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Evaporation Equipment Product List and Ranking from 41 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Evaporation Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. エイエルエステクノロジー Kanagawa//Testing, Analysis and Measurement
  2. 神港精機 東京支店 Tokyo//Industrial Machinery
  3. テルモセラ・ジャパン 本社 Tokyo//Industrial Electrical Equipment
  4. 4 サンユー電子 Tokyo//Testing, Analysis and Measurement
  5. 5 ジャパンクリエイト Saitama//Testing, Analysis and Measurement
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Evaporation Equipment Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. ALST Technology Co., Ltd. Company Profile エイエルエステクノロジー
  2. TMP type vacuum deposition device サンユー電子
  3. High-precision vacuum deposition device マイクロフェーズ
  4. 4 Organic Device Deposition Equipment E-100J エイエルエステクノロジー
  5. 5 Load lock type EB evaporation deposition device ジャパンクリエイト

Evaporation Equipment Product List

31～45 item / All 84 items

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Small Vacuum Vapor Deposition Device "HVE-100" [Achieving Clean Film Formation!]

Small Vacuum Vapor Deposition Device "HVE-100" [Achieving Clean Film Formation!]

A compact vacuum deposition device capable of clean film formation! It is equipped with a shutter, allowing for stable deposition!

The "HVE-100" is a compact vacuum deposition device that saves space. The substrate deposition surface is installed facing downward, and the arrangement allows for deposition upwards through evaporation from a resistance heating source (deposition up). It is equipped with a shutter, enabling stable deposition. 【Features】 ■ High vacuum exhaust system: Achieves a vacuum level of <10^-4Pa for clean film formation ■ The chamber is made of SUS for easy maintenance and has internal anti-deposition plates ■ Space-saving/compact: Desktop model with dimensions of W500×D395mm ■ Compatible with your existing exhaust system and film thickness measurement devices *For more details, please refer to the PDF document or feel free to contact us.

  • Vacuum Equipment
  • Evaporation Equipment

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BS series research and development electron beam evaporation device

BS series research and development electron beam evaporation device

A vacuum deposition device that can be customized as needed according to its use and purpose.

The BS series electron beam evaporation system from Nippon Electronics Corporation is an evaporation device suitable for research and development as well as small-scale production. It can be equipped with various optional devices, and the chamber shape and load lock can be customized according to your requirements. 〇 Features - The evaporation sources can be selected from electron beam evaporation sources (electron guns), bombardment evaporation sources, and resistance heating evaporation sources, allowing for multiple units to be combined as desired. - Low-temperature and low-damage evaporation is possible with an electron gun plus a reflective electron trap, or through bombardment evaporation, making it particularly effective for lift-off evaporation using resist. - Stable evaporation of aluminum is achievable, and reusable liners are also provided. *For more details, please download the PDF or feel free to contact us.

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  • Evaporation Equipment

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Thin Film Deposition Device

Thin Film Deposition Device

Magnetrons, ion beams, and more! You can choose from a variety of thin film deposition solutions.

Our company offers "thin film deposition equipment" that provides consistent and reproducible results through a wide range of process capabilities, ease of use, excellent reliability, and global service and support. You can choose from various thin film deposition solutions that accommodate a wide range of materials and applications, including evaporation, thermal evaporation, magnetron, sputtering, PE-CVD, and ion beam. Additionally, as an agent for overseas semiconductor manufacturing equipment manufacturers, we engage in the sale and installation of new semiconductor manufacturing equipment. 【Product Lineup】 ■Infinity Ion Beam Deposition Systems ■Infinity Ion Beam Etch Systems *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductor manufacturing equipment

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BAK Family Fully Automatic Vapor Deposition Function Equipped

BAK Family Fully Automatic Vapor Deposition Function Equipped

Introducing the BAK deposition platform that allows for various chamber sizes and process automation options.

The "BAK Family," a deposition machine equipped with a new level of flexibility and process control, not only provides deposition work for power devices, wireless, LEDs, MEMS, and photonics but also represents a new generation of deposition equipment that achieves automatic substrate exchange and high throughput. From the compact BAK501 for universities and research institutions to the Multi BAK for mass production, we can propose a suitable BAK for all customers, from research and development to mass production. 【Features】 ■Selectable deposition distances from 0.5m to 2.0m ■Highly flexible processes that allow the use of multiple materials without vacuum break ■Fully automated options incorporating load locks and loading robots *For more details, please refer to the related links or feel free to contact us.

  • Evaporation Equipment

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Organic EL Vacuum Deposition Device

Organic EL Vacuum Deposition Device

Organic EL Vacuum Deposition Device

The mask alignment mechanism achieves nano-order alignment using a fine motion piezo XY table and a coarse motion stepping motor XYΘ table.

  • Hydraulic Equipment

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Liftoff process compatible vacuum deposition equipment

Liftoff process compatible vacuum deposition equipment

This is a dedicated deposition device designed for the lift process commonly used in high-frequency communication devices.

The "Lift-off Process Compatible Vacuum Deposition System" is a dedicated deposition device designed for the lift-off process, widely used in optical devices and high-frequency communication devices such as compound semiconductors and SAW devices. Equipped with an electron gun and resistance heating electrodes as evaporation sources, it enables the formation of thick films, including high-melting-point electrode films and precious metals. It excels in the verticality of the incident angle of evaporated particles onto the substrate, and low-temperature deposition is possible due to various mechanisms that prevent temperature rise of the substrate during film formation (substrate water cooling mechanism, reflective electron trap for the electron gun, radiation light prevention measures). **Features** - Verticality of the incident angle of deposition particles onto the substrate (90°±3° at 6-inch wafers) - Low-temperature deposition (below 70°C = proven value) due to the substrate water cooling mechanism - High-speed exhaust with a large-diameter exhaust system and clean background for dense film quality - Flexible hard and soft compatibility with a rich variety of options (single wafer type = CtoC conversion, load lock conversion, composite process = load lock conversion + bonding with other process chambers) - A demo unit is permanently available for sample testing. *For more details, please refer to the PDF document or feel free to contact us.*

  • Evaporation Equipment

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Horizontal vapor deposition device

Horizontal vapor deposition device

Double-sided film formation, edge film formation, compact, large batch processing. The substrate's self-rotation mechanism enables control of the deposition surface. Providing unique processes for quartz oscillators and thin-film resistors.

Equipped with a unique substrate mechanism ideal for double-sided film deposition on small substrates and small-diameter wafers, edge film deposition on ceramic substrates, and mask film deposition. A standard horizontal deposition device with a large processing capacity in a compact chamber. Various options for evaporation sources, heating temperatures, and exhaust systems are available. Capable of handling a wide range of applications from resin decoration to mass production of electrode formation for electronic components with a proven unique mechanism.

  • Evaporation Equipment

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Large Vapor Deposition Device (AAH Type for Automotive Parts)

Large Vapor Deposition Device (AAH Type for Automotive Parts)

Large deposition equipment with extensive experience in film formation for resin exterior products; optimal for film formation of long resin molded products; resin metallization and discontinuous film formation; standard type for mass production of automotive parts.

Supports full film formation of long-length resin molded products over 1 meter. Features high-speed exhaust and low-temperature deposition. Compatible with mass production lines through short takt processing. Achieves high film adhesion through ion bombardment treatment before film formation. Supports high-speed deposition of various metals by using multiple electron guns. Realizes stable fully automatic film formation of discontinuous films through control with a quartz crystal oscillation thickness gauge. Fully automatic deposition system with high stability.

  • Other painting machines
  • Evaporation Equipment
  • Plating Equipment

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Compound semiconductor deposition device (AAMF-C1650SPB type)

Compound semiconductor deposition device (AAMF-C1650SPB type)

A dedicated deposition device optimal for advanced optical devices. Achieves a smooth film surface with low-temperature, low-damage film formation. High-quality electrode films realized by hardware compatible with ultra-high vacuum.

A large-diameter cryopump has been adopted in a more compact chamber than conventional types, and ultra-high vacuum compatibility has been implemented in each mechanism of the chamber, enabling a clean high-vacuum environment. The evaporation source uses an electron gun with a water-cooled reflective electron trap, achieving low-damage film formation that prevents electron bombardment on the substrate. The well-established six-gun electron gun is compatible with the formation of multilayer film electrodes that include high-melting-point metals. It features stable deposition, eliminating substrate damage from micro-arcs and abnormalities on the film surface caused by droplets. It can also accommodate lift-off deposition according to the process and production volume. During lift-off deposition, a water-cooling mechanism from the back of the substrate compatible with thick-film electrodes allows for the formation of precious metal thick-film electrodes.

  • Evaporation Equipment

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Electron beam evaporation device

Electron beam evaporation device

Yashima's electron beam deposition equipment is all custom-ordered. It is efficient, highly expandable for the future, and simple. Therefore, the price is also reasonable.

Electron beam deposition equipment is standard for vacuum deposition of high melting point materials. Our company supports not only our original deposition sources but also those from various manufacturers. We provide a high vacuum and ultra-high vacuum environment to stabilize the electron beam. We accommodate substrate heaters, rotation, and more. We support load lock specifications. We also accommodate manual/automatic operation via sequencer and touch panel.

  • Evaporation Equipment

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Custom-made production achievements: Vapor deposition equipment

Custom-made production achievements: Vapor deposition equipment

We have a track record of devices such as the "two-stage composite Pt deposition system"! Please contact us when you need assistance.

We would like to introduce the custom manufacturing achievements of Japan Create Co., Ltd. regarding "deposition devices." We have a track record of "two-stage composite Pt deposition devices," "lubrication deposition devices for HDD media research and development," and "load-lock type high vacuum ultra-high temperature EB deposition devices." Sample processing is being conducted using demo equipment. Please feel free to contact us when needed. 【Manufacturing Achievements】 ■ Two-stage composite Pt deposition device ■ Lubrication deposition device for HDD media research and development ■ Load-lock type high vacuum ultra-high temperature EB deposition device *For more details, please refer to the PDF materials or feel free to contact us.

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  • Evaporation Equipment

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Organic EL evaporation device

Organic EL evaporation device

You can freely choose from the plasma cleaning chamber, organic deposition chamber, electrode deposition chamber, sealing chamber, and more!

The "Organic EL Deposition Device" is a multi-chamber system suitable for device and material development. It is capable of processing from pre-treatment to film formation and sealing without exposure to the atmosphere. Depending on the purpose, you can freely choose from a plasma cleaning chamber, organic deposition chamber, electrode deposition chamber, sealing chamber, etc. 【Features】 ■ Supports substrate sizes up to 300mm ■ Deposition cells can be selected from various materials and sizes ■ Can be combined with CVD chambers, sputtering chambers, etc. ■ Custom orders can also be manufactured ■ Sample processing is conducted using a demo machine *For more details, please refer to the PDF document or feel free to contact us.

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Epitaxial-EB deposition device

Epitaxial-EB deposition device

A high-temperature process of up to 900°C is possible! This product is suitable for single crystal film formation due to the epitaxial promotion mechanism.

The "Epitaxial-EB Deposition Device" is a product suitable for single crystal film formation of metal films and oxide films through an epitaxial promotion mechanism. It achieves excellent film thickness distribution and reproducibility through substrate rotation, and the maintenance of the chamber is easy. It also supports the lift-off process and reduces particles through appropriate surface treatment. Multi-chamber specifications and batch types can also be manufactured. 【Features】 ■ Oxidation-promoting gas introduction mechanism ■ Material oxidation prevention mechanism ■ Capable of high-temperature processes up to 900°C ■ Supports high vacuum processes with a load-lock system ■ Compatible with lift-off processes ■ Supports tray transport *For more details, please refer to the PDF document or feel free to contact us.

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FAD Filtered Arc Deposition Device

FAD Filtered Arc Deposition Device

Development of new functional films and development of next-generation surface protective films.

Achieve high-quality films that cannot be obtained with sputtering or plasma CVD! With the combination of SPS equipment (electric current sintering device), flexible thin film development becomes possible! From target production to film deposition experiments, all can be completed in one day! Real ion plating using clean vacuum arc plasma.

  • Other surface treatment equipment
  • Surface treatment contract service

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