Reduction of operator burden, product loss, and improvement of quality.
We would like to introduce a case where the method of transporting fine workpieces made by insert molding, which posed issues in continuous "hoop transport," was changed to strip cutting transport.
In the customer's company, there were challenges such as the need for additional space in the longitudinal direction leading to larger equipment, and when troubles occurred, the long hoop material would become entangled, causing delays in cleanup and setup.
When we proposed cutting the hoop material to a specified length and transporting it in strip form, it eliminated the need to stop transport for positioning, and there was no longer a need for a buffer mechanism, thus avoiding the enlargement of the equipment.
[Case Overview]
■ Size
4mm × 2mm × 0.6mm
■ Takt Time
・1.0 seconds per piece
◇ A patent has been obtained for this matter.
"Method for manufacturing electronic components and manufacturing apparatus for electronic components"
■ Patent Number: Patent No. 7088581
■ Patent Registration Date: June 13, 2022
■ Title of Invention: Method for manufacturing electronic components and manufacturing apparatus for electronic components
■ Patent Holder: Seki Giken Co., Ltd.
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