Plasma CVD film deposition
Forming a dense thin film by chemically reacting gases! Low-temperature processing is also possible.
The plasma CVD method is a technique that involves exciting or decomposing a gas containing the desired elements for the film using plasma, which then adsorbs and reacts on the substrate surface to form a film. Because it uses plasma, it allows for film formation at lower temperatures compared to thermal CVD. Additionally, it is characterized by better conformality on uneven surfaces compared to ion plating, vacuum deposition, and sputtering methods. Our company offers coating services using the plasma CVD method, in addition to ion plating and vacuum deposition methods. Currently, the types of films available using the plasma CVD method are four types: DLC (Diamond-Like Carbon), SiO2, SiN, and SiC.
- Company：東邦化研
- Price：Other
