Polishing machineのメーカーや取扱い企業、製品情報、参考価格、ランキングをまとめています。
イプロスは、 製造業 ・ BtoB における情報を集めた国内最大級の技術データベースサイトです。

Polishing machine - メーカー・企業249社の製品一覧とランキング

更新日： 集計期間:Dec 17, 2025～Jan 13, 2026
※当サイトの各ページの閲覧回数を元に算出したランキングです。

Polishing machineのメーカー・企業ランキング

更新日： 集計期間:Dec 17, 2025～Jan 13, 2026
※当サイトの各ページの閲覧回数を元に算出したランキングです。

  1. アイエムティー Wakayama//Testing, Analysis and Measurement
  2. 松田精機 Hyogo//Manufacturing and processing contract
  3. フジミインコーポレーテッド Gifu//Electronic Components and Semiconductors
  4. 4 null/null
  5. 5 田中インポートグループ Osaka//others
企業ランキングへ

Polishing machineの製品ランキング

更新日： 集計期間:Dec 17, 2025～Jan 13, 2026
※当サイトの各ページの閲覧回数を元に算出したランキングです。

  1. Chemical substance management regulations and countermeasures based on the Labor Safety and Health Act for SIC grinding paper. アイエムティー
  2. Plate-shaped white particles of titanium phosphate contribute to the improvement of the lubrication performance of solid lubricants! フジミインコーポレーテッド
  3. Belt Grinder "Bader Machine" 松田精機
  4. 4 Manual Sample Grinder "IM-P2" [Made in Japan] アイエムティー
  5. 5 Variable Capacity Pot Centrifugal Barrel Polisher from Small to Large Volume 新東工業

Polishing machineの製品一覧

181～195 件を表示 ／ 全 802 件

表示件数
Diamond Lapping Film "NEO" for Sample Grinding

Diamond Lapping Film "NEO" for Sample Grinding

Introducing diamond wrapping film suitable for fine polishing using fixed abrasives.

We would like to introduce our product "NEO." This product is a diamond wrapping film that can be used for fine polishing with fixed abrasive particles. We offer particle sizes of 0.5μm, 2μm, and 9μm. For more details, please refer to the related catalog. 【Sizes】 ■203 ■229 ■154 ■305 *For more information, please refer to the PDF document or feel free to contact us.

  • image_16.png
  • Hand polishing and filing

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Fully Automatic Sample Grinding Machine "Cyrex-8" [Made in Japan]

Fully Automatic Sample Grinding Machine "Cyrex-8" [Made in Japan]

Two-stage variable grinding conditions are possible! The grinding head can be adjusted left and right by ±50mm!

The "Cyrex-8" is a fully automatic polishing machine that can make two types of changes during a single polishing process. It is possible to set the machine to gradually increase pressure for a few seconds right after the polishing starts (e.g., 15 seconds) and then gradually decrease pressure for a few seconds before finishing (e.g., 10 seconds). We also accept requests for the production of holders with hole shapes tailored to the samples, such as leveling machines and sample holders, so please feel free to consult with us. 【Polishing Unit Specifications】 ■ Holder Size: MAX. φ200mm ■ Disc Size: φ250, 300, 310mm ■ Primary Side Air: Requires an air source of 0.5MPa or more ■ Power Supply: Three-phase 200-220V 50/60Hz ■ Dimensions/Weight: W830×D855×H1730mm / Approximately 450kg *For more details, please refer to the PDF document or feel free to contact us.

  • image_06.png
  • image_07.png
  • image_08.png
  • image_09.png
  • Other physicochemical equipment

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
[Introduction] Sample Lab Center

[Introduction] Sample Lab Center

We will make proposals centered around polishing machines, polishing devices, and sample polishing machines, utilizing the know-how of all precision polishing technologies.

【Overview】 - Dedicated polishing staff available - Providing satisfactory polished surfaces based on accumulated polishing experience data - Proposing jigs as design and production are conducted in-house - Offering detailed polishing reports to clarify the polishing process 【Demo Process】 1. Preliminary meeting 2. Sample collection 3. Setting conditions 4. Demo (on-site or online)

  • 図4.png
  • 図5.png
  • Wafer processing/polishing equipment

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Special shapes such as porous types and irregular types are also possible! Information on custom holder production.

Special shapes such as porous types and irregular types are also possible! Information on custom holder production.

Production of holders that meet your requests! We can create holders that respond to customer needs based on in-house design, and we are also capable of producing special shapes such as porous types and irregular types.

At IMT Corporation, we accept custom holder production. Based on our extensive data from past polishing achievements, we not only create but also deliver precise and reliable polishing. If you are a customer who wants to polish large samples, or if you want to polish many small samples, or if you have reasons that prevent embedding, please consult with us. 【Examples of polishers we can produce】 ■ Semiconductor wafer polishing machine ■ Surface polishing equipment for LCD panels ■ Shaft polishing equipment ■ Robot polishing machine *For more details, please refer to the related links or feel free to contact us.

  • screenshot.6681.png
  • screenshot.6682.png
  • screenshot.6683.png
  • screenshot.6684.png
  • Wafer processing/polishing equipment

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Reasons for choosing IMT

Reasons for choosing IMT

Meticulous work unique to Japanese manufacturers! Detailed follow-up visits by sales representatives even after installation.

Here are the reasons why our company is chosen. We primarily use domestic parts, which makes maintenance easy due to Japanese standards. It is also possible to dispatch dedicated technical staff on-site. Our meticulous work, characteristic of Japanese manufacturers, is complemented by prompt responses from sales staff who understand the technology. We thoroughly resolve customer dissatisfaction through close communication between sales and technical teams. 【Features】 ■ Detailed follow-up visits by sales representatives even after installation ■ Design and manufacturing at our headquarters in Wakayama Prefecture ■ Use of carefully selected domestic parts ■ Possibility of dispatching dedicated technical staff on-site ■ Prompt responses from sales staff knowledgeable in technology *For more details, please refer to the PDF materials or feel free to contact us.

  • 2023-01-17_09h28_32.png
  • Wafer processing/polishing equipment

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Chemical substance management regulations and countermeasures based on the Labor Safety and Health Act for SIC grinding paper.

Chemical substance management regulations and countermeasures based on the Labor Safety and Health Act for SIC grinding paper.

Guidance on wearing protective gear is necessary. We are accepting consultations for initiatives.

According to a notification from the Ministry of Health, Labour and Welfare, it is mandated that individuals engaged in work involving carcinogenic substances must retain work records and other documentation for a period of 30 years, effective from April 1, 2023. Workers engaged in the manufacture or handling of substances that are clearly hazardous to health must be instructed to wear the following protective equipment: (1) Dust mask (2) Safety goggles (3) Protective gloves Please adhere to the laws and regulations of your local municipality regarding wastewater. Disposal will be classified as industrial waste. ■ Measures to reduce exposure levels must be minimized. As part of future initiatives with IMT, we will consider the following: (1) Examination of alternative products (2) Proposals for overall ventilation systems and local exhaust systems (3) Improvement of work methods We welcome inquiries regarding initiatives like those mentioned above, so please feel free to consult with us. *For more details, please do not hesitate to contact us.*

  • others

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
[Must-see for the meat industry!] Multi-type knife sharpening robot "Togi Robo Ver.2"

[Must-see for the meat industry!] Multi-type knife sharpening robot "Togi Robo Ver.2"

No need for knife sharpening craftsmen anymore? Knives used in meat processing and butchering can be automatically sharpened by a robot with simple operation!

Knives used for disassembly work in meat processing need to be sharpened every day after work, but the number of knife sharpeners has decreased, and many companies are struggling to maintain the usual sharpening standards. The "Togi Robo" can solve the problems associated with knife sharpening. This device allows you to set up to 40 knives on a turntable and simply turn on the switch, and the robot will automatically perform rough and finishing sharpening. 【Product Features】 ■ Easy operation ■ Fast sharpening ■ Uniform finish ■ Long-lasting sharpness ■ Compatible with various types of knives *For more details, please contact us or check the PDF download.

  • togirobo1.jpg
  • togirobo2.jpg
  • Other food machinery

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Tohoku Univ. Technology : Method for producing spherical zinc oxide : T19-905

Tohoku Univ. Technology : Method for producing spherical zinc oxide : T19-905

Method for producing Monodispersed spherical zinc oxide having uniform particle diameter

　Zinc oxide is used as an ultraviolet shielding agent in cosmetics such as sunscreens. However, in the conventional manufacturing technology, it was difficult to control the particle size of zinc oxide, and it was considered that the texture was bad. Furthermore, there is concern about the effects on the environment and the human body due to toxic exhaust gas caused by treatment at high temperature and the use of inert gas in the manufacturing process. The present invention relates to a method for producing spherical zinc oxide with uniform particle size and monodisperse, and spherical zinc oxide with a simple, low cost and low environmental impact. The spherical zinc oxide is expected to be used as a cosmetic with high ultraviolet shielding effect, excellent soft focusing property and excellent usability.

  • others

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Grinding device "Low-Speed Sander 76"

Grinding device "Low-Speed Sander 76"

Recommended polishing equipment by polishing professionals!

The "Low-Speed Sander 76" enables a wide range of processing when combined with our kits, such as "Polishing + Hairline" and "Deburring." It can be used both horizontally and vertically, making it suitable for various polishing tasks, and we offer a rich lineup including "Polishing PRO Set 1" and "Polishing PRO Set 2," which addresses various burrs. 【Kit Lineup】 ■ Polishing PRO Set 1: Polishing + Hairline ■ Polishing PRO Set 2: Deburring ■ Polishing PRO Set 3: Mirror Finish ■ Polishing PRO Set 4: Gloss Finish Specialist *For more details, please download the PDF or feel free to contact us.

  • Other abrasives
  • Other surface treatment equipment

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Grinding device "Makenki"

Grinding device "Makenki"

A compact polishing device suitable for deburring and chamfering of machined parts!

The "Grinding Machine" is a polishing device that allows for angle adjustments of the disc surface by raising the stand. It is mainly suitable for applications such as deburring, chamfering, light grinding, and general polishing finishes of processed parts. We recommend the "Saving Series" discs, which allow for one-touch attachment and detachment for easy disc replacement. 【Specifications】 ■ Power Consumption: 150W (AC100V) ■ Spindle Speed - 3,275 min(-1) (50Hz) - 3,930 min(-1) (60Hz) ■ Main Unit Weight: 9.2 Kg *For more details, please download the PDF or feel free to contact us.

  • Other abrasives
  • Other surface treatment equipment

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Nano Diamond

Nano Diamond

Nanodiamond - Explosion Method (Cluster)

Nanodiamonds are nanoscale diamonds that have a diamond crystal structure. They retain almost all the properties of diamonds. Due to their nanoscale size, they have the potential to exhibit these properties even more effectively. We offer three types of nanodiamonds depending on the manufacturing method.

  • Other metal materials

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Introduction to Processing Technology: Double-Sided Polishing and Lapping Processing

Introduction to Processing Technology: Double-Sided Polishing and Lapping Processing

We are performing high-precision polishing of micron plates using a double-sided polishing machine!

We perform high-precision polishing of micron plates using a double-sided polishing machine. We also handle mass production polishing and lapping of difficult-to-cut materials such as iron and Kovar, as well as non-magnetic materials like copper, aluminum, SUS, titanium, and resin. Please contact us for more details.

  • Processing Contract

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Surface grinding processing using a horizontal axis rotary grinding machine

Surface grinding processing using a horizontal axis rotary grinding machine

Active in the automotive and semiconductor industries! Surface grinding processing using a horizontal axis rotary grinding machine.

The 'Surface Grinding Process Using a Horizontal Axis Rotary Grinding Machine' involves grinding the reference surfaces, specifically the end faces and both end surfaces, as the first step when high-precision machining of flanged round objects is required. The reference end face, when processed using a magnetic chuck, is a crucial point to ensure that no deformation occurs during cylindrical grinding and internal grinding due to clamping with chucks and other fixtures. Additionally, the NC horizontal axis rotary grinding machine is suitable for high-precision machining of round objects and can also perform grinding with a taper of a few microns to facilitate easy assembly of the items. Recently, it has shown particular effectiveness in machining titanium materials, contributing to reduced processing time and improved precision for this difficult-to-cut material. [Features] - Materials: S45C, SUS304, A7075, SKD11, Titanium 64, etc. - Industries: Automotive parts prototyping, machine tool parts, semiconductor manufacturing equipment parts, etc. - Processing Machine: NC horizontal axis rotary grinding machine - Processing Accuracy: Flatness and parallelism of 0.001 to 0.005 - Work Size: Φ500×200L *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Other machine elements
  • Wafer processing/polishing equipment

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Syringe grinding device

Syringe grinding device

Are you having trouble with thin needles or finishing precision?

Our needle polishing machine may be able to meet your needs. We will customize the basic unit to your specifications. The standard machine accommodates needle sizes from 33G to 14G. Please feel free to consult us regarding other specifications or special needles.

  • Other processing machines

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
grinder

grinder

A device that can sharpen any needle! Developed and manufactured with the aim of creating a product that anyone can handle with the ease of an automatic machine.

We would like to introduce our "Grinding Machine" that we manufacture. To accommodate the grinding of a wide variety of injection needles, it can handle single-point (single-edged needles) and double-point (double-edged needles) options, and it is capable of grinding any blade shape with a bevel angle ranging from 9 to 40 degrees. Additionally, we offer a lineup of equipment configurations that allow for side hole processing to be performed inline, including punch processing and EMG processing. 【Specifications (Partial)】 ■ General: Fully automatic control of grinding conditions ■ Grinding Chuck: 480mm long ■ Compatible Gauge: 13G (φ2.2) to 32G (φ0.23) ■ Needle Length: 12.5mm to 120.0mm (80-120mm is optional) ■ Grinding Angle: 9-40 degrees *For more details, please refer to the related links or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines
  • Mechanical Design

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

Polishing machineに関連する検索キーワード

COPYRIGHT © 2001-2026 IPROS CORPORATION ALL RIGHTS RESERVED.