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CPU Module Product List and Ranking from 25 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

CPU Module Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. Suntex Co., Ltd. Shizuoka//Industrial Electrical Equipment
  2. SECO S.p.A Italy//Industrial Electrical Equipment
  3. ADLINKジャパン 東京本社 Tokyo//Industrial Electrical Equipment
  4. 4 ナセル Tokyo//Industrial Electrical Equipment
  5. 5 アットマークテクノ Hokkaido//Electronic Components and Semiconductors
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CPU Module Product ranking

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. NXP i.MX95 OSM CPU module OSM-IMX95 Suntex Co., Ltd.
  2. Ryzen COM Express CPU Module Type 7 Suntex Co., Ltd.
  3. NXP i.MX93 OSM CPU Module OSM-IMX93 Suntex Co., Ltd.
  4. Armadillo-610 アットマークテクノ
  5. 4 CPU module "SMARC" [LEC-ALN] ADLINKジャパン 東京本社

CPU Module Product List

151～180 item / All 194 items

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i.MX93OSM-LF LGA iW-RainboW-G50M

i.MX93OSM-LF LGA iW-RainboW-G50M

Achieve high-performance ML applications that excel in cost efficiency and energy efficiency!

We would like to introduce the 'i.MX 93 OSM-LF LGA Module iW-RainboW-G50M' that we handle. It provides efficient machine learning (ML) acceleration and advanced security through the built-in EdgeLock secure enclave, supporting energy-efficient edge computing. By incorporating scalable Arm Cortex-A55 cores within the i.MX portfolio, it enhances the performance and energy efficiency of Linux-based edge applications. 【Features (partial)】 ■ i.MX 93 CPU with 64-bit ARM v8.2-A Architecture ■ NPU with up to 0.5 TOP/s Neural Network performance ■ Wi-Fi 6, Bluetooth 5.3 & IEEE802.15.4 connectivity ■ Supports Cortex-A55 cores *For more details, please download the PDF or feel free to contact us.

  • Embedded Board Computers
  • CPU Module

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Ultra-compact CPU module 'Linkey-100'

Ultra-compact CPU module 'Linkey-100'

Achieving ultra-miniaturization of 30mm × 50mm!

The "Linkey-100" is an ultra-compact CPU module that features an ARM Cortex-M4 (STM32 F4) in a size of 30mm x 50mm, and also includes a LAN connector. It provides cost-effective cloud computing for remote device management. Additionally, a development kit for creating this product is available. Please feel free to contact us if you have any requests. 【Features】 ■ Excellent peripherals of the CPU (STM32F4 series) are efficiently assigned to the expansion connector, enabling top-level performance. ■ Suitable as a device platform for small-batch production of various types. ■ Simplifies enclosure design. ■ LAN connector (RJ45) can be implemented on the expansion board. ■ Standard equipment includes an LED and a dip switch for debugging. *For more details, please download the PDF or feel free to contact us.

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6U VME CPU Module『SVA701』

6U VME CPU Module『SVA701』

Long-term supply with embedded specified components! Function expansion/customization is possible with option boards.

The "SVA701" is a 6U VME CPU Module equipped with the necessary I/F and functional expandability for control VME boards. By adopting the 11th generation TigerLake UP3 and our own PCIe-VME bridge (FPGA), long-term product supply is possible. It features endian-specific byte swap functionality, making VME access easy. Please feel free to contact us if you have any requests. 【Features】 ■ 11th generation Intel Processor series ■ Implementation of embedded system requirements ■ In-house development/domestic production *For more details, please refer to the PDF document or feel free to contact us.

  • Expansion Boards
  • CPU Module

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"CPU Module" Verdin iMX8M Plus

"CPU Module" Verdin iMX8M Plus

NXP i.MX8M Plus equipped with Toradex's Verdin family CPU module.

The NXP i.MX 8M Plus SoC features up to four powerful 64-bit Armv8 Cortex-A53 cores, providing sufficient power for typical industrial and medical applications while being a cost-effective choice for running the latest graphical user interface on Linux. The integrated Neural Processing Unit (NPU) is designed from the ground up to perform deep learning inference, capable of delivering several times the performance of CPU and GPU-based solutions in the same power range. Toradex offers integration with popular machine learning frameworks such as TensorFlow.

  • Microcomputer
  • ASIC
  • CPU Module

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XMC-CPU/2041 <PMC/XMC Series>

XMC-CPU/2041 <PMC/XMC Series>

52 LVTTL I/O with connector PMC-P14! Operating state function and fallback flash.

The "XMC-CPU/2041" is an FPGA-equipped XMC/PMC Quad Core PowerPC CPU. It features a Freescale PowerPC QorIQ P2041 running at 1.2GHz, with three Ethernet ports and one USB 2.0 port. There are hardware options available, including PowerPC at 1.5GHz, a maximum DRAM capacity of 2GB + ECC, and Precision Time Protocol (PTP) synchronization over Ethernet, so please feel free to contact us if you have any inquiries. 【Features】 ■ Freescale PowerPC QorIQ P2041, 1.2GHz ■ Xilinx FPGA Spartan 6 XC6LXT-45T for local applications ■ 3x Ethernet, 1x USB 2.0 ■ 52 LVTTL I/O via connector PMC-P14 ■ Operating state functionality and fallback flash * For more details, please refer to the PDF document or feel free to contact us. * An English version of the catalog is available for download.

  • Company：Renas
  • Price：Other
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Qseven Intel x6000E CPU module

Qseven Intel x6000E CPU module

Qseven Rev. 2.1 compliant, CPU module equipped with Intel Elkhart Lake.

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Possible to design carrier boards compatible with both ARM and x86 ■Many options available such as Intel, AMD, NXP ■Flexibility in functionality increase or decrease due to BOM component changes ■Short development period, quick market launch

  • Embedded Board Computers
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Qseven NXP i.MX 8【MAIA】

Qseven NXP i.MX 8【MAIA】

Qseven Rev. 2.1 compliant CPU module with NXP i.MX 8.

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Possible to design carrier boards compatible with both ARM and x86 ■Many options available, including Intel, AMD, and NXP ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick time to market

  • Embedded Board Computers
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μQseven NXP i.MX6 CPU module

μQseven NXP i.MX6 CPU module

μQseven compliant, NXP i.MX6 equipped CPU module

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Possible to design carrier boards compatible with both ARM and x86 ■Many options available, including Intel, AMD, and NXP ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

  • Embedded Board Computers
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COM-HPC Intel 11th Generation CPU Module

COM-HPC Intel 11th Generation CPU Module

COM-HPC compliant CPU module with Intel Tiger Lake H (client)

■Reduces overall development costs ■Global common standard ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality increase or decrease due to BOM component changes ■Short development period, quick market launch

  • Embedded Board Computers
  • CPU Module

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COM Express Intel 8th Generation CPU Module

COM Express Intel 8th Generation CPU Module

COM-EXPRESS TYPE6 compliant, Intel Whisky Lake equipped CPU module (compact)

■Reduces overall development costs ■Global common standard ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

  • Embedded Board Computers
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COM Express AMD EPYC CPU module

COM Express AMD EPYC CPU module

COM-EXPRESS TYPE7 compliant CPU module equipped with AMD EPYC Embedded 3000 (Basic)

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

  • Embedded Board Computers
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SMARC Xilinx Zynq FPGA module

SMARC Xilinx Zynq FPGA module

FPGA module equipped with Xilinx Zynq Ultrascale+ compliant with SMARC Rev. 2.0.

■Reduces overall development costs ■Global standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Feasible design of carrier boards compatible with both ARM and x86 ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

  • Embedded Board Computers
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2023 Comprehensive Catalog (CPU Modules and Compact Embedded Boards)

2023 Comprehensive Catalog (CPU Modules and Compact Embedded Boards)

2023 SECO's latest products packed! Over 80 products featured.

Board products such as CPU modules and compact embedded boards, as of May 2023, include the entire lineup from SECO.

  • Embedded Board Computers
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[Information] Touch Display Total Solution

[Information] Touch Display Total Solution

Providing high-quality products and professional technical services! Featuring "PCAP" and "touch display multifunction devices," etc.

In this document, we introduce FANNAL Electronics' "Touch Display Total Solution." We provide an introduction to solutions and services, including "TFT displays" and "optical bonding," as well as know-how on knob touch, blackening prevention, and 3A processing. We support software adjustments for the operating environment of terminal products and offer long-term technical support and logistics support from the design phase to the after-service phase. [Contents (partial)] ■ High-tech companies ■ Part of group global expansion ■ Solutions and services - TPM - PCAP - TFT displays *For more details, please refer to the PDF document or feel free to contact us.

  • Touch Panel
  • LCD display
  • CPU Module

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CPU module "AVIOR"

CPU module "AVIOR"

Performance of x86 in low power consumption modules! Introducing Qseven Rel. 2.0 compliant modules!

"AVIOR" is a CPU module equipped with Intel Atom E3800 and Celeron family (Bay Trail) processors. It offers x86 performance in a low-power module and can be used in industrial temperature ranges. It is suitable for fields such as biomedical/medical devices, HMI, industrial automation and control, and measurement instruments. 【Features】 ■ CPU: Intel Atom E3800, Celeron family (System-on-Chip) ■ Connectivity: USB 2.0 × 6, USB 3.0 × 1, PCI-e x1 × 3 ■ Graphics: Integrated Intel HD Graphics controller ■ Memory: Up to 8GB of dual-channel DDR3L 1333MHz ■ Usable in industrial temperature ranges *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "ATLAS"

CPU module "ATLAS"

Achieved high computing performance and graphics performance with the Qseven form factor!

"ATLAS" is a Time Coordinated Computing Qseven Rel. 2.1 compliant module equipped with Intel Atom X6000E series, Intel Pentium, Celeron N, and J series SoCs (Elkhart Lake). It achieves high computing and graphics performance in a Qseven form factor. It is applicable in various fields such as gaming, multimedia devices, and visual computing. 【Features】 ■CPU - Intel Atom x6000E series, Intel Pentium, Celeron N, and J series processors ■Connectivity - GbE x 1, high-precision time protocol IEEE 1588, USB 2.0 x 6, SuperSpeed USB 10Gbps x 2, up to PCI-e x 4 *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "ELECTRA"

CPU module "ELECTRA"

MPU built with advanced 14LPC FinFET process technology! Achieving increased speed and power efficiency.

"ELECTRA" is a μQseven standard module equipped with NXP i.MX 8M Mini & NXP i.MX 8M Nano processors. Built on advanced 14LPC FinFET process technology, this MPU achieves high speed and improved power efficiency. It is used in fields such as HMI, multimedia devices, thin clients, and vending machines. 【Features】 ■ CPU ・NXP i.MX 8M Mini family / i.MX 8M Nano family ■ Connectivity ・Gigabit Ethernet, optional Wi-Fi + BT 5.0, UART x 2, optional CAN, USB 2.0 x 5, PCI-e x1 x 1 *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "MAIA"

CPU module "MAIA"

NXP i.MX 8 application processor equipped! Qseven Rel. 2.1 compliant module

"MAIA" is a CPU module that leverages the wide scalability offered by the Qseven form factor and the i.MX 8 family. It is equipped with the NXP i.MX 8 application processor. The graphics feature an integrated GPU that supports two simultaneous video outputs. It can be applied in various fields such as industrial automation and control, smart vision, and vending machines. 【Features】 ■CPU - NXP i.MX 8 application processor ■Connectivity - USB 3.0 x 1, PCI-e x1 Gen3, CSI camera connector, boot selection signal ■Graphics - Integrated GPU, supports two simultaneous video outputs *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "NEMBUS"

CPU module "NEMBUS"

Achieve compact and highly flexible OTS modules at unique costs! Usable in industrial temperature ranges.

"NEMBUS" is a μQseven standard module equipped with the NXP i.MX 6 processor. It achieves a compact and highly flexible OTS module at a unique cost. It is used in various fields such as HMI, handheld terminals, and wireless technology. It can be used in an industrial temperature range, and the memory can be equipped with up to 1GB of onboard DDR3L. 【Features】 ■ CPU: Single-core/Dual-core Lite (Arm Cortex A9 core) ■ Connectivity: Fast Ethernet, GPI/O ■ Graphics: Dedicated 2D/3D graphics processor ■ Memory: Up to 1GB of onboard DDR3L ■ Usable in industrial temperature range *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "CALLISTO"

CPU module "CALLISTO"

For edge devices in challenging environments! Applicable to a wide range of fields such as games and HMIs.

The "CALLISTO" we handle is a COM Express 3.1 Type 6 Basic module equipped with a 13th generation Intel processor. It can be used in industrial temperature ranges. It enables intensive video processing and AI-based analysis for edge devices in challenging environments. It can be applied in various fields, including automation, biomedical/medical devices, surveillance equipment, and transportation. 【Features】 ■ CPU: 13th generation Intel processor aimed at IoT applications ■ Graphics: Embedded Intel Iris Xe graphics with up to 96 execution units ■ Connectivity: 1x NBase-T 2.5GbE; 2x USB4.0 Gen2; 4x USB3.2 Gen2; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x8 Gen4 and 2x PEG x4 Gen4 ■ Memory: Two DDR5 SO-DIMM slots supporting DDR5-4800 IBECC memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "CHANDRA"

CPU module "CHANDRA"

The operating temperature of the industrial version is -40°C to +85°C! Introducing products with versatility and robustness.

"CHANDRA" is a CPU module equipped with Intel Atom E3800 and Celeron families. It offers versatility and robustness, and can be used in industrial temperature ranges. It is applicable in a wide range of fields such as avionics, industrial automation and control, and transportation. Additionally, the video interface can be switched to manage additional DDI, embedded display port, or 18/24-bit single/dual-channel LVDS interfaces. 【Features】 ■ CPU: Intel Atom E3800 and Celeron family ■ Graphics: Integrated Intel HD Graphics 4000 series controller ■ Connectivity: 4x USB 3.0; 7x USB 2.0; 4x PCI-e x1 Gen2 ■ Memory: DDR3L SO-DIMM slots x2, up to 8GB *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "CHARON"

CPU module "CHARON"

Supports four independent displays! x86 "Zen" Core and elite GPU performance.

The product we handle, 'CHARON', is a COM Express Rel.3.0 Compact Type 6 module equipped with an AMD Ryzen embedded V1000 processor. The graphics feature an AMD Radeon Vega GPU with up to 11 computing units and supports DirectX 12. It can be used in industrial temperature ranges. This product is suitable for fields such as biomedical/medical devices and digital signage-infotainment. 【Features】 ■ CPU: AMD Ryzen embedded V1000 processor ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 4x PCI-e x1 Gen 3, PEG x8 Gen 3 ■ Memory: Supports up to two DDR4 SO-DIMM slots with DDR4-3200 ECC memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "ECHO"

CPU module "ECHO"

The operating temperature of the commercial version is 0°C to +60°C! It supports various designs with a scalable form factor.

"ECHO" is a COM Express Basic Type 6 module equipped with an Intel Haswell processor. It supports three simultaneous video outputs and is compatible with DirectX 11 and OpenGL 4.0. It can be applied in fields such as biomedical/medical devices and gaming. This high-performance product features a scalable form factor that accommodates various designs. Please feel free to contact us for inquiries. 【Features】 ■ CPU: Intel Haswell family CPU ■ Graphics: Integrated Intel HD Graphics 4600 ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 7x PCI-e x1 ■ Memory: Up to 16GB DDR3L-1600 with two SO-DIMM slots *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "JULIET"

CPU module "JULIET"

COM Express form factor and high-performance Intel SoC for secure IoT applications!

"JULIET" is a COM Express Rel. 3.0 Basic Type 7 module equipped with an Intel Xeon D-1700 processor. It can be used in industrial temperature ranges and is applicable in fields such as industrial automation and control, telecommunications, and server high-performance computing. Additionally, it supports up to four DDR4 SO-DIMM slots with ECC-enabled DDR4-2933 memory. 【Features】 ■ CPU: Intel Xeon D-1700 processor ■ Networking: 4x 10GBASE-KR interfaces + 1x 1GbE port (with NC-SI) ■ Connectivity: 4x Superspeed USB 5Gbps; 16x PCI-e Gen4 lanes + 16x PCI-e Gen3 lanes *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "LARISSA"

CPU module "LARISSA"

For mobile applications! Low power consumption multi-core Intel architecture

"LARISSA" is a COM Express 3.0 Compact Type 6 module equipped with 8th generation Intel Core and Celeron U series processors. The operating temperature for the commercial version is 0°C to +60°C, and the dimensions are 95x95mm. It features two DDR4 SODIMM slots that support DDR4-2400 memory. It can be applied in various fields, including biomedical/medical devices, edge computing, HMI, information kiosks, and measurement instruments. 【Features】 ■ CPU: 8th generation Intel Core and 15W TDP Celeron 4000 series processors (formerly Whiskey Lake) ■ Graphics: Intel UHD Graphics 620 / 610 ■ Connectivity: 4 x USB 3.1; 8 x USB 2.0, up to 8 x PCI-e x 1 ■ Memory: Two DDR4 SODIMM slots supporting DDR4-2400 memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "OBERON"

CPU module "OBERON"

Improved processing power due to outstanding platform performance! Applicable in fields such as HMI and gaming.

"OBERON" is a COM Express 3.0 Basic Type 6 module equipped with Intel Core/Xeon, Core/Xeon/Celeron processors. With outstanding platform performance, it enhances processing capabilities. The maximum number of cores is 6, and the maximum number of threads is 12. It also supports up to three digital display interfaces (DDI), DP 1.2, DVI, and HDMI 1.4. Please feel free to contact us for inquiries. 【Features】 ■Graphics: Intel UHD Graphics 630/P630 architecture, with up to 48 execution units ■Connectivity: 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3 ■Memory: Two DDR4 SO-DIMM slots supporting DDR4-2666 ECC memory, up to 64 GB *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "OPHELIA"

CPU module "OPHELIA"

For demanding edge applications with graphics and computing requirements!

"OPHELIA" is a COM Express 3.0 Type 6 Compact module equipped with the AMD Ryzen embedded V2000 SoC. The graphics feature an integrated AMD Radeon GPU with up to 7 computing units, supporting up to 4 independent displays. This product is applicable in various fields, including digital signage, infotainment, information kiosks, and monitoring equipment. 【Features】 ■ CPU: Embedded Ryzen V series V2000 FP6 platform with "Zen2" CPU and Radeon GPU core ■ Connectivity: 1x GbE; 1x SuperSpeed USB 10Gbps; 3x SuperSpeed USB 5Gbps; 8x USB 2.0; 8x PCI-e x1 Gen3; PEGx8 Gen3 ■ Memory: Two DDR4 SO-DIMM slots supporting DDR4-3200 ECC and non-ECC memory (up to 64 GB) *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "ORION"

CPU module "ORION"

Enhanced AI performance and efficiency! CPU module capable of operating in low power state SOC.

The "ORION" we handle is a COM-HPC client module equipped with a 12th generation Intel Core processor. Using a PCI-e x4 port, it allows for the connection of M.2 NVMe drives on the carrier board. It features immersive graphics and enhanced AI performance and efficiency in a standard form factor. The SOC can operate in a low power state and is applicable in various fields, including visual computing, transportation, surveillance equipment, and robotics. 【Features】 ■ CPU: 12th generation Intel Core processor ■ Graphics: Intel Iris Xe architecture, up to 96 EUs, up to 4 independent displays ■ Memory: Two DDR5 SO-DIMM slots supporting DDR5-4800 memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "TARVOS"

CPU module "TARVOS"

When high graphics and hyper-threading are important! Applicable in fields such as telecommunications.

We would like to introduce our CPU module 'TARVOS'. It is equipped with Intel's 6th and 7th generation Core/Xeon processors and supports up to three independent displays. The maximum number of cores is 4, making it suitable for various fields including biomedical/medical devices, HMI, gaming, and digital signage-infotainment. Please feel free to contact us if you have any inquiries. 【Features】 ■ CPU: Intel 6th and 7th generation Core/Xeon CPU ■ Graphics: Intel HD Graphics 530/P530/630/P630 ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3 ■ Memory: 2 x DDR4 So-DIMM slots *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "LEXELL"

CPU module "LEXELL"

Standard solution for multimedia applications! Supports two video outputs simultaneously.

"LEXELL" is a 2.1.1 module equipped with the NXP i.MX 8X application processor. It features an integrated graphics processing unit and supports two simultaneous video outputs. It can be used in an industrial temperature range. It is applicable in fields such as digital signage, infotainment, home automation, and multimedia devices. 【Specifications (excerpt)】 ■ CPU: NXP i.MX 8M application processor ■ Graphics: Integrated graphics processing unit, supports two simultaneous video outputs ■ Memory: Implemented LPDDR4-3200 memory, 32-bit interface, up to 4GB *For more details, please refer to the PDF document or feel free to contact us.

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