Equipment
  3. 富士ソフト インダストリービジネス事業部 Kanagawa//software
  4. 4 ARBOR Technology Corp. Taiwan//IT/Telecommunications
  5. 5 ナセル Tokyo//Industrial Electrical Equipment
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CPU Module Product ranking

Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.

  1. NXP i.MX95 OSM CPU module OSM-IMX95 Suntex Co., Ltd.
  2. Omron PLC Safety CPU Unit NX-SL3/SL5 因幡電機産業 産機カンパニー
  3. NXP i.MX93 OSM CPU Module OSM-IMX93 Suntex Co., Ltd.
  4. CPU module "MAIA" SECO S.p.A
  5. Argon Corporation Rugged CPU Unit for Installation ACB100 ナセル

CPU Module Product List

31～60 item / All 182 items

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OSM CPU Module ADLINK OSM-IMX8MP

OSM CPU Module ADLINK OSM-IMX8MP

ADLINK, NXP i.MX8M Plus with 4-core Cortex-A53 & M7, LPDDR4L up to 8GB

【ADLINK OSM-IMX8MP Features】 ■Dimensions: 45mm x 45mm ■NXP i.MX8M Plus series (4-core Cortex-A53 + Cortex-M7) ■Equipped with TrustZone technology supporting Armv8 cryptographic functions ■2.3 TOPS Neural Processing Unit (optional) ■Graphic output interfaces: HDMI, LVDS, DSI ■LPDDR4L up to 8GB ■eMMC up to 128GB ■2x USB 3.0, 2x USB 2.0, 2x CAN2.0, 4x UART, 3x SPI, 1x I²S interface, 2x I²C interfaces, 8x GPIO ■Dual GbE (one port supports TSN) ■Supports extended temperature range -40°C to 85°C ■Complies with IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D

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  • Embedded Board Computers
  • CPU Module

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OSM CPU Module ADLINK OSM-MTK520

OSM CPU Module ADLINK OSM-MTK520

MediaTek Genio 520 SoC with 2x Arm Cortex-A78＆6x A55,LPDDR5 16GB

**ADLINK OSM-MTK520 Features** ■ Dimensions: 45mm x 45mm ■ Equipped with MediaTek Genio 520 ■ MediaTek 8th Generation NPU (up to 10 TOPS AI computing performance) ■ Compliant with OSM Revision 1.2 ■ Graphic output interfaces: DisplayPort (DP), eDP, HDMI, LVDS, DSI ■ LPDDR5 up to 16GB ■ UFS up to 512GB ■ 1x USB 3.1, 2x USB 2.0, 1x USB 2.0 OTG, 4x UART, 3x SPI, 2x I2S, 2x I2C, 22x GPIOs ■ TSN-compatible MAC 10/100/1000 Mbps RGMII interface ■ Operating temperature range: -40°C to 85°C ■ Compliant with IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D

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  • Embedded Board Computers
  • CPU Module

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PC/104 CPU Module [PCM-3365]

PC/104 CPU Module [PCM-3365]

PC/104 CPU module equipped with Intel Atom E3825 / E3845 & Celeron N2930

- Supports Intel Atom E3825 / E3845 & Celeron N2930, DDR3L-1066/1333MHz SODIMM with a maximum of 8GB - DirectX 11, OpenGL 3.2, OpenCL 1.1, supports independent display on 3 screens: VGA + LVDS/HDMI + LVDS/DVI + LVDS/VGA + LVDS - Supports PC/104-Plus expansion boards - 1x Gigabit Ethernet, rich I/O interfaces (3 COM, SATA, 6 USB 2.0, SMBus/I2C, GPIO, full-size Mini PCIe/full-size mSATA) - Supports SUSIAccess and embedded software API

  • Embedded Board Computers
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Qseven【SOM-3567】

Qseven【SOM-3567】

Intel Atom/Celeron Processor Q7 Module

● Intel Atom / Celeron Processor Q7 Module ● iManager WISE-PaaS / RMM, and Embedded Software API ● LVDS and HDMI / DP support H.264, MPEG2 HW decode/encode ● Onboard dual-channel DDR3L-1333 up to 8GB, eMMC up to 32GB ● Qseven R2.0 CPU Module ● Intel Atom / Celeron Processor Q7 Module

  • Industrial PCs
  • CPU Module

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Armadillo-610

Armadillo-610

50mm x 50mm compact modular embedded platform

The Armadillo-610 is a compact CPU module-based embedded platform equipped with the Arm Cortex-A7 (528MHz) SoC "i.MX 6ULL" (manufactured by NXP Semiconductors). It is designed for users to develop new expansion boards and integrate them into their devices. By using the Armadillo-610 as is for the often complex CPU-related design and referring to the circuit diagrams of the development set expansion board (provided free of charge to purchasers), users can simplify the design process by only expanding the relatively straightforward interface parts, thereby saving design time while achieving various shapes of printed circuit boards. The Armadillo-610 main unit and the expansion board are connected via a board-to-board connector, allowing for a simpler assembly process during manufacturing compared to using a single board.

  • Embedded Board Computers
  • Communications
  • CPU Module

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Omron PLC Safety CPU Unit NX-SL3/SL5

Omron PLC Safety CPU Unit NX-SL3/SL5

Integrating safety into ultra-fast machine automation! Achieving a safe and secure production environment.

■High Safety Certification Compliant with IEC 61508 (SIL3) and EN ISO 13849-1 (PLe/Category 4), designed to meet international safety standards, ensuring a safe and secure production environment. ■Flexible Network Compatibility With support for Safety over EtherCAT (FSoE), standard control devices and safety control devices can coexist on a single EtherCAT network. Additionally, the NX-SL5 supports CIP Safety, allowing standard control devices and safety control devices to coexist on a single EtherNet/IP network. ■Improved Design Efficiency and Reliability By supporting PLCopen-compliant safety function blocks, the learning period and costs for safety design are reduced. In addition to automatic generation of safety programs, wiring diagrams, and user-defined function blocks, offline simulation and online testing help prevent design errors while supporting efficient development. ■High Expandability and Performance The NX-SL3 supports up to 1024 safety I/O points, while the NX-SL5 supports up to 2032 points. It achieves both high-speed, high-precision control and safety control, flexibly accommodating a wide range of devices.

  • Safety Controller
  • PLC
  • CPU Module

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COM-Express Type 6『PCOM-B645VGL』

COM-Express Type 6『PCOM-B645VGL』

Can be used for various applications such as medical device control HMI, robot controllers, broadcasting equipment, and more!

The 『PCOM-B645VGL』 is a COM Express Type 6 compliant CPU module that can be equipped with Intel ATOM x6000 series and Intel Pentium J6000 series processors. It features a variety of graphic output interfaces including VGA, LVDS, HDMI, DP, and eDP, allowing for a maximum of three screen outputs. With PCI Express Gen3 implemented since the Elkhart Lake generation, it is equipped with 6 lanes for high-speed communication with devices, making it suitable for various applications such as medical device control HMIs, robot controllers, and broadcasting equipment. 【Features】 ■ Intel Atom Processor x6000 Series (Elkhart Lake) ■ DDR4 3200MT/s SODIMM 2 slots (up to 32GB) ■ Low power consumption CPU (4.5 to 12W) ■ -40℃ to 85℃ temperature range support ■ 2.5GbE 1 port connection available *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • CPU Module

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COM-Express Type 10『PCOM-BA02GL』

COM-Express Type 10『PCOM-BA02GL』

Can be used in harsh environments such as signage terminals installed at outdoor bus terminals and sensor gateways inside freezers!

The 『PCOM-BA02GL』 is a COM Express Type 10 compliant CPU module that can be equipped with Intel ATOM x6000 series and Intel Pentium J6000 series processors. Not only does it offer a rich selection of display outputs including LVDS, eDP, DP, and HDMI, but it also supports PCI Express Gen3. It is very compact (84mm x 55mm) and has an operating temperature range of -40 to 85°C, making it suitable for various installation locations. 【Features】 ■ Intel Atom Processor x6000 series (Elkhartlake) ■ DDR4 3200MT/s 8GB onboard ■ Low power consumption (4.5 to 12W) ■ -40°C to 85°C temperature range support ■ 1 port 2.5GbE connectivity *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
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COM Express CPU module "Adbc8134"

COM Express CPU module "Adbc8134"

COM Express Basic Size Type 6

<Features> ■ COM Express Basic Size Type 6 Module ■ Equipped with 11th Generation Intel Xeon / Core / Celeron 6600HE processor ■ Supports up to 96GB, DDR4 3200MHz SO-DIMM x3 ■ 1 x VGA, 1 x LVDS/eDP, 3 x DDI (HDMI/DP++) ■ 1 x PCIe x16 (Gen 4), 8 x PCIe x1 (Gen 3) ■ Temperature extended support: -40℃ ~ 70℃

  • Embedded Board Computers
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COM Express CPU module "Adbc8136"

COM Express CPU module "Adbc8136"

COM Express Compact Size Type 6

<Features> ■ COM Express Compact Size Type 6 Module ■ Equipped with 12th generation Intel Core / Celeron 7305E processor ■ Supports up to 64GB, 2 x DDR4 3200MHz SODIMM ■ 1 x VGA, 1 x LVDS/eDP, 3 x DDI ■ 2 x PCIe x4 (Gen4 PCH), 5 x PCIe x1 (Gen3) ■ Extended temperature support: -40℃ to 85℃

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COM Express CPU module "Adbc8135"

COM Express CPU module "Adbc8135"

COM Express Basic Type 7

<Features> ■ COM Express Basic Size Type 7 Module ■ Equipped with 3rd Generation Intel Xeon Processor D-1700 Family Processor ■ Supports up to 96GB, 260-pin SODIMM x3 ■ 1x PCIe x16 (Gen4), 2x PCIe x8 (Gen3), 1x SMBus, 1x I2C, 1x LPC, 2x UART (TX/RX) ■ Extended temperature support: -40℃ to 85℃

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MX93/91SOM module

MX93/91SOM module

How about developing with the high-performance and reasonably priced i.MX9 series as a successor to the i.MX8?

The i.mx series, along with ARM-SOC, is soaring in price due to the weak yen. Therefore, Mitsui Electronics has developed a CPU module for the i.MX93/91. If we continue to use the current products, the cost of materials will only continue to rise. How about developing a successor model with NXP's new i.mx9 series? The i.MX93 is a cost-performance model that shrinks unnecessary functions, allowing for performance improvements on existing products while enabling cost reductions. Additionally, it has been developed as a CPU module that also supports the more affordable i.MX91. Leave the design of the carrier board and the CPU board to us!

  • Embedded Board Computers
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CPU module "SMARC"

CPU module "SMARC"

Low power consumption significantly reduces the board space required for power conversion devices and power lines! A credit card-sized computer module!

The SMARC is a versatile small form factor computer module targeting applications that require low power, cost-effectiveness, and high performance. It caters to systems that require a more compact solution than PC-oriented form factors. ARM SoCs eliminate the need for chips designed for PC platforms, significantly reducing power consumption and the amount of board space required for power conversion devices and power lines. This enables the use of smaller form factors and promotes the adoption of SMARC-compatible modules in low-power mobile devices. Using this standard, up to 9W of continuous power can be utilized for more demanding applications. 【Features】 ■ Power consumption ranges from 2W to 6W, allowing for passive cooling ■ Reduced wiring requirements 【Usage Scenarios】 Applications in mobile devices, industrial automation, medical technology, inspection and measurement, digital signage, transportation, and more. *For more details, please contact us or download from the link below.

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  • LEC-iMX6_simg_en_1.jpg
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CPU module "SMARC" [LEC-EL]

CPU module "SMARC" [LEC-EL]

SMARC short-sized module equipped with Intel 6th generation Atom x6000 processor (formerly code-named: Elkhart Lake)

The ADLINK LEC-EL is a SMARC module that supports the Intel Atom x6000 (x6425E, x6413E, x6211E, x6200FE, x6425RE) processor (formerly Elkhart Lake) with integrated Intel UHD graphics and high-speed interfaces. The LEC-EL module supports up to 8GB of LPDDR4 memory and is designed to meet strict operating temperature ranges and low power consumption envelopes, making it an ideal product for mission-critical fanless edge computing applications where safety and reliability are always required.

  • Embedded Board Computers
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CPU module "SMARC" [LEC-RB5]

CPU module "SMARC" [LEC-RB5]

Qualcomm QRB5165 series octa-core SoC equipped SMARC short-size module

The ADLINK LEC-RB5 is a SMARC module that features the Qualcomm QRB5165 SoC, equipped with eight Arm Cortex-A77 cores and a Qualcomm Hexagon Tensor Accelerator with up to 15 TOPS. This module is designed for applications in robotics and drones, integrating multiple IoT technologies into a single solution. The LEC-RB5 SMARC module provides artificial intelligence (AI) capabilities on-device, supports up to six cameras, and offers low power consumption. It can power robots and drones in consumer, enterprise, defense, industrial, and logistics sectors.

  • Embedded Board Computers
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Power-saving / Low price / Space-saving Android-equipped CPU module

Power-saving / Low price / Space-saving Android-equipped CPU module

Power-saving / Low price / Space-saving Android-equipped CPU module!

◆Versatile Baseboards Various sizes and functions of boards are available for the compact CPU module, allowing you to choose a baseboard that fits the required interfaces. ◆Diverse Product Series You can select from a wide range of CPU modules to meet your needs. ◆Supported OS and API Compatible with major OS and APIs. *For more details, please request documentation or view the PDF data available for download.

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CPU module "PICO-IMX series"

CPU module "PICO-IMX series"

36×40mm, 8g! Ultra compact and lightweight! For drones, robots, medical devices, and industrial equipment.

The "PICO-IMX Series" is a CPU module equipped with the latest CPU "i.MX6" from Freescale. It features an ultra-compact size of 36×40mm and weighs only 8g, making it extremely lightweight. Additionally, it offers high performance and low power consumption at a low price, making it suitable for a wide range of applications such as drones and industrial equipment. Furthermore, during the evaluation and early development phase, it can be combined with a dedicated carrier board to start development immediately. The OS source code and drivers for the included IC are provided free of charge, allowing for quick application development. 【Specifications】 ■ CPU: i.MX6 Solo (Single Core) / Dual Lite (Dual Core) ■ CPU Technology: ARM Cortex-A9 1GHz ■ Memory: 512MB to 2GB (maximum) ■ Storage: Standard 4GB eMMC or microSD card slot ■ Supported OS: Android, Linux *For more details, please download the catalog or contact us.

  • Embedded Board Computers
  • Industrial PCs
  • CPU Module

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CPU module "OMAP-L138 Module"

CPU module "OMAP-L138 Module"

This is a CPU module capable of being equipped with an operating system for industrial information processing.

The "OMAP-L138 Module" is a compact and power-efficient CPU module equipped with Texas Instruments' OMAP-L138. It supports various operating systems including Linux 2.6.37, Android, Windows Embedded, and μITRON. It can be used for a wide range of applications such as communication and control embedded devices, and information terminals. 【Features】 - Module equipped with ARM9 + DSP SoC OMAP-L138 - Capable of writing U-boot/Linux 2.6.37 to onboard Serial Flash Memory - Baseboard with standard LAN, USB, and serial interfaces - Touch panel LCD I/F support For more details, please contact us or download the catalog.

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CPU Module "AM3359 Module"

CPU Module "AM3359 Module"

High-speed graphics, CPU module for feature-rich industrial equipment.

The "AM3359 Module" is a high-speed, low-power CPU module equipped with Texas Instruments' AM3359, which supports rich graphic capabilities. It is compatible with various operating systems including Linux, Android, and Windows Embedded CE. It can be used for a wide range of applications such as communication and control embedded devices, and information terminals. 【Features】 ○ Module with AM3359 Cortex-A8 ○ Advanced 3D graphics acceleration ○ Flexible communication interfaces ○ Realization of highly reliable display options For more details, please contact us or download the catalog.

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Module "AM3359 Module"

Module "AM3359 Module"

Equipped with AM3359 Cortex-A8! A feature-rich module for industrial equipment!

The "AM3359 Module" is a high-speed, low-power CPU module equipped with Texas Instruments' AM3359, which supports rich graphic capabilities. It is compatible with various operating systems including Linux, Android, and Windows Embedded CE. It can be used for a wide range of applications such as communication and control embedded devices, and information terminals. We also offer a variety of in-house developed products, so please feel free to contact us if you are interested. 【Features】 ■ Advanced 3D graphics acceleration ■ Flexible communication interfaces ■ Reliable display options *For more details, please refer to the catalog or feel free to contact us.

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Module "OMAP-L138 Module"

Module "OMAP-L138 Module"

OS compatible! Module for industrial information processing!

The "OMAP-L138 Module" is a compact and power-efficient CPU module equipped with Texas Instruments' OMAP-L138. It can be used for a wide range of applications, including communication and control embedded devices, and information terminals. It supports various OS platforms, including Linux 1.6.37, Android, Windows Embedded, and μITRON. We also offer our own developed products. Please feel free to contact us. 【Features】 ■ Capable of writing U-boot/Linux 2.6.37 to the onboard Serial Flash Memory ■ Baseboard equipped with standard LAN, USB, and serial interfaces ■ Touch panel LCD I/F support *For more details, please refer to the catalog or feel free to contact us.

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CPU module "IoT-Engine RZ/A2M"

CPU module "IoT-Engine RZ/A2M"

Equipped with Renesas Electronics microcontroller (RZ/A2M)!

The "IoT-Engine RZ/A2M" is a CPU module compliant with the IoT-Engine standard. It is equipped with MIPI camera input interface, HyperRAM, and LVDS display output interface (when connected to a baseboard), enabling the development of IoT devices, including image processing and analysis. Additionally, it can send acquired images and analysis results to a server via USB, WiFi, etc. 【CPU】 ■ RZ/A2M R7S921053VCBG ■ Cortex-A9 528MHz ■ Built-in RAM 4MB ■ DRP 6 tiles *For more details, please download the PDF or feel free to contact us.

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iW-RainboW-G20M

iW-RainboW-G20M

Equipped with a video codec module! Audio and video interface.

We would like to introduce the 'iW-RainboW-G20M' that we handle. This product is equipped with a dual-core ARM Cortex-A15 CPU @1.5GHz. Additionally, it is compatible with the Qseven standard and is an industrial-grade product certified by JSS-55555 environmental testing. 【Features】 ■ Dual-core ARM Cortex-A15 CPU @1.5GHz ■ Audio and video interfaces ■ Video codec module ■ 3D graphics engine ■ Qseven standard compatibility ■ JSS-55555 environmental testing certified industrial grade *For more details, please refer to the PDF document or feel free to contact us.

  • Industrial PCs
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  • Embedded OS
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iW-RainboW-G50M

iW-RainboW-G50M

Supports 2×1Gbps Ethernet! Over 10 years of product lifespan program.

We would like to introduce the "iW-RainboW-G50M" that we handle. This product features the i.MX 93 OSM-L LGA module, equipped with an NPU that provides 0.5 TOPS of neural network performance. Additionally, it includes IEEE 802.11b/g/n/ac/ax Wi-Fi and Bluetooth 5.2. 【Features】 ■ i.MX 93 CPU ■ NPU with 0.5 TOPS of neural network performance ■ IEEE 802.11b/g/n/ac/ax Wi-Fi ■ Bluetooth 5.2 ■ Supports Cortex-A55 cores *For more details, please refer to the PDF document or feel free to contact us.

  • Industrial PCs
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  • Embedded OS
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iW RainboW G25M

iW RainboW G25M

Introducing the "Snapdragon 820 SMARC SOM" that we handle!

Fujisoft is the domestic retailer for the 'iW RainboW G25M'. It is equipped with a 64-bit Quad Kryo Snapdragon 820 CPU. The product features 802.11ac Wi-Fi & BT 4.1. With Fujisoft's extensive experience in embedded development, we provide a reliable support system that ensures peace of mind both before and after your purchase. 【Overview & Features】 ■ 64-bit Quad Kryo Snapdragon 820 CPU ■ Hexagon 680 DSP @ 825MHz ■ 14-bit Qualcomm Spectra ISP ■ 802.11ac Wi-Fi & BT 4.1 ■ Qualcomm IZat Gen8C GPS ■ SMARC R2.0 compatible *For more details, please refer to the related links or feel free to contact us.

  • Industrial PCs
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  • Embedded OS
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i.MX91OSM-LF LGA iW-RainboW-G50M

i.MX91OSM-LF LGA iW-RainboW-G50M

Enables rapid development of new Linux-based edge devices!

We would like to introduce the 'i.MX 91 OSM-LF LGA Module iW-RainboW-G50M' that we handle. This platform, which excels in scalability and reliability, streamlines the development of cost-effective edge devices that require security, performance, and Linux support. The NXP i.MX 91 family enables rapid development of new Linux-based edge devices for applications such as home controllers, connected appliances, home entertainment, industrial scanning/printing, building management, EV chargers, and medical platforms. 【Features (partial)】 ■ i.MX 91 CPU with 64-bit ARM v8.2-A Architecture ■ 2GB LPDDR4 Memory ■ 16GB eMMC Flash (Expandable) ■ Wi-Fi 6, Bluetooth 5.3 & IEEE802.15.4 Connectivity ■ Supports 1 x Cortex-A55 cores *For more details, please download the PDF or feel free to contact us.

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i.MX93 SMARC SoM iW-RainboW-G50M

i.MX93 SMARC SoM iW-RainboW-G50M

Provides advanced security! Supports energy-efficient edge computing.

We would like to introduce the 'i.MX 93 SMARC SOM iW-RainboW-G50M' that we handle. By incorporating a scalable Arm Cortex-A55 core within the i.MX portfolio, it enhances the performance and energy efficiency of Linux-based edge applications. Additionally, it is equipped with the Arm Ethos-U65 microNPU, enabling high-performance, cost-effective, and energy-efficient ML applications. 【Features (partial)】 ■ i.MX 93 CPU with 64-bit ARM v8.2-A Architecture ■ NPU with up to 0.5 TOP/s Neural Network performance ■ IEEE 802.11b/g/n/ac/ax Wi-Fi & Bluetooth 5.3 ■ Supports Cortex-A55 cores *For more details, please download the PDF or feel free to contact us.

  • Embedded Board Computers
  • CPU Module

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SoM/CPU module『i.MX 91 SMARC』

SoM/CPU module『i.MX 91 SMARC』

Supports a operating temperature range of -40℃ to +85℃! Equipped with various interfaces.

The "i.MX 91 SMARC System on Module iW-RainboW-G50M" is equipped with the i.MX 91 CPU, which adopts the 64-bit ARM v8.2-A architecture, and provides connectivity with IEEE 802.11b/g/n/ac/ax Wi-Fi and Bluetooth 5.3. Additionally, it features two Gigabit Ethernet PHYs, 2GB of LPDDR4 memory, 16GB of eMMC flash (expandable), and various interfaces (USB 2.0, SPI, I2C, UART, etc.), and supports an operating temperature range of -40°C to +85°C. This makes it a suitable module for vertical markets such as industrial, medical, automotive, and avionics. 【Features (partial)】 ■ i.MX 91 CPU with 64-bit ARM v8.2-A Architecture ■ IEEE 802.11b/g/n/ac/ax Wi-Fi & Bluetooth 5.3 ■ Supports Cortex-A55 cores *For more details, please download the PDF or feel free to contact us.

  • Embedded Board Computers
  • Other embedded systems (software and hardware)
  • CPU Module

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[Solution Example] i.MX8M Mini - LPDDR4

[Solution Example] i.MX8M Mini - LPDDR4

Evaluation board implementation completed! Compact CPU module equipped with i.MX8M Mini finished!

To Matsudo Co., Ltd. and RITA Electronics, we have established a technical study session aimed at solving customer challenges, and the implementation of the "i.MX8M Mini - LPDDR4" board we created in this session has been completed. We will now proceed to confirm its operation, advancing waveform verification of LPDDR4 with this board, and comparing the simulation results of the circuit and patterns with the actual measured values, so that we can provide solutions to our customers. We will release detailed information as it becomes available. Please feel free to contact us if you have any requests. *Details of the case can be viewed via the related links. For more information, please do not hesitate to contact us.

  • Evaluation Board
  • CPU Module

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"CPU Module" Verdin iMX8M Mini

"CPU Module" Verdin iMX8M Mini

NXP i.MX8M Mini equipped with Toradex's Verdin family CPU module.

The NXP i.MX8M Mini SoC is equipped with up to four powerful 64-bit Armv8 Cortex-A53 cores, providing sufficient power for typical industrial and medical applications while being a cost-effective option for running the latest graphical user interface on Linux.

  • Microcomputer
  • ASIC
  • CPU Module

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