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Polishing Machine Product List and Ranking from 248 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Oct 22, 2025~Nov 18, 2025
This ranking is based on the number of page views on our site.

Polishing Machine Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Oct 22, 2025~Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 松田精機 Hyogo//Manufacturing and processing contract
  2. アイエムティー Wakayama//Testing, Analysis and Measurement
  3. 田中インポートグループ Osaka//others
  4. 4 null/null
  5. 5 フジミインコーポレーテッド Gifu//Electronic Components and Semiconductors

Polishing Machine Product ranking

Last Updated: Aggregation Period:Oct 22, 2025~Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. Belt Grinder "Bader Machine" 松田精機
  2. Chemical substance management regulations and countermeasures based on the Labor Safety and Health Act for SIC grinding paper. アイエムティー
  3. Heat release and thermal conduction filler, cylindrical particles, thermal conductivity, zinc oxide. フジミインコーポレーテッド
  4. 4 Tabletop small sample mirror polishing machine "DIALAP V.A" [Made in Japan]
  5. 5 Horizontal Ball Grinding Machine "ND460" *Grinding Stone Diameter φ460 西田機械工作所

Polishing Machine Product List

286~300 item / All 814 items

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Toho Steel Co., Ltd. "Centrifugal Barrel Polishing Machine"

Leave it to us for all your centrifugal barrel polishing machine needs!

We handle both barrel removable and barrel fixed centrifugal barrel polishing machines. We offer a wide range of products, including standard models, round pot specifications, and 40L x 4 layers, so please feel free to contact us if you have any requests. *For more details, please download the PDF or feel free to contact us.

  • Wafer processing/polishing equipment

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Yamizu Machinery Manufacturing Co., Ltd. Company Profile

We contribute to the creation of true value and the evolution of innovation through high-performance machines such as grinders and dust collectors.

Yamimizu Machinery Manufacturing Co., Ltd. is a professional in mechanical finishing that covers the grinding and polishing category, meticulously responding to various new materials. We provide high-performance machines tailored to match your production line and intended use through full custom orders. We also welcome inquiries about special types. Please feel free to contact us. 【Business Content】 ■ Automatic Machines - Automatic polishing machines - Automatic grinding machines - Deburring machines - NC saw sharpening machines ■ Standard Machines - Cylindrical grinding machine (NCB-50II) - Double-headed buffing machine - Double-headed grinder - Belt grinding machine ■ Dust Collectors - Bag filter dust collectors - Wet dust collectors - Pulse jet dust collectors ■ Others: Special machines, abrasives, etc. *For more details, please refer to the PDF materials or feel free to contact us.

  • Wafer processing/polishing equipment
  • Dust collector
  • Other abrasives

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Buffing machine with transmission device 'UBS-46・UBS-60'

Buff polishing machine with a transmission device that can be adjusted to the appropriate rotation speed for the type and size of the buff!

The "UBS-46 and UBS-60" are polishing machines equipped with an inverter in the UB type. They can be adjusted to match the appropriate rotational speed for the type and size of the buff, significantly expanding the range of work. The dust cover (buff cover) is designed to provide flexibility for operations, making it easy to replace the buff. 【Specifications (UBS-46)】 ■ Spindle total length: 1200mm ■ Spindle diameter: φ25.4mm ■ Spindle center height: 850mm ■ Installation space (W)×(D): 600×600mm ■ Motor (KW): 2.2 (3.7) ■ Spindle rotation speed: 1000–3000 r.p.m ■ Spindle bearing: 6308ZZ (4 pieces) ■ Machine dimensions (W)×(D)×(H): 1258×773×1380mm ■ Machine weight: 465kg ■ Buff size used φ×(W): φ355×50mm *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Hand polishing and filing

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Cylindrical Grinding Machine "NCB-50 II"

Many delivery achievements! Standard centerless grinding machine suitable for polishing pipes and bar materials.

The "NCB-50 II" is a standard cylindrical grinding machine. It is easy to operate and does not require skilled expertise for grinding. It is capable of dry grinding for workpieces ranging from φ10 to φ50×1,000mm, and can use non-woven fabric and buffs. 【Features】 ■ Standard type ■ Centerless grinding machine ■ Capable of dry grinding ■ Can use non-woven fabric and buffs *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Hand polishing and filing

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Small Centerless Grinding Machine 'CCB-10'

Easy to operate for anyone! A compact, space-saving centerless grinding machine.

The "CCB-10" is a compact, space-saving small centerless grinding machine. It can be used with a household 100V power supply. It is easy to operate, making it accessible for anyone. 【Specifications (partial)】 ■ Workpiece size that can be ground (outer diameter × length): φ3 to φ10 × 150mm ■ Grinding wheel rotation motor: single-phase 100V × 200W ■ Grinding wheel size (outer diameter × width × hole diameter): φ150 × 30 width × φ12.7mm ■ Grinding wheel rotation speed: 3175 r.p.m / 3810 r.p.m ■ Feed wheel rotation motor: single-phase 100V / 40W ■ Workpiece grinding feed speed: MAX (2.5m / 3m) / min ■ Grinding wheel center height: 180mm ■ Machine dimensions (width × depth × height): 450 × 600 × 280mm ■ Approximate weight: 35kg *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Hand polishing and filing

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NC6 Axis Grinding Machine 'NBG-03-S6'

Simultaneous 6-axis control allows for flexible polishing of twisted surfaces!

The "NBG-03-S6" is a product from Nobimizu Machinery Manufacturing Co., Ltd., a professional company specializing in machine finishing that covers the grinding and polishing category. It can perform complex curved surface polishing, which traditionally relied on manual labor, quickly and accurately in fully automatic mode. 【Features】 ■ With simultaneous 6-axis control, twisted surfaces can be processed freely. ■ While 5-axis processing is common, 6-axis processing is also possible. *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • others

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Small Centerless Grinding Machine "ECO Raku 2 CCB-10 Model"

Can be used with a household 100V power supply! Compact size and space-saving.

The "ECO Raku 2 CCB-10 model" is a compact centerless grinding machine that anyone can easily use for grinding. It can be used with a household 100V power supply. With dimensions of 450×600×280mm, it is compact and space-saving. Additionally, it is equipped with a small handle, making it easy to operate the spindle and feed wheel back and forth. 【Features】 ■ Anyone can easily grind ■ No complicated adjustments required ■ Easy operation of the spindle and feed wheel with the small handle ■ Simple start with a button switch *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Centerless Grinder "NCB-50II"

Non-woven fabric wheels and buffs can be used widely! Polishing can be done without requiring advanced skills.

The "NCB-50II" is a centerless grinding machine that can perform external diameter grinding on various types of pipes and shafts regardless of their material. Operation is simple. It allows for grinding without requiring skilled expertise. Additionally, we can accommodate a variety of special specifications based on the standard model. (Discharge devices, wheel-less devices, conveyor systems, wet specifications, etc.) 【Features】 ■ Capable of external diameter grinding on various types of pipes and shafts regardless of material ■ Easy operation ■ Custom design and manufacturing for special specifications available *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Precision Grinding Device "MA-400e"

High-precision angular bearings are adopted as the main axis! Achieving a flatness accuracy of ±10μm on the reference table.

The "MA-400e" is a precision grinding device with a spindle directly mounted on a surface plate that has been ground and finished with high precision. The brushless DC motor allows for high-precision grinding as there is no change in rotational speed due to load fluctuations. By combining the automatic grinding mechanism's roller holding unit, roller-type swinging holding unit, and various sample holders, we have achieved high-precision automatic grinding for electronic materials, electronic components, ceramics, metal materials, as well as for the pretreatment of TEM, SEM, SIMS samples, and orientation using X-rays. 【Features】 - The spindle is directly mounted on a surface plate that has been ground and finished with high precision. - High-precision angular bearings are used in the spindle. - Achieves flatness accuracy within ±10μm on the reference table. - The brushless DC motor allows for high-precision grinding as there is no change in rotational speed due to load fluctuations. *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines

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Precision Grinding Device "MA-300e"

Interlock covers are also available! We have achieved further efficiency in polishing operations.

The "MA-300e" is a precision polishing device suitable for polishing large samples such as 3-inch and 4-inch specimens. By installing automatic sample holding units in three locations, it achieves further efficiency in polishing operations. Additionally, by equipping a shaking device, it is expected to improve polishing accuracy and maintain the flatness of the polishing disc. It adopts a sequence control program, allowing for centralized management of the polishing process recipes. 【Features】 - Suitable for polishing large samples such as 3-inch and 4-inch specimens - Three automatic sample holding units installed for further efficiency in polishing operations - Adopts a sequence control program for centralized management of polishing process recipes - Equipped with a leakage breaker and emergency stop button for safe and secure polishing operations - Interlock cover also available *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines

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Precision Grinding Device "MA-200e"

Ideal for sample preparation for research and development! Successfully reduced vibration and noise significantly.

The "MA-200e" is a precision grinding device that is highly accurate and suitable for sample preparation in research and development. With the emergency stop button, leakage breaker, and interlock cover (optional), it enables grinding operations with a focus on safety and security. Additionally, it is now possible to manage a wide variety of grinding processes and recipes collectively via a touch panel. 【Features】 ■ Highly accurate and suitable for sample preparation in research and development ■ Improved drive system and rigidity successfully reduce vibration and noise significantly ■ Comfortable operation with digital control using an LCD touch panel ■ Ability to collectively manage a wide variety of grinding processes and recipes via the touch panel ■ Enables grinding operations with a focus on safety and security *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines

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Precision Grinding Device MA Series

Reproducibility in sample grinding

By selecting a suitable sample holder for the sample, various shapes and processing purposes for polishing can be achieved. This is a tabletop precision polishing device that is optimal for sample preparation for TEM and SEM observation. Additionally, by replacing the polishing disc and polishing agents, it can handle everything from rough polishing to mirror finishing and CMP (Chemical Mechanical Polishing) with just one unit. 【Examples of materials with processing achievements】 - Semiconductor materials: Si / SiC / GaN / GaAs / InP / Ga2O3 … - Optical materials: Glass / Sapphire / CLBO / YiG / GGG … - Ceramic materials: Alumina / Silicon Nitride … Furthermore, we have numerous achievements with other materials such as metals, minerals, and biological samples.

  • Wafer processing/polishing equipment

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Fully Automatic Wafer Grinding and Polishing Equipment 'CMG-802XJ'

It performs chuck surface cleaning, rough grinding, finishing grinding, and polishing fully automatically with one machine!

The "CMG-802XJ" is a fully automated wafer grinding and polishing composite device that places four vacuum chucks on a sorting table and processes in sequence: chuck surface cleaning, rough grinding, finishing grinding, and polishing, using a rotary transfer type. It was newly developed in response to the high-precision downsizing demands for a wide variety of IC cards and SiP products. With an integrated mechanism with the MDS (Tape Mounting and Peeling Device), it provides a total solution for damage-free processing and ultra-thin wafer thickness. 【Features】 ■ Supports 300mm ultra-thin wafers ■ Integrated mechanism with MDS (Tape Mounting and Peeling Device) ■ Provides total solutions for damage-free processing and ultra-thin wafer thickness ■ Capable of grinding 8-inch/12-inch wafers down to a thickness of 30μm ■ Automatically performs chuck surface cleaning, rough grinding, finishing grinding, and polishing all in one machine *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Comtech Co., Ltd. "Polishing Equipment"

Leave the front and back inversion to the robot! A polishing device that achieves energy savings with nighttime power!

Our company offers a "grinding machine" that achieves stable grinding without being affected by the wear of grinding stones. Automatic grinding of round blades at set angles and depths. Additionally, with the optional robot, it is possible to grind unattended at night. 【Features】 ■ Automatic reversal allows the operator to simply set the round blade ■ Asymmetric grinding is possible ■ Grinding can be performed through automatic diameter measurement ■ Stable grinding is possible even with different outer diameter dimensions ■ Equipped with an automatic stabilization device for grinding force *Please contact us for more details.

  • Wafer processing/polishing equipment

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Case Study of Glass Film Implementation: Tokyo Metro Co., Ltd.

This is an example of preventing glass shattering due to internal and external causes. *Case study presentation.

Our company handles a variety of wrapping products, including vehicle wrapping, vending machines, signs and billboards, interior decorations, and road surface displays. We would like to introduce a case study of the glass film implemented by Tokyo Metro Co., Ltd. Tokyo Metro Co., Ltd. consulted us as a countermeasure due to a series of window breakage incidents. We used an actual vehicle (a decommissioned car) to conduct a comparative study with various films and application methods, confirming that the measures were sufficient before they decided to implement the solution. Additionally, to prevent breakage after application, we calculate the thermal load on the glass when selecting films, and based on our years of accumulated experience, we provide proposals and support for implementation. Please feel free to consult us. *The materials provide an overview of the background leading to the implementation, the solutions, and their effects. You can easily download it from "PDF Download."

  • Other safety and hygiene products

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