Etching×豊和産業 - メーカー・企業と製品の一覧

Photo etching

Microfabrication is possible from small-scale prototypes. Photo-etching.

◎ Prototyping available from a single piece ◎ Consistent process from thin film formation ◎ Prototyping for dicing, bump formation, etc. also available ◎ Patterning of dielectric films and multilayer films possible with lift-off processing ◎ Substrate size can be customized ◎ Etching of Si wafers and glass substrates is also possible ◎ Short delivery times available (consultation required) ◎ Supports rigid and FPC substrates as well

企業：豊和産業
価格：Other

Printed Circuit Board
Processing Contract
others

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Si anisotropic etching

Anisotropic etching of Si is a technique that utilizes the crystal axis orientation of Si to create half-holes and through-holes. For example, when a Si wafer (type #100) is anisotropically etched, sharp and high-precision patterning is possible at an angle of 54.7 degrees to the crystal axis direction. For more details, please feel free to "Contact Us."

企業：豊和産業
価格：Other

others

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Glass etching

Glass etching does not have the directionality of Si wafers, but the range of material and work dimensions is very broad, and it is used in various fields. For more details, please feel free to "contact us."

企業：豊和産業
価格：Other

others

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[Must-See for Engineers!!] MEMS-related Photo Etching Technical Documentation Collection

A collection of technical materials that consolidates useful information for research and development related to MEMS, where technological development is advancing, is available for free!

MEMS, centered around photofabrication and micromachine technology, is expected to thrive in various application fields. We are pleased to announce the comprehensive release of a "Technical Data Collection" that includes numerous processing and application technologies. This collection is filled with information on essential technologies such as "photoetching," which is a fundamental technology in MEMS and display device substrates; "dicing processing," a technique for accurately cutting out circuits formed on silicon wafers into chips; and "bump formation," which is indispensable for various mounting technologies such as CSP, BGA, and flip chips. For more details, please contact us or refer to the catalog.

企業：豊和産業
価格：Other

Processing Contract
Wafer processing/polishing equipment

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Photo etching

We accept small-scale prototypes using precision photographic technology for fine processing.

We accept small-scale prototypes using photolithography and precision photography technology, which are essential technologies in MEMS and display devices. We form thin films on substrates such as glass substrates, silicon wafers, films, and ceramics, and create fine patterns through a consistent photolithography process. We can accommodate prototypes starting from a single piece. We also support prototypes for dicing and bump formation. Additionally, we can pattern dielectric films and multilayer films using lift-off processing. Substrate sizes can be customized as needed. Etching of silicon wafers and glass substrates is also possible. We can respond with short lead times (consultation required) and can accommodate rigid and FPC substrates. For more details, please contact us or refer to our catalog.

企業：豊和産業
価格：Other

Processing Contract

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Etching×豊和産業 - メーカー・企業と製品の一覧

Etchingの製品一覧

Photo etching

Si anisotropic etching

Glass etching

[Must-See for Engineers!!] MEMS-related Photo Etching Technical Documentation Collection

Photo etching

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