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Plating(gold) - List of Manufacturers, Suppliers, Companies and Products

Plating Product List

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Gold plating (plating process/surface treatment)

Gold plating (plating process/surface treatment)

High-quality plating and surface treatment using aluminum, stainless steel, and other metals are possible!

Al Corporation has now made it possible to perform high-quality plating and surface treatment (using aluminum, stainless steel, titanium, cobalt, and other metals) through GTS in the United States. This manufacturer specializes in developing customer products based on engineering design concepts. They particularly focus on the semiconductor field, epitaxy, annealing, laser applications, and high-reflectivity ellipsometry. 【Features】 ■ Concept design review ■ Advanced alloy plating development ■ Expertise in plated products ■ Clean room assembly (1K, 10K) ■ Special coating technology *For more details, please refer to the PDF materials or feel free to contact us.

  • Processing Contract
  • Surface treatment contract service

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What is plating that you can't ask about now? We are offering explanatory materials that can be understood through manga.

What is plating that you can't ask about now? We are offering explanatory materials that can be understood through manga.

Ozzik Technologies' "Electroless Ag Plating" is compatible with SiC power devices! It achieves excellent performance.

A simple explanation of nickel plating, zinc plating, and plastic plating in manga! Even though we talk about plating, there are various types of plating processes. Depending on the required application, environment, and the material being processed, it can be confusing to determine which plating process is best. "Electroless Ag Plating" is a technology from Ozic Technologies that is compatible with SiC power devices. Conventional technologies have issues such as instability in operation under high-temperature environments and an inability to meet the demands for high-performance devices, necessitating more advanced processing to accommodate SiC power devices. Our "Electroless Ag Plating" can solve the challenges of conventional technologies by enabling operation in high-temperature environments through high melting point metal bonding with Ag nanoparticles. 【Features】 ■ Achieves excellent performance as an Au alternative plating such as DIG (Direct Immersion Gold) ■ Maintains quality for a long time without being affected by the substrate (such as Cu) and without oxidation ■ Forms a uniform thin film (0.1~0.5μmt), accommodating fine wiring patterns and partial plating *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • others
  • Surface treatment contract service

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Plating process chemicals for MID (Molded Interconnect Devices)

Plating process chemicals for MID (Molded Interconnect Devices)

MID process chemicals with reliable selectivity (copper, nickel, tin, silver, gold finishes available)

Japan McDermid proposes a new MID plating process that offers high yield and reliable selectivity, making it ideal for plating LDS, Pd-containing resins, and double-shot MID. This process provides stable selectivity across a wide range of materials and catalysts, enabling more complex and efficient designs for the most needed low-cost molded composites. Additionally, the simple and manageable process results in stable plating rates and a long, predictable bath life.

  • Other electronic parts
  • Electrical equipment parts
  • Chemicals

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Non-electrolytic silver plating

Non-electrolytic silver plating

Compatible with next-generation SiC power devices! Achieves excellent performance.

"Electroless Ag plating" is a technology from OJIC Technologies designed for next-generation SiC power devices. Conventional technologies faced issues such as instability in operation under high-temperature environments and an inability to meet the demands for higher performance devices, necessitating more advanced processing to accommodate SiC power devices. Our "Electroless Ag plating" can solve the challenges of conventional technologies by enabling operation in high-temperature environments through high melting point metal bonding with Ag nanoparticles. 【Features】 ■ Achieves excellent performance as an alternative plating to Au, such as DIG (Direct Immersion Gold) ■ Maintains quality for a long period without being affected by the substrate (such as Cu) and without oxidation ■ Supports fine wiring patterns and partial plating by forming a uniform thin film (0.1~0.5μmt) *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • others
  • Surface treatment contract service

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