Atmospheric pressure plasma surface treatment device for direct bonding technology for the FCCL market.
Atmospheric pressure plasma device enabling direct bonding in the 5G and 6G FCCL market.
There is a rapidly increasing demand for substrate materials in the FCCL market for millimeter-wave devices, and a technology that allows for direct adhesion without roughening the surface is required. Our company's downstream atmospheric pressure plasma equipment focuses on molecular bonding, enabling processing that causes no damage to the surface or any scientific damage from UV light or other effects of plasma. Our "Precise" system separates the plasma generation unit from the processing unit (downstream type), allowing for the addition of functional groups and hydroxyl groups to the surface without damaging the processing area. This enables direct adhesion to liquid crystal polymers (LCP) and fluororesins while maintaining a smooth surface. Since our plasma treatment for adhesion and bonding is based on molecular bonding, it can be performed without causing any damage to the surface or any scientific damage from UV light or other effects of plasma. Additionally, by performing a pre-treatment for electroless plating through plasma treatment, we improve the dispersion of the catalyst and achieve uniform copper plating. For more details, please contact us or download the catalog.
- Company：イー・スクエア
- Price：Other
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