Forced air cooling heat sink for high heat generation devices
LAHB Series - Fischer Electronics
Forced air-cooled heat sink designed for high-heat-generating devices such as IGBTs and power supplies.
The LAHB series is a high-performance heat sink that achieves efficient cooling of high-heat-generating devices through forced air cooling. With air forced convection by an axial fan and a hollow structure, it optimizes airflow within the heat sink, demonstrating stable heat dissipation performance even in high-power applications. It enables efficient temperature management even in high-output environments where natural air cooling is challenging. It is suitable for the power electronics field, such as IGBT modules, inverters, and power supplies, and is widely used as a countermeasure against heat generation associated with increased output. This product is suitable for applications where existing heat sinks lack cooling performance or where enhanced heat dissipation through forced air cooling is being considered.
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basic information
■ Cooling Method Forced air cooling (axial fan) ■ Structure Hollow structure heat sink (airflow chamber structure *for some part numbers) ■ Material Aluminum ■ Applicable Uses High heat generating devices (IGBT, inverters, power supplies, etc.) ■ Features High heat dissipation performance and low thermal resistance design ■ Size Multiple variations available (please refer to the catalog for details) ■ Fan Included (axial fan) ■ Power Specifications DC or AC fan ■ Notes Please check the catalog for detailed specifications, dimensions, and performance data.
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Applications/Examples of results
- Cooling of IGBT modules - Heat dissipation measures for inverter devices - Switching power supply (SMPS) - Industrial power supply equipment - Motor drive - Power electronics equipment - Temperature management of high power and high heat generating devices
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