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Heat sink Product List and Ranking from 62 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:Feb 25, 2026~Mar 24, 2026
This ranking is based on the number of page views on our site.

Heat sink Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Feb 25, 2026~Mar 24, 2026
This ranking is based on the number of page views on our site.

  1. Axuas Co., Ltd. Aichi//Consumer Electronics
  2. LSIクーラー Tokyo//Industrial Electrical Equipment
  3. 三協サーモテック 東京事務所 Tokyo//Other manufacturing
  4. 4 ザワード Tokyo//Trading company/Wholesale
  5. 5 リーダー Osaka//others

Heat sink Product ranking

Last Updated: Aggregation Period:Feb 25, 2026~Mar 24, 2026
This ranking is based on the number of page views on our site.

  1. Heat Sink for Printed Circuit Board - Product Catalog 三協サーモテック 東京事務所
  2. Flexible heat sink LSIクーラー
  3. EVA-based heat sealant (water-based emulsion type) リーダー
  4. 4 SMT heat sink for DPAK package FK283 Axuas Co., Ltd.
  5. 4 Emerging Ceramics Heat Sink (Metal Metallurgy) Business

Heat sink Product List

361~390 item / All 748 items

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Extruded heat sink (for forced air cooling) 90mm square x 40(H)mm

Narrow pitch heat sink series for forced air cooling. Available for purchase from one piece.

This is a standard specification heat sink from Zawardo. It can be used with forced air cooling. You can purchase from one piece. Discounts are available for bulk purchases. Depending on the quantity, we can also accommodate changes to the heat sink extrusion length and additional hole processing, so please consult with us. If you use a heat sink made with this mold, we will not charge any mold costs, so please consider this when designing or selecting your heat sink! ● Material: A6063-T5

  • Cooling system
  • Heat sink

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Extruded heat sink (for forced air cooling) 80 square x 40(H)mm

Narrow pitch heat sink series for forced air cooling. Available for purchase from one piece.

This is a standard specification heat sink from Zawardo. It can be used with forced air cooling. You can purchase from just one unit. Discounts are available for bulk purchases. Depending on the quantity, we can also accommodate changes to the heat sink extrusion length and additional hole processing, so please consult with us. If you use a heat sink made with this mold, we will not charge any mold fees, so please consider this when designing or selecting your heat sink! ● Material: A6063-T5

  • Cooling system
  • Heat sink

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Freshly machined heat sink

Since the base and fin are integrated, there is no loss in heat transfer. Suitable for applications such as water cooling jackets and power semiconductors for communication devices.

It is a method of "shaving" aluminum and copper with a blade. I have heard that this method was developed by a Japanese manufacturer over 20 years ago, but currently, many factories in Taiwan and China are implementing it in their own specialized ways. The products processed by Japanese manufacturers had fins that were wavy like "shavings," but in China and Taiwan, they have devised ways to make the fins straight (suitable for small to medium production). Advantages: Since the base and fins are integrated, there is no loss of heat transfer. Processing of copper materials is also possible. Compared to extruded products, it allows for narrow pitch, high fins, and production in small quantities.

  • Cooling system
  • Heat sink

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Alternative solutions for small-scale brazed products! Proposal for replacing brazed heat sinks.

We can offer proposals using three types of construction methods: integrated molding, wide width, and low cost! We have numerous achievements in solving issues such as design revisions and weight reduction.

This document introduces the replacement of soldered heat sinks that we propose. It clearly explains the key points of various methods such as machining, riveting, and FSW. Additionally, it includes what Zaward can do. We invite you to read it. 【Contents】 ■ Replacement of soldered heat sinks ■ Key points of machining ■ Key points of riveting ■ Key points of FSW ■ What Zaward can do *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Heat sink

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【Excellent thermal performance!】Water cooling plates/water cooling products【The last bastion of heat dissipation】

Technical documentation regarding the last bastion of heat dissipation, "water-cooled products" <<Manufacturing range/materials/case studies, etc.>> *Thermal analysis services available!*

We would like to introduce the water-cooled products we handle. They can accommodate high heat generation, making them suitable for high-heat components such as IGBTs. Additionally, they are more compact compared to air-cooled systems, allowing for effective utilization of internal space. We have examples of products related to linear applications using AL6063 and copper pipes, as well as inverters with a heat generation of 1,500W. 【Features】 ■ Silent operation possible  → Usable in clean rooms ■ More compact compared to air-cooled systems  → Effective utilization of internal space ■ Capable of handling high heat generation  → Suitable for high-heat components such as IGBTs *For more details, please refer to the PDF document or feel free to contact us.

  • Cooling system
  • Heat sink

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[Case Study] Inspection Response to Precise Appearance Standards

Responding to special quality requirements! Introducing examples of acceptance inspections conducted locally as well as in Japan.

This is a customer seeking Peltier cooling heat sinks for home appliances. We addressed the special quality requirements regarding appearance, facilitated the alignment of quality standards between the factory and the customer, and manufactured with elevated quality standards. In addition to the acceptance inspection conducted on-site, we also carried out acceptance inspections in Japan. "We appreciate your unwavering support in addressing our excessive demands while standing between us and the factory," was the feedback we received. 【Case Summary】 ■ Introduced Product: Peltier cooling heat sink ■ Challenge: Special quality requirements regarding appearance ■ Results - Manufacturing was conducted with elevated quality standards - Acceptance inspections were carried out in Japan in addition to on-site inspections *For more details, please refer to the PDF document or feel free to contact us.

  • Peltier element
  • Cooling system
  • Heat sink

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Freshly cut heat sink '60W60L12H'

Since it does not require molds, small-scale production is also possible! Products suitable for small to medium-scale production.

We would like to introduce our newly launched heat sink, '60W60L12H'. It allows for thin fins and can be manufactured with a narrow pitch (for both small and large sizes). It can be produced in a wide range and in small quantities. Surface treatments include degreasing, anodizing, powder coating, cationic coating, and nickel plating. 【Features】 ■ Ability to create thin fins ■ Capable of manufacturing with a narrow pitch (for both small and large sizes) ■ No initial investment required ■ Can be produced in small quantities ■ Wide range of manufacturing possible *For more details, please refer to the related links or feel free to contact us.

  • Heat exchanger
  • Heat sink

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Freshly cut heat sink "90W90L12H"

No initial investment required! Introducing our heat sinks for small to medium production.

We would like to introduce our newly manufactured heat sink, the '90W90L12H'. The surface treatments include degreasing, anodizing, powder coating, cationic coating, and nickel plating. Using a specialized machine, aluminum and copper sheets are shaved thinly to form fins, a method that does not require molds, allowing for small-scale production. 【Features】 ■ Fins can be made thin ■ Manufacturing with narrow pitch is possible (for both small and large sizes) ■ No initial investment required ■ Production in small quantities is possible ■ Wide range of manufacturing is possible *For more details, please refer to the related links or feel free to contact us.

  • Heat exchanger
  • Heat sink

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[Technical Column #09] The Mechanism of Heat Sinks

Explaining our technology that further enhances the mechanism and heat dissipation of heat sinks!

This column explains the mechanism of heat sinks. Heat sinks are important components of high-performance electronic devices. We will introduce the mechanism of heat dissipation, the materials used, and our technology "Sugohie," which can further enhance heat dissipation, by the functional plating company, Ebina Denka Kogyo. [Contents (Excerpt)] ■ What is the mechanism of heat sinks? An explanation of the mechanism that supports high-performance electronic devices. ■ About heat sinks. ■ Reasons why heat sinks are necessary for high-performance electronic devices. ■ The mechanism of heat dissipation using heat sinks. ■ The mechanism of heat dissipation. *For detailed content of the column, please refer to the related links. For more information, feel free to contact us.

  • Other electronic parts
  • Plating Equipment
  • Heat sink

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Microchannel Heat Sink 'M4040/M2020'

Uniform temperature across the entire surface with matrix flow channels! We also accommodate custom orders and mass production.

The "M4040/M2020" is a microchannel heat sink that is effective for heat removal from high heat density sources. In the commonly seen "single flow path," there is a "temperature variation" on the cooling surface. WELCON's fluid distribution design technology achieves effective heat absorption from high heat density sources through uniform cooling. By improving the heat absorption density compared to conventional products, it enables downsizing, weight reduction, simplification, and energy saving, including the pump and piping. There is a proven track record of mass production for cooling CPUs in supercomputers. When combined with heat exchangers, precise temperature control is possible. 【Features】 ■ 260W/cm² heat absorption ■ Uniform temperature across the entire surface due to matrix flow paths ■ Customizable ■ Achieves low flow rate and low thermal resistance ■ Enables downsizing, weight reduction, simplification, and energy saving, including the pump and piping *For more details, please refer to the PDF document or feel free to contact us.

  • Other environmental equipment
  • Heat sink

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Case Study of Microchannel Heat Sink Development

It is possible to cool uniformly without temperature variation! We offer customization of standard products and prototype development from scratch.

Many existing heat sinks have a simple structure known as a 1-path structure, where the flow path from the inlet to the outlet is connected by a single line. In this case, there is a temperature variation between the inlet side, where fresh refrigerant is supplied, and the outlet side, where the refrigerant is heated by the heat source. The heat sinks provided by WELCON as standard products can cool uniformly without temperature variation. They feature a "matrix flow path" that implements microchannels with fine chambers like those in liquid crystals, allowing fresh refrigerant to be distributed uniformly. [Features] - No temperature variation - Can cool uniformly - Fresh refrigerant is distributed uniformly by implementing fine chambers like those in liquid crystals with microchannels *For more details, please refer to the PDF document or feel free to contact us.

  • Heat exchanger
  • Other electronic parts
  • air conditioning
  • Heat sink

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[Technical Data] Reduced Temperature Variation! High-Performance Water-Cooled Microchannel Heat Sink

If you're looking to enhance the performance of heat management components while also achieving miniaturization, weight reduction, and energy efficiency, this is a must-see!

Our company designs, manufactures, and sells microchannel heat sinks. We can suppress the temperature rise to 40°C for a heat generation of 260W/cm². The microchannel flow paths are arranged across the entire cooling surface, ensuring that the refrigerant is evenly distributed throughout all flow paths. Fresh refrigerant uniformly spreads within the plane, reducing temperature variations, improving cooling efficiency, and achieving low thermal resistance. 【Features】 ■ Suppresses temperature rise to 40°C for a heat generation of 260W/cm² ■ Microchannel flow paths are arranged across the entire cooling surface ■ Internal structure ensures even distribution of refrigerant across all flow paths ■ Reduces refrigerant volume ■ No need to significantly lower the refrigerant inlet temperature *For more details, please refer to the PDF document or feel free to contact us.

  • Other environmental equipment
  • Heat sink

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Dual-side heating compatible with 10,000W! Microchannel dual-side cooling water-cooled heat sink.

Uniform temperature distribution! Suitable for power semiconductor cooling, computing board (GPU, etc.) cooling, and more.

The "WEL-Cool Heat Sink" is a microchannel water-cooled heat sink (cold plate) that can be customized in various ways, including dual-side cooling, thin design, size, and performance. It features a microchannel structure on both sides, allowing for simultaneous cooling. Additionally, it achieves high performance (low thermal resistance) while maintaining low pressure loss. The innovative internal structure helps to equalize the temperature distribution. Please feel free to contact us for inquiries. 【Features】 ■ Simultaneous cooling on both sides ■ High performance (low thermal resistance) and low pressure loss ■ Equalized temperature distribution ■ Manufactured using diffusion bonding, with no filler metal used in the product ■ Customization available in various forms *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements
  • Heat sink

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【Large Semiconductor Heat Sink】Information for Forced Air Cooling and Water Cooling

Simplifying the mechanical riveting process to achieve high performance while keeping costs low!

Introducing heat sinks that contribute to the compactness of units and exhibit excellent characteristics in high-density electronic devices, including large semiconductor heat sinks for forced air cooling and water cooling. ■□■Features■□■ ■ By adopting a mechanical crimping method, the fin thickness has been reduced and a narrow pitch has been achieved, resulting in an increased surface area and excellent thermal resistance even at the same dimensions. ■ The mechanical crimping process has been simplified, achieving high performance while maintaining low costs. ■ The fin height can be freely set. For other functions and details, please contact us.

  • Other electronic parts
  • Heat sink

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Information on Medium-Sized High-Power Semiconductor Heat Sinks

Heat sink (radiator) medium-sized heat sink (medium-sized, for high-power semiconductors)

The LEX medium-sized heat sink series, designed for cooling in high-density electronic devices that are becoming more powerful due to advancements in semiconductor technology, offers a total of 276 models that are the most rational and cater to all users. 【Features】 ○ Medium-sized products can be complexly processed using large machining centers. ○ A wide variety of extruded materials are available, allowing for selection of materials that meet customer needs. A versatile heat sink made from flat extruded materials. It is suitable for both natural cooling and forced air cooling applications. (Refer to the graphs in the catalog for performance data during natural and forced cooling.) If heat dissipation and thermal transport using metal alone are insufficient for heat dissipation measures, it is possible to enhance heat dissipation by installing heat pipes. - For more details, please contact us or download the catalog.

  • Other electronic parts
  • Heat sink

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Heat Sink DHP Series

We have added the models recommended by Marusan Electric as standard products in our lineup.

We have added models recommended by Marusan Electric as standard products to our lineup. Standard products can be offered at a low price as they do not require molds. We are introducing the Intel CPU-specific types "104DHP91-91" and "104DHP90-90," as well as the 1U server types "26DHP83-106.5" and "24.5DHP90.3-90.3." For more details, please contact us or refer to the catalog.

  • Cooling system
  • Heat sink

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Heater Comb Fit

The principle of comb-fit coupling is...

The surfaces of the aluminum materials that make up the heat sink's base and fins are covered with a hard oxide film due to exposure to air. By instantly removing this hard oxide film and pressing the newly formed surfaces of the fins and base against each other with pressure, the metal surfaces bond together, improving the thermal conductivity between the base and fins. *Online meetings are also possible, so please feel free to contact us.*

  • Other electronic parts
  • Heat sink

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Heat sink for surface mount devices, SQ series

The SQ series is an aluminum extruded type with a slit fin type.

We are pursuing high performance for heat sinks and radiators. The semiconductor devices (such as transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The SQ series heat sinks for surface-mounted devices are made of extruded aluminum and feature a slit fin design. *Online meetings are also possible, so please feel free to contact us.

  • Other electronic parts
  • Heat sink

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Free comprehensive catalog available! Electronic component radiator "heat sink"

Utilizing the excellent thermal conductivity of aluminum for heat dissipation and absorption! Preventing reliability and performance degradation or failure due to temperature rise in semiconductor devices.

Heat sinks are used as practical and economical cooling methods in various industries. This method is adopted in the semiconductor industry as the most practical and economical cooling solution to prevent reliability and performance degradation, as well as destruction due to temperature rise in semiconductor devices. Additionally, the "heat sink" of LSI coolers is characterized by its resistance to vibration, which can also help reduce initial costs. 【Contents】 - V Series: Hollow type (for medium power forced air cooling) - M Series: Multipurpose, general-purpose fin-type heat sinks - H Series: Multipurpose, general-purpose fin-type heat sinks *This download is a digest version. If you would like the complete version, please contact us. *Online meetings are also possible, so feel free to reach out to us.

  • Cooling system
  • Heat sink

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Heat dissipation solutions that solve the heat dissipation problems faced by electronic devices!

You can download various heat dissipation product information materials in bulk.

● Thermal Rubber: A silicone-based resin material that conducts heat. It quickly dissipates heat from the source. ● Cool Staff: A groundbreaking heat dissipation film that condenses multiple heat dissipation pathways into a single sheet of film. ● Heat Sink: Compatible with precision processing through various extrusion and processing techniques. ● FAN Motor: Also compatible with integrated designs with heat sinks. ● Heat Dissipation Paint: A thermosetting paint with general heat dissipation properties in a solution form.

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  • Other electronic parts
  • Heat sink

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Universal heat sink, passive heat sink

This is a general-purpose heat sink used in various environments such as natural air cooling and forced air cooling.

- Sold individually, more than one available for online shopping - Immediate delivery available - Customization options such as additional processing are also possible

  • Other electronic parts
  • Heat sink

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Shoulder screw type heat sink

The method of securing the heat sink and board with shoulder screws holds the heat sink in place using the tension of the spring.

We provide a method to secure the heat sink and board with shoulder screws, holding the heat sink in place with the tension of the spring. Depending on your specifications, we can offer a total solution that includes shoulder screws, springs, and thermal interfaces.

  • Other electronic parts
  • Heat sink

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Heat sink for DC-DC converter

Standard products are available for sale from one piece, with same-day shipping OK! We also accommodate additional processing and customization! Leave it to us from prototypes to mass production!

This is a heat sink for DC-DC converters. Here is an introduction to various heat sinks.

  • Other electronic parts
  • fan
  • Heat sink

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Quick Set Heat Sink Series

This is a method of securing a Z-shaped clip by hooking it onto anchor pins inserted into two small holes (diameter 1.8mm) made on the electronic circuit board.

- Small mounting area - Positioning guide - Easy attachment and detachment - Adjustable mounting load

  • Other electronic parts
  • Heat sink

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Round Heat Sink CN Series

This is a heat sink with a round base shape.

- Standard heat sinks are available for sale and can be shipped the same day from one piece. - Additional processing and customization are also available. - We support everything from prototype heat sinks to mass production.

  • Other electronic parts
  • Heat sink

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Water-Cooled Heat Sink Series

Flow path design to achieve uniform cooling

Water is circulated inside a metal plate to cool the entire plate, and a heating element is attached to absorb heat. This is primarily used for cooling semiconductor devices such as IGBTs, as well as for various applications and industries including UV-LEDs, amplifiers, and Peltier elements. The performance of water-cooled heat sinks varies significantly depending on the flow path structure and the machining precision of the element surface. Our company is committed to efficient and uniform cooling within the plane, and we design and manufacture water-cooled heat sinks that meet your desired performance and shape.

  • Other semiconductor manufacturing equipment
  • Cooling system
  • Heat sink

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[Case Study] Aluminum Extrusion Heat Sink

Introducing product examples of heat sinks made by aluminum extrusion!

This is a product example of heat sinks made from aluminum extrusion by Fuji Shokai. A heat sink is a component that utilizes the high thermal conductivity of metal to dissipate and expel heat. When installed in contact with a heat source, it can absorb heat and naturally cool the heat source by radiating it away. Additionally, we also manufacture a "forced air cooling type" that enhances the cooling effect. [Overview] ■ The larger the surface area exposed to air, the higher the heat dissipation efficiency, so it often has a shape with multiple protrusions or plates. *For more details, please refer to the PDF document or feel free to contact us.

  • aluminum
  • others
  • Other electronic parts
  • Heat sink

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[Processed Parts Results] Heat Sink

Shortest half-day estimate / Introduction of machining processed parts achievements! From one piece of various types in small quantities! We will provide an estimate for processed parts in the shortest half-day.

Agency Assist has a track record in processing for prototype and development fields across various industries. We can handle a wide range of materials, including aluminum, iron, stainless steel, brass, and resin. This time, we would like to introduce our machining processed component, the "Heat Sink." 【Features】 -------------------------------------------------------------- Part Name: Heat Sink Material: Aluminum (A5052) Processing Method: Machining Size: X77.5mm × Y42.5mm × Z25mm Surface Treatment: Electroless Ni Plating Application: Heat dissipation component for electronic devices -------------------------------------------------------------- "Features of Agency Assist" - We provide estimates for processed parts within half a day at the shortest. - We accommodate everything from single item processing to small lots of various types. - We handle everything from surface treatment to hardening, polishing, and precision inspection. From metals to resins, leave your cutting processing for prototype and development parts to us. ☆ Please feel free to contact us for a preliminary estimate! ☆

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Fischer Elektronik manufactured heat sink

Fischer's heat sink and PCB connector representing Europe.

Our company, Aquas, is the official domestic distributor of the global German manufacturer Fischer Elektronik. We introduce the products of Fischer Elektronik, recognized as a world leader in heat sinks. If you have any requests for modifications to standard products listed in the catalog or for custom products, please feel free to consult us. **Heat Sink Lineup** ◆ Profile Heat Sinks - Extruded Heat Sinks - Heat Sinks for PCB Mounting - Extruded Heat Sinks for Transistor Mounting Springs - Springs for Transistor Mounting - Fin Coolers - Water-Cooled Heat Sinks - Heat Sinks for DC-DC Converters ◆ Heat Sinks for ICs and Processors, Active Heat Sinks, etc. - Heat Sinks with Axial Fans - Heat Sinks for PGA - Heat Sinks for BGA, etc. ◆ Board-Level Heat Sinks - Finger Shape Heat Sinks - Clip-On Heat Sinks *For more details, please feel free to contact us.*

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  • Other semiconductors
  • Heat sink

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