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Heat sink(IGBT) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Dec 24, 2025～Jan 20, 2026
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Heat sink Product List

16～30 item / All 32 items

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Width 150mm Height 60mm High-performance air-cooled aluminum heat sink

Width 150mm Height 60mm High-performance air-cooled aluminum heat sink

High-performance heat sink series for power electronics PM (Profilmecc)

The PM (Profilmecc) series provided by Meccal (Italy) is an innovative product. It is a completely custom-made heat sink while also offering standard solution specifications. Profilmecc, manufactured using a unique patented technology for the mechanical assembly of the base and fins, ensures excellent mechanical specifications. * Width, length, height, and fin shape can be designed according to application. * Designable dimension range: Width: MAX 1000mm, Length: MAX 1300mm, Base height: 8 - 50mm, Fin height: MAX 190mm * Supports hole processing and surface treatment (anodizing, etc.).

  • profilmecc-01.jpg
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  • profilmecc-03.jpg
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Width 250mm Height 85mm High-performance air-cooled aluminum heat sink

Width 250mm Height 85mm High-performance air-cooled aluminum heat sink

High-performance heat sink series for power electronics PM (Profilmecc)

The PM (Profilmecc) series provided by Meccal (Italy) is an innovative product. It is a fully custom-made heat sink while also offering standard solution specifications. Manufactured using a unique patented technology for the mechanical assembly of the base and fins, Profilmecc guarantees excellent mechanical specifications. * Width, length, height, and fin shape can be designed according to application. * Designable dimension range: Width: MAX 1000mm, Length: MAX 1300mm, Base height: 8 - 50mm, Fin height: MAX 190mm * Also supports hole processing and surface treatment (anodizing, etc.).

  • profilmecc-01.jpg
  • profilmecc-02.jpg
  • profilmecc-03.jpg
  • foto-pagina-profilmecc.jpg
  • logo.png
  • Other electronic parts

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Heat sink, multipurpose, general-purpose F/H/M series

Heat sink, multipurpose, general-purpose F/H/M series

The F/H/M series is an aluminum extruded fin-type heat sink.

We are pursuing high performance in heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air convection or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The multi-purpose, general-purpose F/H/M series heat sinks are aluminum extruded fin-type heat sinks. *Online meetings are also possible, so please feel free to contact us.

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Heat sink for high-performance forced air cooling "YK/YU/YX series"

Heat sink for high-performance forced air cooling "YK/YU/YX series"

The YK/YU/YX series is a high-performance forced air cooling type with a comb fit design.

We are pursuing high performance for heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. 【Features】 〇 Radiators for electronic components that prevent device destruction → Quickly transfers heat for cooling 〇 Composed of a base plate for mounting heat-generating devices and fins for dissipating heat from the base plate 〇 High-performance forced air cooling 〇 Comb-fit type 〇 YK series → Fin-joint type single-sided base 〇 YU series → Fin-joint type single-sided base (narrow pitch) 〇 YX series → Fin-stacked type hollow double-sided base *Online meetings are also possible, so please feel free to contact us.

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Heat sink for surface mount devices, SQ series

Heat sink for surface mount devices, SQ series

The SQ series is an aluminum extruded type with a slit fin type.

We are pursuing high performance for heat sinks and radiators. The semiconductor devices (such as transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The SQ series heat sinks for surface-mounted devices are made of extruded aluminum and feature a slit fin design. *Online meetings are also possible, so please feel free to contact us.

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Low thermal expansion, high thermal conductivity, heat sink.

Low thermal expansion, high thermal conductivity, heat sink.

The optimal heat sink requires a balance between thermal expansion rate and conductivity.

Thermal management in device design is an essential fundamental technology for various electronics products where high output and miniaturization are advancing. Ensuring the reliability of devices involves minimizing the thermal impact on semiconductor elements and being mindful of the thermal expansion of each material. When the thermal expansion coefficients of materials differ, significant stress can occur in the materials due to temperature changes, potentially leading to serious malfunctions. At Planzé, we provide ideal heat sinks with high thermal conductivity and appropriate thermal expansion coefficients to enhance device reliability and extend product lifespan.

  • Non-ferrous metals
  • Other semiconductors
  • diode

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Heat Sink for Stud-Type Devices S Series

Heat Sink for Stud-Type Devices S Series

The S series is a heat sink for stud-type devices equipped with aluminum extrusion.

We are pursuing high performance in heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to forcibly circulate air or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat treatment with heat sinks. The S series heat sink for stud-type devices is an aluminum extruded type heat sink designed for stud-type devices. *Online meetings are also available, so please feel free to contact us.

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Aluminum Water-Cooled Heat Sink "YC Series"

Aluminum Water-Cooled Heat Sink "YC Series"

Due to being shaped with aluminum profiles, it achieves a cost reduction of 30-40% compared to copper! This is a water-cooled heat sink that uses forced cooling with water.

Semiconductor devices (transistors, CPUs, IGBTs, etc.) used in electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. This product uses water for forced cooling and is a water-cooled heat sink that achieves simplicity and low cost by using aluminum profiles and copper pipes. 【Features】 ■ Formed from profiles (custom options and pipe embedding specifications are also possible) ■ Low cost ■ Specification confirmation can be handled with simulation software → If you provide the loss power (W) and the model name of the FAN to be used, we can present it in a graph, which can be used as evidence when conducting prototypes. *If you wish to request a simulation, please contact us via the inquiry button. *Online meetings are also possible, so feel free to reach out to us.

  • Other electronic parts

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Heat Sink Hollow Type (Medium Power Forced Air Cooling) V Series

Heat Sink Hollow Type (Medium Power Forced Air Cooling) V Series

The V series is an aluminum extruded type hollow fin heat sink for forced air cooling.

We are pursuing high performance in heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves forcing air to circulate using a fan or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat treatment with heat sinks. The hollow-type heat sink (for medium power forced air cooling) V series is an aluminum extruded type hollow fin heat sink for forced air cooling. *Online meetings are also possible, so please feel free to contact us.

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Free comprehensive catalog available! Electronic component radiator "heat sink"

Free comprehensive catalog available! Electronic component radiator "heat sink"

Utilizing the excellent thermal conductivity of aluminum for heat dissipation and absorption! Preventing reliability and performance degradation or failure due to temperature rise in semiconductor devices.

Heat sinks are used as practical and economical cooling methods in various industries. This method is adopted in the semiconductor industry as the most practical and economical cooling solution to prevent reliability and performance degradation, as well as destruction due to temperature rise in semiconductor devices. Additionally, the "heat sink" of LSI coolers is characterized by its resistance to vibration, which can also help reduce initial costs. 【Contents】 - V Series: Hollow type (for medium power forced air cooling) - M Series: Multipurpose, general-purpose fin-type heat sinks - H Series: Multipurpose, general-purpose fin-type heat sinks *This download is a digest version. If you would like the complete version, please contact us. *Online meetings are also possible, so feel free to reach out to us.

  • Cooling system

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Heat sink for pin-mounted devices, P/FP/U series

Heat sink for pin-mounted devices, P/FP/U series

The P/FP series is of the aluminum extrusion type, while the U series is of the plate type.

We are pursuing high performance for heat sinks and radiators. Semiconductor devices (such as transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most heat sinks consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. Cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat management with heat sinks. The P/FP/U series of heat sinks for pin-mounted devices consists of the P/FP series, which is an aluminum extrusion type, and the U series, which is a plate type. *Online meetings are also possible, so please feel free to contact us.

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Water-cooled heat sink

Water-cooled heat sink

Outstanding cooling effect!

Due to the increase in the capacity of components, air cooling methods are reaching their limits. Our oxygen-free copper water-cooled heat sinks, with a thickness of 6 to 20 mm, are about one-tenth the size of air cooling!! They provide several times the cooling effect per unit area and contribute to space-saving.

  • Other semiconductor manufacturing equipment

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WKBS Forced Air Cooling Dedicated Heat Sink

WKBS Forced Air Cooling Dedicated Heat Sink

WKBS Forced Air Cooling Dedicated Heat Sink

This is a dual-sided riveted type heat sink that applies the conventional single-sided riveting method (KBS) series. ● It is a high-performance heat sink specifically designed for forced air cooling, capable of both single-sided and dual-sided mounting. ● It features an optimal structural design for mounting various modules such as Tr, DI, and IGBT. ● Compared to conventional products, the upper and lower fins are fixed, eliminating the need for fin retaining plates, so no side mounting screws are required. ● It prevents fin vibration. ● Even in the single-sided mounting type, component mounting is possible on the backside.

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Water-cooled heat sink. Why not switch from air cooling to water cooling?

Water-cooled heat sink. Why not switch from air cooling to water cooling?

With a thermal conductivity more than 20 times that of air, it absorbs heat from heating elements! We design and manufacture heat sinks tailored to your needs based on application, shape, size, and material!

Water is circulated inside a metal plate to cool the entire plate, and a heating element is attached to absorb heat. This is mainly used for cooling semiconductor devices such as IGBTs, as well as for various applications and industries including UV-LEDs, amplifiers, and Peltier elements. The performance of water-cooled heat sinks varies significantly depending on the flow path structure and the machining precision of the element surface. Our company is committed to designing flow paths that efficiently and uniformly cool the surface, and we design and manufacture water-cooled heat sinks that meet your desired performance and shape.

  • Other semiconductor manufacturing equipment
  • Cooling system

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パワー半導体用ファン付きヒートシンク W200mm L100mm

パワー半導体用ファン付きヒートシンク W200mm L100mm

波型フィン（コルゲートフィン）ヒートシンクに、SEPA製のファンと上部の密閉プレートを組み合わせた一体型冷却ユニット

私たち（株）アクアスでは、高い加工技術・表面処理技術を持つアルトロニック社（ドイツ）の正規販売店です。 「PK327」は、アルトロニック独自の波型フィン（コルゲートフィン）ヒートシンクに、SEPA製のファンと上部の密閉プレートを組み合わせた一体型冷却ユニットです 強制空冷に最適化されており、長尺タイプでも安定したエアフローと放熱性能が得られます 標準長3種とファン電圧2種は即納モデルあり

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