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Polishing Machine - メーカー・企業248社の製品一覧とランキング

更新日： 集計期間:Oct 22, 2025～Nov 18, 2025
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Polishing Machineのメーカー・企業ランキング

更新日： 集計期間:Oct 22, 2025～Nov 18, 2025
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  1. 松田精機 Hyogo//Manufacturing and processing contract
  2. アイエムティー Wakayama//Testing, Analysis and Measurement
  3. 田中インポートグループ Osaka//others
  4. 4 null/null
  5. 5 フジミインコーポレーテッド Gifu//Electronic Components and Semiconductors
企業ランキングへ

Polishing Machineの製品ランキング

更新日： 集計期間:Oct 22, 2025～Nov 18, 2025
※当サイトの各ページの閲覧回数を元に算出したランキングです。

  1. Belt Grinder "Bader Machine" 松田精機
  2. Chemical substance management regulations and countermeasures based on the Labor Safety and Health Act for SIC grinding paper. アイエムティー
  3. Heat release and thermal conduction filler, cylindrical particles, thermal conductivity, zinc oxide. フジミインコーポレーテッド
  4. 4 Tabletop small sample mirror polishing machine "DIALAP V.A" [Made in Japan]
  5. 5 Horizontal Ball Grinding Machine "ND460" *Grinding Stone Diameter φ460 西田機械工作所

Polishing Machineの製品一覧

301～315 件を表示 ／ 全 814 件

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Blade sharpening machine

Blade sharpening machine

Adjustable specifications! Introducing workability × efficiency × special custom equipment design.

MINA Technology Co., Ltd. offers "blade sharpening machines." Custom equipment design is tailored to create devices suitable for specific projects and processes. If you have an image, we can conceptualize and realize the design. We enhance the efficiency, productivity, and competitiveness of our customers' operations. Please feel free to contact us when you need our services. 【Features】 ■ We can conceptualize and realize the design as long as you have an image. ■ Unlike commercially available products, we can optimize for specific tasks or processes. *For more details, please refer to the PDF materials or feel free to contact us.

  • Mechanical Design

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Explosive Shock Wave Method Nano Diamond (SNMD)

Explosive Shock Wave Method Nano Diamond (SNMD)

The world of particle sizes 2.6 to 2.8 mm! Leave it to us for anything related to nano diamonds.

The detonation nanodiamond is a product manufactured by mixing TNT (trinitrotoluene) and RDX (cyclotrimethylenetrinitramine: hexogen) and detonating it in an oxygen-free environment. It has realized the reuse of military explosives for peaceful purposes. Please feel free to contact us if you have any inquiries. 【Features of ND particles】 ■ Presence of a hydration layer (non-freezing) ■ High dispersibility in certain solutions ■ Oxidized graphite ■ Particle size ranges from 2.6 to 2.8 mm ■ Carbon composite compound with a thin layer of diamond inclusion and oxidized nanographite *For more details, please download the PDF or feel free to contact us.

  • Chemicals

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Grinding and Polishing Machine "Abrapole-30"

Grinding and Polishing Machine "Abrapole-30"

Efficiently polishing large samples or a large quantity of samples in a short time.

The "Abrapole-30" is an advanced polishing and grinding device that uses a fixed sample plate. It features a double droplet system that optimizes the dripping of suspensions and lubricants, a grinding rate sensor, and a safety transparent cover. It can uniformly drip over a wide area, making it compatible with a 350mm diameter disc and a 200mm fixed sample plate. 【Features】 ■ Powerful motor with a robust design to support it ■ Compatible with large samples ■ Easy operation *For more details, please download the PDF or contact us.

  • Wafer processing/polishing equipment

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Sample Grinder "Abraplan-30"

Sample Grinder "Abraplan-30"

High reliability, large capacity, precise and efficient surface grinding equipment.

The "Abrasive Plan-30" is an advanced surface grinding machine that can accommodate fixed sample plates with a diameter of up to 200mm. It is suitable for processing large samples or a large number of samples continuously in the field. Additionally, it reduces working time and enhances the productivity of the grinding and polishing processes. 【Features】 ■ High precision and powerful performance ■ Easy and fast operation ■ Large capacity *For more details, please download the PDF or contact us.

  • Wafer processing/polishing equipment

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Fully Automatic Grinding and Polishing Solution 'Xmatic'

Fully Automatic Grinding and Polishing Solution 'Xmatic'

Complete automation of the grinding and polishing process! Reducing human errors and ensuring very high reproducibility.

The "Xmatic" is a fully automated grinding and polishing solution for high-throughput laboratories. It can accommodate up to 8 sample plates at once, allowing various methods to be assigned to each sample plate. Once the consumables are placed in their designated positions, they are recognized by a unique data matrix code, and their positions are automatically registered in the user interface. Additionally, we offer the "Xmatic Compact," which is suitable for situations with limited installation space. 【Features】 ■ Maximizes reproducibility with consistent fully automated grinding and polishing ■ Improves lab efficiency by minimizing the working time of sample preparation operators per sample ■ Increases throughput through optimized high-quality sample preparation processes ■ Enhances safety in the working environment with minimal human resources ■ Simplifies processes with quick, easy, and intuitive operation *For more details, please refer to the PDF document or feel free to contact us.

  • Testing Equipment and Devices
  • Wafer processing/polishing equipment

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Semi-Automatic Universal Testing Machine "Duramin-600"

Semi-Automatic Universal Testing Machine "Duramin-600"

Ring light illumination suitable for testing soft metals in dark field! Automatic 6-position turret.

The "Duramin-600" is a semi-automatic universal hardness testing machine operated via a touchscreen. It features a robust design that can withstand harsh production environments. Three testing force ranges and an optional electric Z-table suitable for large samples are available. 【Features】 ■ Suitable for Vickers, Knoop, Brinell, and Rockwell hardness tests ■ Three testing force ranges: • 9.8N to 2450N (1 to 250kgf) • 29.4N to 7360N (3 to 750kgf) • 49N to 29400N (5 to 3000kgf) ■ High-precision control system utilizing load cell technology ■ Built-in PC operated via mouse or touchscreen *For more details, please refer to the PDF document or feel free to contact us.

  • Testing Equipment and Devices

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Fluid polishing device 'elite series' for 3D molded products and molds.

Fluid polishing device 'elite series' for 3D molded products and molds.

3D metal powder molded parts with complex shapes, R shapes, and spiral shapes can be polished to a mirror finish, even with fine pores!

The semi-custom original fluid polishing device "elite series" is specialized for fine holes with inner diameters ranging from Φ0.1 to Φ5 in various metal pipes, making it suitable for extremely fine pores that have been difficult to polish until now. In recent years, there has been a rapid increase in requests for "clogging due to rust and scale" and "improvement of surface roughness on the inner surface" in cooling channels generated by molds, making "internal polishing" an essential requirement for the application of 3D printed products. Particularly in the case of mold channels, it is recommended to "perform polishing inside the channel after shaping to reduce the adhesion and clogging of dirt and rust" and "regularly re-polish to maintain cooling performance and extend mold life," with the aim of addressing important issues that affect production. We recommend polishing the mold channels of 3D printed products. Additionally, it contributes to stabilizing processing quality, reducing labor costs, and increasing profit margins. 【Features】 ◆ Compatible with Inconel, stainless steel, Ti, Al, Ni, Cu-based materials, maraging steel, and various others ◆ Capable of polishing the inner surfaces of channels through which gas or liquid flows ◆ Easily removes the molten re-solidification layer in 5 to 15 minutes without oxidation treatment ◆ Efficient with automated management

  • Wafer processing/polishing equipment

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Fluid polishing device "elite580"

Fluid polishing device "elite580"

Complex-shaped flow paths for gas and liquids can be polished, even for flow paths and holes smaller than 1mm!

The "elite580" is a fluid polishing device that enables polishing of fine hole channels in metal 3D printed products to "Ra0.1". It features a fast polishing speed due to the particles of the polishing material hitting the uneven surfaces inside the channels while being carried by a high-speed water flow, making it faster than other physical polishing methods. Additionally, it can accommodate a wide range of materials and complex channels down to ultra-fine holes, and the running costs are low due to the use of inexpensive polishing materials. 【Features】 ■ Uses only "water" and "polishing material" ■ One-way flow and circulation type ■ Faster polishing speed than other physical polishing methods *For more details, please refer to the related links or feel free to contact us.

  • Wafer processing/polishing equipment

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Commitment to quality

Commitment to quality

Learn about fluid polishing technology through data! Our mirror finish has an ultra-mirror surface with an Ra value of 0.01μm.

At our company, we utilize measurement data for setting target values and quality evaluation as part of our commitment to quality. The generally required mirror finish has a Ra value of 0.1μm, but the mirror finish we achieve has an ultra-mirror surface with a Ra value of 0.01μm. Additionally, to demonstrate the high level of our polishing technology, we conduct data measurements at a trusted third-party public institution. 【Features】 ■ Utilization of measurement data for setting target values and quality evaluation ■ The mirror finish we achieve has an ultra-mirror surface with a Ra value of 0.01μm ■ Data measurements conducted at a trusted third-party public institution *For more details, please refer to the related links or feel free to contact us.

  • Wafer processing/polishing equipment

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High-speed manual grinding machine "ST-2 type"

High-speed manual grinding machine "ST-2 type"

The vibrations and recoil during operation are minimal, allowing for a uniform and vivid polished surface.

The "ST-2 type" is a high-speed manual polishing machine developed with the aim of high efficiency and labor saving, specifically designed and manufactured to fully utilize the lifespan and performance of diamond tools. It features a water injection method from the center of the spindle, and cutter replacement is done with a one-touch mechanism. Additionally, the improved boss mounting section and spring maintain an appropriate polishing pressure. 【Features】 ■ Developed for high efficiency and labor saving ■ Specifically designed and manufactured to fully utilize the lifespan and performance of diamond tools ■ Consideration of weight balance in each component, providing sufficient rigidity ■ Minimal vibration and recoil during operation, enabling the creation of a uniform and vivid polished surface ■ The spindle drive employs a multi-pole conversion motor, allowing for quick speed changes via a hand-operated switch *For more details, please refer to the PDF materials or feel free to contact us.

  • Other machine elements
  • Wafer processing/polishing equipment
  • Other processing machines

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Gate-type fully automatic side grinding machine 'APS8-600'

Gate-type fully automatic side grinding machine 'APS8-600'

The dimensions of the height and width of processed stone can be easily set using a diagonal two-point setting method on a fully automatic side grinding machine.

The "APS8-600" is a gantry-type fully automatic side grinding machine that offers exceptional rigidity and stable grinding due to its gantry structure. The stone guide for aligning the grinding reference surface features a high rigidity and easy-to-operate one-touch link system. It can be operated promptly after installation without the need for special foundation work. 【Features】 ■ Exceptional rigidity and stable grinding due to the gantry structure ■ The dimensions of the height and width of the processed stone can be easily set using a diagonal two-point setting method ■ The range of movement during processing can be adjusted entirely via the operation panel ■ The magazine can hold 8 types of grinding wheels, allowing for the selection of only the necessary wheels for processing ■ The number of grinding pattern cycles and feed amounts can be set for each process *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements
  • Wafer processing/polishing equipment
  • Other processing machines

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Paper Grinding Machine "DX1400 Model"

Paper Grinding Machine "DX1400 Model"

Print smudges eliminated! Perfect plate wrap! Equipped with a quiet type 'dust collector' as standard.

The "DX1400 model" is a paper polishing machine designed to automate the traditional "hand polishing" method of sanding the chrome plating on the surface of gravure cylinders, allowing for easy and ideal polishing results. It finishes the manual cross polishing work in a short time, achieving an average and ideal polish. 【Features】 ■ The angle of the cross pattern can be easily and freely adjusted. ■ Once the plate is set and the switch is pressed, the automatic polishing process is completed. ■ Heavy plates can be easily attached and detached without lifting, using the "GN lifter." ■ Equipped with a quiet "dust collector" that sucks in harmful polishing dust. ■ A "water polishing specification DX-W model" is also available, which prevents clogging and dust generation. *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Other machine elements

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Mechatronics in the field of engineering

Mechatronics in the field of engineering

Introducing polishing (lapping) processing technology with nanometer precision through load control!

Hitachi Information and Communication Engineering collaborates with customers to design and develop dedicated equipment tailored to their needs, proposing solutions that integrate IT data. Focusing on load control technology, we possess various technologies such as positioning technology, measurement technology, and control technology (software), enabling polishing (lapping) with nanometer precision. Our production equipment-related products mainly handle storage-related production equipment, such as hard disk drives and optical discs. Utilizing the technologies and know-how accumulated within this field, we are expanding our range of equipment products for various applications. 【Features】 ■ High-precision polishing technology (load control technology) ■ Production equipment-related products ■ Micro-component handling technology ■ Precision tool manufacturing technology *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services

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Buff polishing device (buff polisher) achieves high-precision polishing equipment!

Buff polishing device (buff polisher) achieves high-precision polishing equipment!

High-quality shafts and bearing components, high-rigidity stands are used to achieve high-precision grinding equipment. *Grinding tests are currently being conducted with samples.

Our buff polishing machines and grinding machines are primarily used in the copper rolling industry. They are useful for removing oxidation scale after annealing and in the finishing process before shipment. The buff can be fixed in a cantilever style or a double-end support style, both of which excel in buff exchangeability. The buff polishing machine's performance significantly varies the surface of the workpiece after cutting, depending on the selection of buff and grinding stone, plate speed, rotation speed, and load conditions. First, we conduct polishing tests using samples, and after confirming the desired conditions, we proceed with the design of the equipment. Additionally, we have a track record of polishing machines for sheet materials and target plates that utilize this technology, so please feel free to consult us with any concerns you may have. *For more details, please refer to the PDF materials or feel free to contact us.*

  • Other processing machines

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Fusion of barrel polishing machine and electro-polishing machine: "Barrel Electro-Polishing Device" *Patent pending

Fusion of barrel polishing machine and electro-polishing machine: "Barrel Electro-Polishing Device" *Patent pending

Simultaneous processing of multiple types of parts fully automatically. Achieves deburring, improved corrosion resistance, and glossy finishing all at once. *A document summarizing the differences between electropolishing and barrel polishing will be provided.

Our "Barrel Electrolytic Polishing Device" is a machine that incorporates the function of electrolytic polishing into a rotating barrel. It allows for deburring while simultaneously improving corrosion resistance and achieving a glossy finish. With the push of a button, it operates fully automatically and can process multiple parts at once. 【Features】 ■ Improved surface roughness and reduced sliding resistance ■ No contact marks from electrode jigs ■ Surface covered with a chrome-rich layer, achieving excellent corrosion resistance ■ Designed with a focus on chemical resistance to extend the lifespan of the device ■ Complete interlock system ■ Compatible materials: SUS304, SUS304L, SUS316, SUS316L (using our electrolytic polishing solution) *We are distributing materials that summarize the benefits of electrolytic polishing and barrel polishing.

  • Other surface treatment equipment

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