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CPU Module Product List and Ranking from 26 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Jun 24, 2026～Jul 21, 2026
This ranking is based on the number of page views on our site.

CPU Module Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jun 24, 2026～Jul 21, 2026
This ranking is based on the number of page views on our site.

  1. Suntex Co., Ltd. Shizuoka//Industrial Electrical Equipment
  2. SECO S.p.A Italy//Industrial Electrical Equipment
  3. アドバンテック Tokyo//Industrial Electrical Equipment
  4. 4 ADLINKジャパン 東京本社 Tokyo//Industrial Electrical Equipment
  5. 5 サンリツオートメイション Tokyo//IT/Telecommunications
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CPU Module Product ranking

Last Updated： Aggregation Period:Jun 24, 2026～Jul 21, 2026
This ranking is based on the number of page views on our site.

  1. NXP i.MX95 OSM CPU module OSM-IMX95 Suntex Co., Ltd.
  2. OSM CPU Module ADLINK OSM-MTK520 Suntex Co., Ltd.
  3. PC/104 CPU Module [PCM-3365] アドバンテック
  4. 6U VME CPU Module『SVA701』 サンリツオートメイション
  5. 4 MilDef Corporation Rugged CPU Unit Mobilite7 ナセル

CPU Module Product List

151～180 item / All 201 items

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CPU module

CPU module

The heart of the CPU board is realized on a small board! Designed and developed to specifications that suit the customer's needs.

N.M.R. Corporation handles "CPU Modules." This product realizes the heart of the CPU board on a small board. Various peripheral interfaces can be designed and developed according to the customer's specifications. Notably, it significantly differs from the ETX standard by adding PCI Express interfaces and many I/Os. 【Product Lineup】 ■ICE-BT-T10 ■ICE-BT-T10W2 ■ICE-ULT3 ■ICE-BT-T6 ■iQ7-BT-E38001 ■iQ7-BT-E38001W2 *For more details, please refer to the PDF materials or feel free to contact us.

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Q-Seven CPU Module [EQM-APL]

Q-Seven CPU Module [EQM-APL]

Q-Seven module equipped with Intel processor

Avalue's rugged environmental system is specially designed for long-term operation in harsh environments. Additionally, it is designed to maintain reliability in computer processing even under severe usage conditions. For more details, please contact us or download the catalog.

  • Embedded Board Computers
  • CPU Module

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SoM/CPUboard『iW-RainboW-G40M-OSM』

SoM/CPUboard『iW-RainboW-G40M-OSM』

Equipped with Bluetooth 5.0! Over 10 years of product lifespan program.

We would like to introduce the "iW-RainboW-G40M-OSM" that we handle. This product is an i.MX 8M Plus OSM LGA module, equipped with a 64-bit ARMv8 architecture, featuring the i.MX 8M Plus Q/QL/D CPU. Additionally, it includes an NPU with a neural network performance of 2.3 TOPS and 8GB of LPDDR4 memory. 【Features】 ■ i.MX 8M Plus Q/QL/D CPU ■ NPU with 2.3 TOPS neural network performance ■ 8GB LPDDR4 memory ■ IEEE 802.11a/b/g/n/ac/ax Wi-Fi ■ Bluetooth 5.0 *For more details, please refer to the PDF document or feel free to contact us.

  • Industrial PCs
  • Embedded Board Computers
  • Embedded OS
  • CPU Module

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iW-RainboW-G34M/G37M

iW-RainboW-G34M/G37M

Introducing the "i.MX 8M Mini or i.MX 8M Nano SODIMM SOM" that we handle!

Fujisoft is a domestic distributor of the 'iW-RainboW-G34M/G37M'. It adopts IEEE 802.11a/b/g/n/ac Wi-Fi & Bluetooth 5.0. It is a product that can be equipped with either the i.MX 8M Mini Q/QL/D/DL/S/SL CPU or the i.MX 8M Nano Q/QL/D/DL/S/SL CPU. With Fujisoft's extensive experience in embedded development, we provide a support system that ensures peace of mind both before and after purchase. 【Overview and Features】 ■ i.MX 8M Mini Q/QL/D/DL/S/SL CPU ■ i.MX 8M Nano Q/QL/D/DL/S/SL CPU ■ 10+ years of Product Longevity Program ■ IEEE 802.11a/b/g/n/ac Wi-Fi & Bluetooth 5.0 ■ Power and Cost Optimized *For more details, please refer to the related links or feel free to contact us.

  • Industrial PCs
  • Embedded Board Computers
  • Embedded OS
  • CPU Module

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iW-RainboW-G15M-SODIMM

iW-RainboW-G15M-SODIMM

Introducing the "i.MX 6 SODIMM SOM" handled by our company, which has extensive experience in embedded development!

Fujisoft is a domestic retailer of the "iW-RainboW-G15M-SODIMM." It is equipped with an i.MX 6 Q/D/DL/S Core CPU and features 1000/100/10 Mbps Ethernet. With extensive experience in embedded development, Fujisoft provides a reliable support system that ensures peace of mind both before and after purchase. 【Overview and Features】 ■ i.MX 6 Q/D/DL/S Core CPU ■ Multi-format HD 1080p encode & decode ■ 2D/3D Hardware Graphics Acceleration ■ 10+ years of Product Longevity Program ■ 1000/100/10 Mbps Ethernet ■ Modular & Compact SODIMM form factor 67.6mm X 37mm *For more details, please refer to the related links or feel free to contact us.

  • Industrial PCs
  • Embedded Board Computers
  • Embedded OS
  • CPU Module

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iW-RainboW-G18M-SODIMM

iW-RainboW-G18M-SODIMM

Introducing the "i.MX 6 UL/ULL/ULZ SODIMM SOM" that we handle!

Fujisoft is a domestic retailer of the 'iW-RainboW-G18M-SODIMM'. It is equipped with an i.MX 6 UL, ULL, ULZ CPU. The product is certified by CE and FCC. With extensive experience in embedded development, Fujisoft provides a reliable support system that ensures peace of mind both before and after purchase. Please feel free to contact us when you need assistance. 【Overview and Features】 ■ i.MX 6 UL, ULL, ULZ CPU ■ Advanced hardware enabled security ■ 10+ years of Product Longevity Program ■ Technical and quick customization support ■ Modular & Compact SODIMM form factor 67.6mm X 29mm ■ CE, FCC Certified *For more details, please refer to the related links or feel free to contact us.

  • Industrial PCs
  • Embedded Board Computers
  • Embedded OS
  • CPU Module

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i.MX93OSM-LF LGA iW-RainboW-G50M

i.MX93OSM-LF LGA iW-RainboW-G50M

Achieve high-performance ML applications that excel in cost efficiency and energy efficiency!

We would like to introduce the 'i.MX 93 OSM-LF LGA Module iW-RainboW-G50M' that we handle. It provides efficient machine learning (ML) acceleration and advanced security through the built-in EdgeLock secure enclave, supporting energy-efficient edge computing. By incorporating scalable Arm Cortex-A55 cores within the i.MX portfolio, it enhances the performance and energy efficiency of Linux-based edge applications. 【Features (partial)】 ■ i.MX 93 CPU with 64-bit ARM v8.2-A Architecture ■ NPU with up to 0.5 TOP/s Neural Network performance ■ Wi-Fi 6, Bluetooth 5.3 & IEEE802.15.4 connectivity ■ Supports Cortex-A55 cores *For more details, please download the PDF or feel free to contact us.

  • Embedded Board Computers
  • CPU Module

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Ultra-compact CPU module 'Linkey-100'

Ultra-compact CPU module 'Linkey-100'

Achieving ultra-miniaturization of 30mm × 50mm!

The "Linkey-100" is an ultra-compact CPU module that features an ARM Cortex-M4 (STM32 F4) in a size of 30mm x 50mm, and also includes a LAN connector. It provides cost-effective cloud computing for remote device management. Additionally, a development kit for creating this product is available. Please feel free to contact us if you have any requests. 【Features】 ■ Excellent peripherals of the CPU (STM32F4 series) are efficiently assigned to the expansion connector, enabling top-level performance. ■ Suitable as a device platform for small-batch production of various types. ■ Simplifies enclosure design. ■ LAN connector (RJ45) can be implemented on the expansion board. ■ Standard equipment includes an LED and a dip switch for debugging. *For more details, please download the PDF or feel free to contact us.

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6U VME CPU Module『SVA701』

6U VME CPU Module『SVA701』

Long-term supply with embedded specified components! Function expansion/customization is possible with option boards.

The "SVA701" is a 6U VME CPU Module equipped with the necessary I/F and functional expandability for control VME boards. By adopting the 11th generation TigerLake UP3 and our own PCIe-VME bridge (FPGA), long-term product supply is possible. It features endian-specific byte swap functionality, making VME access easy. Please feel free to contact us if you have any requests. 【Features】 ■ 11th generation Intel Processor series ■ Implementation of embedded system requirements ■ In-house development/domestic production *For more details, please refer to the PDF document or feel free to contact us.

  • Expansion Boards
  • CPU Module

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"CPU Module" Verdin iMX8M Plus

"CPU Module" Verdin iMX8M Plus

NXP i.MX8M Plus equipped with Toradex's Verdin family CPU module.

The NXP i.MX 8M Plus SoC features up to four powerful 64-bit Armv8 Cortex-A53 cores, providing sufficient power for typical industrial and medical applications while being a cost-effective choice for running the latest graphical user interface on Linux. The integrated Neural Processing Unit (NPU) is designed from the ground up to perform deep learning inference, capable of delivering several times the performance of CPU and GPU-based solutions in the same power range. Toradex offers integration with popular machine learning frameworks such as TensorFlow.

  • Microcomputer
  • ASIC
  • CPU Module

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XMC-CPU/2041 <PMC/XMC Series>

XMC-CPU/2041 <PMC/XMC Series>

52 LVTTL I/O with connector PMC-P14! Operating state function and fallback flash.

The "XMC-CPU/2041" is an FPGA-equipped XMC/PMC Quad Core PowerPC CPU. It features a Freescale PowerPC QorIQ P2041 running at 1.2GHz, with three Ethernet ports and one USB 2.0 port. There are hardware options available, including PowerPC at 1.5GHz, a maximum DRAM capacity of 2GB + ECC, and Precision Time Protocol (PTP) synchronization over Ethernet, so please feel free to contact us if you have any inquiries. 【Features】 ■ Freescale PowerPC QorIQ P2041, 1.2GHz ■ Xilinx FPGA Spartan 6 XC6LXT-45T for local applications ■ 3x Ethernet, 1x USB 2.0 ■ 52 LVTTL I/O via connector PMC-P14 ■ Operating state functionality and fallback flash * For more details, please refer to the PDF document or feel free to contact us. * An English version of the catalog is available for download.

  • Company：Renas
  • Price：Other
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Qseven Intel x6000E CPU module

Qseven Intel x6000E CPU module

Qseven Rev. 2.1 compliant, CPU module equipped with Intel Elkhart Lake.

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Possible to design carrier boards compatible with both ARM and x86 ■Many options available such as Intel, AMD, NXP ■Flexibility in functionality increase or decrease due to BOM component changes ■Short development period, quick market launch

  • Embedded Board Computers
  • CPU Module

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Qseven NXP i.MX 8【MAIA】

Qseven NXP i.MX 8【MAIA】

Qseven Rev. 2.1 compliant CPU module with NXP i.MX 8.

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Possible to design carrier boards compatible with both ARM and x86 ■Many options available, including Intel, AMD, and NXP ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick time to market

  • Embedded Board Computers
  • CPU Module

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μQseven NXP i.MX6 CPU module

μQseven NXP i.MX6 CPU module

μQseven compliant, NXP i.MX6 equipped CPU module

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Possible to design carrier boards compatible with both ARM and x86 ■Many options available, including Intel, AMD, and NXP ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

  • Embedded Board Computers
  • CPU Module

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COM-HPC Intel 11th Generation CPU Module

COM-HPC Intel 11th Generation CPU Module

COM-HPC compliant CPU module with Intel Tiger Lake H (client)

■Reduces overall development costs ■Global common standard ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality increase or decrease due to BOM component changes ■Short development period, quick market launch

  • Embedded Board Computers
  • CPU Module

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COM Express Intel 8th Generation CPU Module

COM Express Intel 8th Generation CPU Module

COM-EXPRESS TYPE6 compliant, Intel Whisky Lake equipped CPU module (compact)

■Reduces overall development costs ■Global common standard ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

  • Embedded Board Computers
  • CPU Module

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COM Express AMD EPYC CPU module

COM Express AMD EPYC CPU module

COM-EXPRESS TYPE7 compliant CPU module equipped with AMD EPYC Embedded 3000 (Basic)

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

  • Embedded Board Computers
  • CPU Module

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SMARC Xilinx Zynq FPGA module

SMARC Xilinx Zynq FPGA module

FPGA module equipped with Xilinx Zynq Ultrascale+ compliant with SMARC Rev. 2.0.

■Reduces overall development costs ■Global standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Feasible design of carrier boards compatible with both ARM and x86 ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

  • Embedded Board Computers
  • CPU Module

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2023 Comprehensive Catalog (CPU Modules and Compact Embedded Boards)

2023 Comprehensive Catalog (CPU Modules and Compact Embedded Boards)

2023 SECO's latest products packed! Over 80 products featured.

Board products such as CPU modules and compact embedded boards, as of May 2023, include the entire lineup from SECO.

  • Embedded Board Computers
  • CPU Module

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[Information] Touch Display Total Solution

[Information] Touch Display Total Solution

Providing high-quality products and professional technical services! Featuring "PCAP" and "touch display multifunction devices," etc.

In this document, we introduce FANNAL Electronics' "Touch Display Total Solution." We provide an introduction to solutions and services, including "TFT displays" and "optical bonding," as well as know-how on knob touch, blackening prevention, and 3A processing. We support software adjustments for the operating environment of terminal products and offer long-term technical support and logistics support from the design phase to the after-service phase. [Contents (partial)] ■ High-tech companies ■ Part of group global expansion ■ Solutions and services - TPM - PCAP - TFT displays *For more details, please refer to the PDF document or feel free to contact us.

  • Touch Panel
  • LCD display
  • CPU Module

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CPU module "AVIOR"

CPU module "AVIOR"

Performance of x86 in low power consumption modules! Introducing Qseven Rel. 2.0 compliant modules!

"AVIOR" is a CPU module equipped with Intel Atom E3800 and Celeron family (Bay Trail) processors. It offers x86 performance in a low-power module and can be used in industrial temperature ranges. It is suitable for fields such as biomedical/medical devices, HMI, industrial automation and control, and measurement instruments. 【Features】 ■ CPU: Intel Atom E3800, Celeron family (System-on-Chip) ■ Connectivity: USB 2.0 × 6, USB 3.0 × 1, PCI-e x1 × 3 ■ Graphics: Integrated Intel HD Graphics controller ■ Memory: Up to 8GB of dual-channel DDR3L 1333MHz ■ Usable in industrial temperature ranges *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "ATLAS"

CPU module "ATLAS"

Achieved high computing performance and graphics performance with the Qseven form factor!

"ATLAS" is a Time Coordinated Computing Qseven Rel. 2.1 compliant module equipped with Intel Atom X6000E series, Intel Pentium, Celeron N, and J series SoCs (Elkhart Lake). It achieves high computing and graphics performance in a Qseven form factor. It is applicable in various fields such as gaming, multimedia devices, and visual computing. 【Features】 ■CPU - Intel Atom x6000E series, Intel Pentium, Celeron N, and J series processors ■Connectivity - GbE x 1, high-precision time protocol IEEE 1588, USB 2.0 x 6, SuperSpeed USB 10Gbps x 2, up to PCI-e x 4 *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "ELECTRA"

CPU module "ELECTRA"

MPU built with advanced 14LPC FinFET process technology! Achieving increased speed and power efficiency.

"ELECTRA" is a μQseven standard module equipped with NXP i.MX 8M Mini & NXP i.MX 8M Nano processors. Built on advanced 14LPC FinFET process technology, this MPU achieves high speed and improved power efficiency. It is used in fields such as HMI, multimedia devices, thin clients, and vending machines. 【Features】 ■ CPU ・NXP i.MX 8M Mini family / i.MX 8M Nano family ■ Connectivity ・Gigabit Ethernet, optional Wi-Fi + BT 5.0, UART x 2, optional CAN, USB 2.0 x 5, PCI-e x1 x 1 *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "MAIA"

CPU module "MAIA"

NXP i.MX 8 application processor equipped! Qseven Rel. 2.1 compliant module

"MAIA" is a CPU module that leverages the wide scalability offered by the Qseven form factor and the i.MX 8 family. It is equipped with the NXP i.MX 8 application processor. The graphics feature an integrated GPU that supports two simultaneous video outputs. It can be applied in various fields such as industrial automation and control, smart vision, and vending machines. 【Features】 ■CPU - NXP i.MX 8 application processor ■Connectivity - USB 3.0 x 1, PCI-e x1 Gen3, CSI camera connector, boot selection signal ■Graphics - Integrated GPU, supports two simultaneous video outputs *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "NEMBUS"

CPU module "NEMBUS"

Achieve compact and highly flexible OTS modules at unique costs! Usable in industrial temperature ranges.

"NEMBUS" is a μQseven standard module equipped with the NXP i.MX 6 processor. It achieves a compact and highly flexible OTS module at a unique cost. It is used in various fields such as HMI, handheld terminals, and wireless technology. It can be used in an industrial temperature range, and the memory can be equipped with up to 1GB of onboard DDR3L. 【Features】 ■ CPU: Single-core/Dual-core Lite (Arm Cortex A9 core) ■ Connectivity: Fast Ethernet, GPI/O ■ Graphics: Dedicated 2D/3D graphics processor ■ Memory: Up to 1GB of onboard DDR3L ■ Usable in industrial temperature range *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "CALLISTO"

CPU module "CALLISTO"

For edge devices in challenging environments! Applicable to a wide range of fields such as games and HMIs.

The "CALLISTO" we handle is a COM Express 3.1 Type 6 Basic module equipped with a 13th generation Intel processor. It can be used in industrial temperature ranges. It enables intensive video processing and AI-based analysis for edge devices in challenging environments. It can be applied in various fields, including automation, biomedical/medical devices, surveillance equipment, and transportation. 【Features】 ■ CPU: 13th generation Intel processor aimed at IoT applications ■ Graphics: Embedded Intel Iris Xe graphics with up to 96 execution units ■ Connectivity: 1x NBase-T 2.5GbE; 2x USB4.0 Gen2; 4x USB3.2 Gen2; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x8 Gen4 and 2x PEG x4 Gen4 ■ Memory: Two DDR5 SO-DIMM slots supporting DDR5-4800 IBECC memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "CHANDRA"

CPU module "CHANDRA"

The operating temperature of the industrial version is -40°C to +85°C! Introducing products with versatility and robustness.

"CHANDRA" is a CPU module equipped with Intel Atom E3800 and Celeron families. It offers versatility and robustness, and can be used in industrial temperature ranges. It is applicable in a wide range of fields such as avionics, industrial automation and control, and transportation. Additionally, the video interface can be switched to manage additional DDI, embedded display port, or 18/24-bit single/dual-channel LVDS interfaces. 【Features】 ■ CPU: Intel Atom E3800 and Celeron family ■ Graphics: Integrated Intel HD Graphics 4000 series controller ■ Connectivity: 4x USB 3.0; 7x USB 2.0; 4x PCI-e x1 Gen2 ■ Memory: DDR3L SO-DIMM slots x2, up to 8GB *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "CHARON"

CPU module "CHARON"

Supports four independent displays! x86 "Zen" Core and elite GPU performance.

The product we handle, 'CHARON', is a COM Express Rel.3.0 Compact Type 6 module equipped with an AMD Ryzen embedded V1000 processor. The graphics feature an AMD Radeon Vega GPU with up to 11 computing units and supports DirectX 12. It can be used in industrial temperature ranges. This product is suitable for fields such as biomedical/medical devices and digital signage-infotainment. 【Features】 ■ CPU: AMD Ryzen embedded V1000 processor ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 4x PCI-e x1 Gen 3, PEG x8 Gen 3 ■ Memory: Supports up to two DDR4 SO-DIMM slots with DDR4-3200 ECC memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "ECHO"

CPU module "ECHO"

The operating temperature of the commercial version is 0°C to +60°C! It supports various designs with a scalable form factor.

"ECHO" is a COM Express Basic Type 6 module equipped with an Intel Haswell processor. It supports three simultaneous video outputs and is compatible with DirectX 11 and OpenGL 4.0. It can be applied in fields such as biomedical/medical devices and gaming. This high-performance product features a scalable form factor that accommodates various designs. Please feel free to contact us for inquiries. 【Features】 ■ CPU: Intel Haswell family CPU ■ Graphics: Integrated Intel HD Graphics 4600 ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 7x PCI-e x1 ■ Memory: Up to 16GB DDR3L-1600 with two SO-DIMM slots *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "JULIET"

CPU module "JULIET"

COM Express form factor and high-performance Intel SoC for secure IoT applications!

"JULIET" is a COM Express Rel. 3.0 Basic Type 7 module equipped with an Intel Xeon D-1700 processor. It can be used in industrial temperature ranges and is applicable in fields such as industrial automation and control, telecommunications, and server high-performance computing. Additionally, it supports up to four DDR4 SO-DIMM slots with ECC-enabled DDR4-2933 memory. 【Features】 ■ CPU: Intel Xeon D-1700 processor ■ Networking: 4x 10GBASE-KR interfaces + 1x 1GbE port (with NC-SI) ■ Connectivity: 4x Superspeed USB 5Gbps; 16x PCI-e Gen4 lanes + 16x PCI-e Gen3 lanes *For more details, please refer to the PDF document or feel free to contact us.

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