Next-generation substrate conductor layer formation "PVD device" - World first! Direct copper deposition.
New Generation PVD Equipment
Using sputtering technology in a medium vacuum environment, we have developed the world's first plating seed layer formation technology through direct copper deposition! Achieving productivity beyond conventional levels!
【Features】 ■ Achieves high productivity equivalent to or greater than conventional methods such as electroless plating through a vacuum process. ■ Enables high-density plasma modification treatment using a new plasma source. ■ Allows for a high-adhesion process through direct copper sputtering onto organic insulators and glass. ■ Realizes film formation on high aspect ratio TH and BVH, which is considered difficult with conventional sputtering. ■ Offers overwhelming cost competitiveness in equipment compared to traditional sputtering devices. 【Adhesion Strength (Peel Strength)】 Non-alkali glass: ~10 Quartz: ~7 Epoxy resin: ~6 Polyimide: ~12
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basic information
High adhesion properties can be obtained through direct copper deposition on organic insulating materials and glass.
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Applications/Examples of results
TGV film formation Circuit formation
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Company information
Starting with printed circuit boards, we provide cutting-edge technology to electronic component manufacturers in Japan through the sale of manufacturing equipment for major electronic components such as semiconductors, LCDs, and PDPs, as well as inspection and analysis equipment. Although we operate as a trading company, we leverage our many years of experience in resist coating as a "trading company that can speak about technology" to offer optimal solutions to various customers, and we will continue to contribute to the Japanese electronic component industry.
