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CVD(成膜) - メーカー・企業と製品の一覧

CVDの製品一覧

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PlasmaMAX Hollow Cathode Plasma CVD

PlasmaMAX Hollow Cathode Plasma CVD

It is designed to optimize the mass production process by maximizing the substrate width and film deposition speed while maintaining the highest quality.

This technology allows for the optimization of the manufacturing of barrier films, optical multilayer film products, functional fibers, displays, and a series of related custom applications. The PlasmaMAX hollow cathode can be customized in shape, making it easy to integrate into horizontal inline vacuum deposition systems, vertical inline vacuum deposition systems, and roll-to-roll web coating processes. With an easily customizable design platform and stable processes across a wide range of pressure levels, it can be used with most existing CVD and PVD equipment, enabling performance optimization at a low cost.

  • Plasma surface treatment equipment

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Mist CVD Mistic

Mist CVD Mistic

Optimal high corrosion resistance and high conductivity oxide film for metal separators for fuel cells.

<Features> A simple and highly functional CVD coating that can form a film in the atmosphere.

  • Processing Contract

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High-performance Single-wafer Processing Atmospheric Pressure CVD (APCVD) System (A200V)

High-performance Single-wafer Processing Atmospheric Pressure CVD (APCVD) System (A200V)

Small quantities and wide varieties. NSG(SiO2)/PSG/BPSG deposition. Single-wafer processing atmospheric pressure CVD (APCVD) system (Compatible with 8-inch SiC wafers)

A200V is a single-wafer processing atmospheric pressure CVD system (APCVD system) for silicon oxide (SiO2) deposition, such as interlayer insulating deposition, passivation deposition (protective deposition), and sacrificial deposition. 【Features】 　・Ideal for insulating depositions and diffusion/plasma mask depositions. 　・Low particle film deposition by single-wafer face-down deposition. 　・High safety and deposition stability by using a sealed chamber. 　・Wafer warp correction function (patented) for SiC wafers. 　・Low-load, long-cycle maintenance. 　・Compact cabinet and adjacent installation to the mirror type for space saving. 　・Low CoO (low running cost) 【Applications】 　・Interlayer dielectric deposition for power semiconductors (NSG/PSG/BPSG) 　・Hard mask for diffusion/ion implantation, Sacrificial depositions (NSG) 　・Passivation depositions (protective depositions, insulating depositions) (NSG) 　・Optical Waveguide (NSG/BPSG) *For more details, please contact us or download the catalog for further information.

  • CVD Equipment

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Atmospheric Pressure CVD (APCVD) System for Small-scale Production and Development (D501)

Atmospheric Pressure CVD (APCVD) System for Small-scale Production and Development (D501)

For prototyping, development, and small lot production For deposition of NSG(SiO2)/BSG/PSG/BPSG Batch processing (simultaneous processing of multiple substrates) APCVD system

The D501 is a batch processing (multiple-unit simultaneous processing) atmospheric pressure CVD system (APCVD system) for small-volume production/testing and silicon oxide deposition (SiO2 deposition) on irregularly shaped substrates. 【Features】 　・Simultaneous processing of substrates of different shapes and sizes 　・High deposition speed 　・Simple maintenance 　・Small footprint 　・Low CoO (low running cost) 【Applications】 　・Interlayer insulating (NSG/PSG/BPSG) 　・Hard mask for diffusion/ion implantation, Sacrificial deposition (NSG) 　・Passivation deposition (protective deposition, insulating deposition) (NSG) 　・Source films for solid phase diffusion for solar cells (BSG, PSG)/Cap deposition (NSG) *For more details, please contact us or download the catalog for further information.

  • CVD Equipment

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High-productivity Continuous Atmospheric Pressure CVD (APCVD) System (AMAX1200)

High-productivity Continuous Atmospheric Pressure CVD (APCVD) System (AMAX1200)

Mass production / NSG(SiO2)/PSG/BPSG deposition High-productivity / Continuous atmospheric pressure CVD (APCVD) system (for 12-inch wafers)

The AMAX series is a continuous atmospheric pressure CVD system (APCVD system) for silicon oxide (SiO2) deposition, such as an interlayer insulator deposition, passivation deposition (protective deposition), and back seal (for epitaxial wafers). 【Features】 　・High productivity of up to 56 wafers/h (wafer size: up to 12 inches) 　・No vacuum or plasma is required (thermal CVD) 　・SiC trays are used to prevent heavy metal contamination. 　・Simple maintenance. 　・Low CoO (low running cost) 【Applications】 　・Back seal for epitaxial wafers (NSG) 　・Passivation deposition (protective deposition, insulating deposition) (NSG) *For more details, please contact us or download the catalog to view.

  • CVD Equipment

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High-productivity Continuous Atmospheric Pressure CVD (APCVD) System (AMAX800V)

High-productivity Continuous Atmospheric Pressure CVD (APCVD) System (AMAX800V)

Mass Production / NSG(SiO2)/PSG/BPSG deposition　 High-productivity/Continuous atmospheric pressure CVD (APCVD) system (for up to 8-inch wafers)

The AMAX series is a continuous atmospheric pressure CVD system (APCVD system) for silicon oxide (SiO2) deposition, such as interlayer insulator deposition, passivation deposition (protective deposition), and back seal (for epitaxial wafers). 【Features】 　・High productivity of up to 100 wafers/hr. (wafer size: up to 8 inches) 　・No vacuum or plasma is required (thermal CVD) 　・SiC trays are used to prevent heavy metal contamination. 　・Simple maintenance. 　・Low CoO (low running cost) 【Applications】 　・Back seal for epitaxial wafers (NSG) 　・Interlayer insulator deposition for power semiconductors (NSG/PSG/BPSG) 　・Hard mask for diffusion/Ion implantation, Sacrificial deposition (NSG) 　・Passivation deposition (protective deposition, insulating deposition) (NSG) *For more details, please contact us or download the catalog for further information.

  • CVD Equipment

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CVD, PECVD horizontal furnace device "EVAD series"

CVD, PECVD horizontal furnace device "EVAD series"

Equipped with a flow management system! Processing of powders at high temperatures using CVD/PECVD is possible.

The "EVAD Series" is a CVD and PECVD horizontal furnace device capable of synthesizing and forming films from gas, vapor, liquid, and solid raw materials. It controls temperature distribution through single-zone and multi-zone configurations, and allows for high-temperature CVD/PECVD processing of powders using a high-quality stainless steel chamber with a rotation mechanism. The PLASMICON control system supports fully automated processes and data storage. 【Features】 ■ Equipped with the FLOCON series flow management system ■ Capable of incorporating the ICP plasma source from the PLUME series ■ Capable of synthesizing and forming films from gas, vapor, liquid, and solid raw materials ■ Temperature distribution control through single-zone and multi-zone configurations *For more details, please refer to the PDF document or feel free to contact us.

  • CVD Equipment

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