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Plating Solution Product List and Ranking from 5 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Jul 23, 2025~Aug 19, 2025
This ranking is based on the number of page views on our site.

Plating Solution Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Jul 23, 2025~Aug 19, 2025
This ranking is based on the number of page views on our site.

  1. ユミコアジャパン Tokyo//Ferrous/Non-ferrous metals
  2. 奥野製薬工業 Osaka//Chemical 大阪・放出、東京、名古屋など
  3. Daiwa Fine Chemicals Co., Ltd. Hyogo//Other manufacturing
  4. 4 null/null
  5. 5 null/null

Plating Solution Product ranking

Last Updated: Aggregation Period:Jul 23, 2025~Aug 19, 2025
This ranking is based on the number of page views on our site.

  1. Semiconductor materials, semiconductor copper plating solution.
  2. Introduction to Surface Treatment Materials: "Rough Nickel Plating"
  3. ARGUNA C-100 // Graphite Composite Silver Plating Solution ユミコアジャパン
  4. 4 ARGUNA 630 // Hard Silver Plating Solution ユミコアジャパン
  5. 4 PALLUNA ACF-800 // Pure Palladium Plating Solution ユミコアジャパン

Plating Solution Product List

46~56 item / All 56 items

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ARGUNA 635 // Hard Silver Plating Solution

A silver plating film that pursues all aspects of gloss, purity, and hardness.

ARGUNA 635 is a glossy silver plating solution that can be used for both functional parts and decorative items. It meets the requirements of ASTMB700 type B and provides a high-purity silver coating with a maximum hardness of 190HV. The resulting coating exhibits superior wear resistance and vibration resistance compared to pure silver. By adjusting the working conditions, barrel, rack, and continuous plating are possible. The coating has excellent electrical properties and demonstrates stable hardness over a long period.

  • Non-ferrous metals
  • Chemicals

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Rhodium-Platinum Alloy Plating Solution

Attractive alloy plating of rhodium and platinum

Rhodium gives decorative items a high-gloss white appearance. Platinum has an immutable value and provides high reliability. By combining these two precious metals, we have developed a highly attractive alloy plating solution. The coating of RHODUNA PT is typically composed of 50% rhodium and 50% platinum. RHODUNA PT is easily recognized by the jewelry industry due to platinum's high social value, while also enjoying significant cost reductions compared to pure rhodium.

  • Rare metals
  • alloy
  • Chemicals

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Solving Weak-Micro Vias: High Connection Reliability Electroless Copper Plating Solution

Achieving thin film deposition of non-electrolytic copper plating! It greatly contributes to the formation of fine circuits on semiconductor package substrates and the improvement of via connection reliability!

In recent years, with the miniaturization and high performance of electronic devices, semiconductor devices have also become more refined and functional. There is a growing demand for further miniaturization of wiring and reduction of via diameters in semiconductor package substrates that connect semiconductor devices to the main substrate. Okuno Pharmaceutical Industry has newly developed products to meet the demands for fine wiring. Highest via connection reliability: Electroless copper plating solution: OPC FLET Copper - Achieves crystal continuity at the bottom of the via - Conventional baths see a significant increase in resistance due to a decrease in the thickness of the electroless copper plating film OPC FLET Copper shows good conductivity even at low film thickness - Controls the plating deposition rate - The deposition rate becomes gradual over time, suppressing deposition on copper - Conventional baths tend to have excessive surface film thickness OPC FLET Copper achieves sufficient coverage at low film thickness - Excellent connection reliability for small-diameter vias

  • Chemicals

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DIALLOY 822 // Tin-Zinc Alloy Plating Solution

A plating film suitable for functional parts with few pinholes.

DIALLOY 822 is an alkaline cyanide-type tin-zinc alloy plating solution. It can be applied to barrel plating and rack plating. The alloy composition is 80% tin and 20% zinc under standard conditions, but the alloy composition can be adjusted by changing the working conditions. The plating film obtained with DIALLOY 822 is ideal for functional parts. It imparts corrosion resistance to iron and iron alloys and contributes to wear prevention with good sliding properties. By adding post-treatments such as passivation and sealing, corrosion resistance can be further enhanced. The plating film exhibits excellent solder wetting and weldability.

  • Non-ferrous metals
  • alloy
  • Chemicals

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Solution for Weak-Micro Vias: High Connection Reliability Electroless Copper Plating Solution

Achieving thin film deposition of electroless copper plating! Electroless copper plating process for semi-additive manufacturing with excellent connection reliability.

We have developed a new electroless copper plating process called "OPC FLET process" to meet the demands for fine wiring and contribute to the densification of semiconductor package substrates. In addition to the OPC FLET copper, which excels in uniform deposition within via holes, we have also developed a new electroless copper plating solution that achieves low film thickness and high reliability for through holes in printed circuit boards. We offer a range of products that can meet various customer needs.

  • Chemicals

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White decorative trivalent chromium plating solution "Top Fine Chrome BLW"

A trivalent chromium plating solution that achieves a beautiful bluish-white appearance equivalent to hexavalent chromium plating and has excellent uniform electrodeposition properties.

Decorative chrome plating is widely used in automobiles, bicycles, motorcycles, and faucets due to its excellent corrosion and wear resistance. Decorative chrome plating using hexavalent chromium is subject to regulations such as the RoHS directive and wastewater regulations, and currently, trivalent chromium decorative chrome plating is becoming more common. However, conventional trivalent chromium plating tends to have a blackish tint on the coating, which poses challenges in appearance. Our company has newly developed a trivalent chromium plating solution that achieves a beautiful bluish-white appearance comparable to hexavalent chromium plating, with excellent uniform electrodeposition and adherence.

  • Chemicals

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Long-life, high-speed electroless nickel plating solution

Environmentally friendly electroless nickel plating solution that can be continuously used with stable performance.

Electroless nickel plating, which has a uniform coating thickness, high dimensional accuracy, high hardness, and excellent corrosion resistance, has seen increasing demand in various fields in recent years. Generally, electroless nickel-phosphorus plating experiences a decrease in deposition rate due to the aging of the plating bath. Because changes in the deposition rate can lead to fluctuations in the phosphorus content of the plating film, the plating solution has been regularly updated and discarded. Our company has newly developed an environmentally friendly electroless nickel plating solution that maintains excellent bath stability, showing minimal decrease in deposition rate even after processing for over 10 turns, allowing for continuous use.

  • Chemicals

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Non-cyanide substitution type electroless silver plating solution Dine Silver EL-3S

Non-cyanide substitution type electroless silver plating solution

Traditionally, cyanide complex-based plating solutions have been used for replacement-type electroless plating of silver (Ag), but there have been many issues regarding the working environment and wastewater treatment costs. The Dain Silver EL-3S process is a replacement-type electroless Ag plating solution that contains no cyanide at all and has performance equivalent to that of cyanide baths. It also has a long liquid life and can be applied not only to copper materials but also to electroless Ni-P plated materials. It can be used as an alternative plating for electroless Ni-P/electroless Au plating, which is a coating for soldering printed circuit boards, and by directly plating Ag onto copper circuits using the EL-3S process, it can reduce plating costs. Furthermore, it demonstrates superior reliability in solderability compared to heat-resistant preflux.

  • Chemicals

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Non-cyanide copper plating solution "Dine Copper PSR Series"

Non-cyanide copper plating solution that does not use cyanide compounds.

This is a non-cyanide copper plating solution that does not use cyanide compounds. - I want to stop handling cyanide compounds. - I want to reduce the risks of natural disasters and accidents. - I want to start copper plating but do not have cyanide wastewater treatment facilities. If you are facing any of the above issues, please consider this product. ● DAIN COPPER PSR-SZ - It is difficult for copper replacement to occur even on difficult materials such as zinc die casting, resulting in a plating film with good adhesion. - It is a monovalent copper type plating solution similar to cyanide (liquid appearance: colorless transparent liquid). - It achieves a deposition rate comparable to cyanide, resulting in good productivity. ● DAIN COPPER PSR-STS - It provides good adhesion on zincate films of copper, brass, iron, and aluminum. - It has excellent covering properties. - It forms a good base for silver plating, nickel plating, and acidic copper plating.

  • Chemicals

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Ruthenium plating solution

Platinum group plating solution as a substitute for palladium.

Metals belonging to the platinum group have trends that vary by era. The reasonably priced and stable platinum group metals have made significant advancements in both undercoating and finishing. Yumico's ruthenium plating solution (RUTHUNA) has excellent features and is attracting attention as an alternative to palladium plating due to its ability to significantly reduce costs compared to palladium.

  • Non-ferrous metals
  • Chemicals

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AURUNA 5750 // Gold-silver alloy plating solution

The most suitable plating solution for cost reduction.

AURUNA 5750 is a plating solution of approximately 12 carats of gold-silver alloy (50% gold / 50% silver). The resulting film exhibits a pale yellow color. It demonstrates high corrosion resistance and excellent ductility, resulting in high durability. Even when finishing with high-purity gold plating, it is possible to reduce gold usage by employing AURUNA 5750 as an intermediate layer. The stability of the bath is high, and it is resistant to the contamination of inorganic impurities. It is compatible with both rack plating and barrel plating.

  • Non-ferrous metals
  • Chemicals

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