The optimal heat sink requires a balance between thermal expansion rate and conductivity.
Thermal management in device design is an essential fundamental technology for various electronics products where high output and miniaturization are advancing. Ensuring the reliability of devices involves minimizing the thermal impact on semiconductor elements and being mindful of the thermal expansion of each material. When the thermal expansion coefficients of materials differ, significant stress can occur in the materials due to temperature changes, potentially leading to serious malfunctions. At Planzé, we provide ideal heat sinks with high thermal conductivity and appropriate thermal expansion coefficients to enhance device reliability and extend product lifespan.
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basic information
~Planze's Heat Sink Product Lineup~ ■ W (Tungsten) ■ Mo (Molybdenum) ■ MoCu (Copper Molybdenum) ■ WCu (Copper Tungsten) ■ Cu-MoCu-Cu Laminate (Copper-Copper Molybdenum-Copper Laminate) We can manufacture according to your desired specifications. 'Copper Tungsten Copper Molybdenum' - A composite material that incorporates copper into tungsten and molybdenum, offering excellent machinability and thermal conductivity. - It has a thermal expansion coefficient close to that of ceramics and semiconductor materials, making it compatible with packages. - Copper molybdenum heat sinks can be produced through punching, providing excellent cost efficiency. - Compatible with various plating options. Reference Products - WCu and MoCu heat sinks according to customer drawings - WCu Plate: 0.5-50mmT x 100 x 100 mm - MoCu Sheet: 1-1.5mmT x 400 x 600 mm, 2-3mm x 400 x 400 mm
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Applications/Examples of results
- Base plates for power semiconductors such as IGBTs for hybrid cars - CPU heat spreaders for high-end servers - High-power LED and LD sub-mounts - Optical communication and wireless packages
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Company information
In today's research and development, we believe that high-level technological exchange beyond company boundaries and guarantees for stable supply in the future are of utmost importance. Since its founding over 100 years ago, Plansee has been trusted as a development partner by top manufacturers around the world, helping to advance today's cutting-edge technology towards further innovation. Additionally, through continuous and significant investment in production facilities and vertical integration from tungsten and molybdenum powder to machining, we deliver the largest dimensions in the industry to our customers reliably and consistently. Headquartered in Austria, Plansee has a machining factory in Iwate Prefecture for our Japanese customers, who have high quality standards and development capabilities. Under strict quality control, we provide tungsten and molybdenum machined products with short lead times. Furthermore, with sales bases in major global economic regions, we can ensure stable supply of certified products from Japan to our customers in global companies with factories overseas, maintaining the same quality across all locations.
