Design and high functionality of next-generation microwave-compatible packaging materials, standards, and examples of adoption.
Explaining the latest information on regulations for microwave packaging materials that the industry is paying attention to!
【Lecturers】 Part 1: Advisor (Former President) of the Japan Packaging Specialist Association, Mr. Hideki Nishi Part 2: Tatsuya Hirata, Technical Development Division, Meiwa Pax Co., Ltd. Part 3: Mr. Tadahiko Kuzu, Chief Researcher, Packaging Science Research Institute, Ph.D. in Engineering Venue: Tokyo Chuo Ward Industrial Hall, 4th Floor, Meeting Room 4【Tokyo, Chuo Ward】 Date and Time: June 25, 2015 (Thursday) 10:30 AM - 4:15 PM
- Company:AndTech
- Price:10,000 yen-100,000 yen