Equipped with pressure and thickness control functions! Suitable for thermal interface materials.
We aim to develop the optimal device for measuring thermal interface materials (TIM) used in semiconductor device heat dissipation.
The steady-state thermal conductivity measurement device "SS-H40" is equipped with two measurement modes: "constant load mode" and "constant thickness mode," allowing for the evaluation of TIM in real-world usage conditions.
In "constant load mode," measurements can be taken at a set load (units: N or Pa). On the other hand, "constant thickness mode" allows for measurements at a set thickness (units: mm).
This enables measurements tailored to the usage environment, allowing for the assessment of whether the obtained thermal conductivity meets specifications.
Furthermore, the measurement time, which previously took several hours, has been reduced to 10-20 minutes, making the process easier.
〇 About the Measurement Principle 〇
This is a steady-state measurement method. The steady-state method involves applying a constant amount of heat to the material, measuring the temperature gradient when the heat is stable, and determining the thermal conductivity of the material. This method maintains a steady-state heat flow, allowing for accurate measurements. It is a widely used measurement technique.