Compatible with next-generation SiC power devices! Achieves excellent performance.
"Electroless Ag plating" is a technology from OJIC Technologies designed for next-generation SiC power devices. Conventional technologies faced issues such as instability in operation under high-temperature environments and an inability to meet the demands for higher performance devices, necessitating more advanced processing to accommodate SiC power devices. Our "Electroless Ag plating" can solve the challenges of conventional technologies by enabling operation in high-temperature environments through high melting point metal bonding with Ag nanoparticles. 【Features】 ■ Achieves excellent performance as an alternative plating to Au, such as DIG (Direct Immersion Gold) ■ Maintains quality for a long period without being affected by the substrate (such as Cu) and without oxidation ■ Supports fine wiring patterns and partial plating by forming a uniform thin film (0.1~0.5μmt) *For more details, please refer to the PDF document or feel free to contact us.
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【Solving Problems with Conventional Technology】 ■ Operation is unstable in high-temperature environments ■ Difficult to lower solder joint temperature ■ Heat resistance is required during secondary mounting ■ Cannot accommodate high performance of devices *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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We believe that our mission is to evolve and propose surface treatment technologies, which are foundational technologies for manufacturing, have a history dating back to ancient times, and have evolved to support cutting-edge industries of each era, but have now become difficult for anyone to perform. This evolution begins with communication with our customers. We learn about the materials our customers use, understand the required functional characteristics, and study the environment in which the finished products will be used and the roles they are expected to fulfill. If necessary, we collaborate with universities and public research institutions. We then provide the optimal surface treatment technology.
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